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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS2026

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherents

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

bondline thickness↗
NASA NTRS1979

The influence of microstructure on the strength of reaction bonded silicon nitride /RBSN/

The effect of the microstructure of reaction bonded silicon nitride on strength is examined. The morphologies of the various microconstituents (alpha-matte, beta-spikes, residual silicon and porosity) each play a role in determining the strength of the material. While density and hence percent porosity greatly affect strength, it is shown that the pore size and pore size distribution affect strength with equal importance. By minimizing the pore size and distribution and maximizing the alpha-beta ratio, a reaction bonded material (2.4 kg/cu m) has been produced with a room temperature modulus of rupture (three-point bending) of 297 MPa from a low green density starting material (1.5 kg/cu m).

Danforth, S. C.↗
NASA NTRS1993

Effect of mission cycling on the fatigue performance of SiC-coated carbon-carbon composites

The effects of thermal and pressure cycling on the fatigue performance of carbon-carbon composites, and the influence of mission cycling on these effects, were investigated by subjecting both virgin and mission-cycled two-dimensional specimens of SiC-coated carbon-carbon composites to fatigue tests, conducted at room temperature in three-point bending, with a stress ratio of 0.2 and a frequency of 1 Hz. It was found that the fatigue strength of C-C composites is high (about 90 percent of the ultimate flexural strength), but decreased with the mission cycling. The lowering of the fatigue strength with mission cycling is attributed to the increase in interfacial bond strength due to thermal and pressure cycling of the material. The already high sensitivity of C-C composites to stress during cyclic loading increases further with the amount of mission cycling. Results of NDE suggest that the damage growth in virgin C-C, in the high-cycle range, is slow at the initial stage of the cyclic life, but propagates rapidly after certain threshold cycles of the fatigue life.

Mahfuz, H.↗
NASA NTRS1991

Studies of fiber-matrix adhesion on compression strength

A study was initiated on the effect of the matrix polymer and the fiber matrix bond strength of carbon fiber polymer matrix composites. The work includes tests with micro-composites, single ply composites, laminates, and multi-axial loaded cylinders. The results obtained thus far indicate that weak fiber-matrix adhesion dramatically reduces 0 degree compression strength. Evidence is also presented that the flaws in the carbon fiber that govern compression strength differ from those that determine fiber tensile strength. Examination of post-failure damage in the single ply tests indicates kink banding at the crack tip.

Bascom, Willard D.↗
DOE OSTI2023

Linear versus Bent Uranium(II) Metallocenes—A Local Vibrational Mode Study

Uranium metallocenes have recently attracted attention driven by their use as catalysts in organometallic synthesis. In addition to bent U(IV) and U(III), an U(II) metallocene [(η 5 -C 5 i Pr 5 ) 2 U] was synthesized with an unusual linear Cp–U–Cp angle. Here, in this work, we investigated 22 U(II) metallocenes, (i) assessing the intrinsic strength of the U-ring interactions in these complexes with a novel bond strength measure based on our local vibrational mode analysis and (ii) systematically exploring what makes these U(II) metallocenes bent. We included relativistic effects through the NESCau Hamiltonian and complemented the local mode analysis with natural bonding orbital (NBO) and quantum theory of atoms in molecules (QTAIM) data. Our study led to the following results: (i) reduction of bulky U-ring ligand substituents does not lead to bent complexes for alkyl substituents ( i Pr and i Bu) in contrast to SiMe 3 ring substituents, which are all bent. (ii) The most bent complexes are [(η 5 -C 5 H 4 SiMe 3 ) 2 U] (130°) and [η 5 -P 5 H 5 ) 2 U] (143°). (iii) Linear complexes showed one hybridized NBO with s/d character, while bent structures were characterized by s/d/f mixing. (iv) We did not observe a correlation between the strength of the U-ring interaction and the amount of the ring-U-ring bend; the strongest interaction was found for [η 5 -Cp) 2 U] and the weakest for [η 5 -P 5 H 5 ) 2 U]. In conclusion, our results provide a foundation for the design of U(II) metallocenes with specific physicochemical properties and increased reactivity.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS1989

NDE of adhesive bonds and bondlines; Proceedings of the 1989 ASNT Fall Conference, Valley Forge, PA, Oct. 9-13, 1989

The conference presents papers on the Solid Propulsion Integrity Program, the NDE methodology of adhesive bond strength determination, and an interface layer model for ultrasonic inspection of adhesive bonds. Also considered are pulse/echo ultrasonic methods for inspecting bondlines, ultrasonic detection of kissing bonds in adhesive joints, and the NDE needs and requirements for SRM bondline inspection. Thermographic stress analysis of bonded joints is discussed as well as the filmless and real-time applications of holography.

Source record↗
NASA NTRS1979

Metal-dielectric interactions

Metal direlectric surface interactions and dielectric films on metal substrates were investigated. Since interfacial interaction depends so heavily on the nature of the surfaces, analytical surface tools such as Auger emission spectroscopy, X-ray photoelectron spectroscopy and field ion microscopy were used to assist in surface and interfacial characterization. The results indicate that with metals contacting certain glasses in the clean state interfacial, bonding produces fractures in the glasses while when a film such as water is present, fractures occur in the metal near the interface. Friction forces were used to measure the interfacial bond strengths. Studies with metals contacting polymers using field ion microscopy revealed that strong bonding forces could develop being between a metal and polymer surface with polymer transferring to the metal surface in various ways depending upon the forces applied to the surface in contact. With the deposition of refractory carbides, silicides and borides onto metal and alloy substrates the presence of oxides at the interface or active gases in the deposition plasma were shown to alter interfacial properties and chemistry. Auger ion depth profile analysis indicated the chemical composition at the interface and this could be related to the mechanical, friction, and wear behavior of the coating.

Buckley, D. H.↗
NASA NTRS1992

Fatigue characterization of advanced carbon-carbon composites

Response of quasi-isotropic laminates of SiC coated Carbon-Carbon (C/C) composites under flexural fatigue are investigated at room temperature. Virgin as well as mission cycled specimens are tested to study the effects of thermal and pressure cycling on the fatigue performance of C/C. Tests were conducted in three point bending with a stress ratio of 0.2 and frequency of 1 Hz. Fatigue strength of C/C has been found to be considerably high - approximately above 85 percent of the ultimate flexural strength. The fatigue strength appears to be decreasing with the increase in the number of mission cycling of the specimens. This lower strength with the mission cycled specimens is attributed to the loss of interfacial bond strength due to thermal and pressure cycling of the material. C/C is also found to be highly sensitive to the applied stress level during cyclic loading, and this sensitivity is observed to increase with the mission cycling. Weibull characterization on the fatigue data has been performed, and the wide scatter in the Weibull distribution is discussed. Fractured as well as untested specimens were C-scanned, and the progressive damage growth during fatigue is presented.

Mahfuz, Hassan↗
NASA NTRS1973

Adhesive-bonded double-lap joints

Explicit analytical solutions are derived for the static load carrying capacity of double-lap adhesive-bonded joints. The analyses extend the elastic solution Volkersen and cover adhesive plasticity, adherend stiffness imbalance and thermal mismatch between the adherends. Both elastic-plastic and bi-elastic adhesive representations lead to the explicit result that the influence of the adhesive on the maximum potential bond strength is defined uniquely by the strain energy in shear per unit area of bond. Failures induced by peel stresses at the ends of the joint are examined. This failure mode is particularly important for composite adherends. The explicit solutions are sufficiently simple to be used for design purposes

Hart-Smith, L. J.↗
NASA NTRS1992

Transverse flexural tests as a tool for assessing damage to PMR-15 composites from isothermal aging in air at elevated temperatures

To date, the effect of thermo-oxidative aging on unidirectional composite mechanical properties has been monitored by the measurement of interlaminar shear strength (ILSS) and either three or four point longitudinal flexural strength (LFS) of the composites being tested. Both results are affected by the fiber-to-matrix bonding, the former being dependent on the shear resistance of the interface and the latter on the degree of load sharing by the fibers through the fiber/matrix interface. Recently, fiber/matrix interfacial bond strengths have been monitored using a transverse flexural strength (TFS) test method. This test method was used to evaluate the effect of fiber surface treatment on the fiber/matrix bond. The interface bonding was varied in these tests using Hercules A-fibers with three-types of surfaces that produce bonds of poor, better, and good quality. The TFS was found not only to be sensitive to the bonding, but also to the aging time of unidirectional A-fiber/PMR-15 composites. This relationship reflects the mechanism by which the PMR-15 degrades during thermal aging.

Bowles, Kenneth J.↗
DOE OSTI2023

Comprehensively Strengthened Metal‐Oxygen Bonds for Reversible Anionic Redox Reaction

Introducing anionic redox in layered oxides is an effective approach to breaking the capacity limit of conventional cationic redox. However, the anionic redox reaction generally suffers from excessive oxidation of lattice oxygen to O 2 and O 2 release, resulting in local structural deterioration and rapid capacity/voltage decay. Here, a Na 0.71 Li 0.22 Al 0.05 Mn 0.73 O 2 (NLAM) cathode material is developed by introducing Al 3+ into the transition metal (TM) sites. Thanks to the strong Al–O bonding strength and small Al 3+ radius, the TMO 2 skeleton and the holistic TM–O bonds in NLAM are comprehensively strengthened, which inhibits the excessive lattice oxygen oxidation. The obtained NLAM exhibits a high reversible capacity of 194.4 mAh g —1 at 20 mA g —1 and decent cyclability with 98.6% capacity retention over 200 cycles at 200 mA g —1 . In situ characterizations reveal that the NLAM experiences phase transitions with an intermediate OP4 phase during the charge–discharge. Theoretical calculations further confirm that the Al substitution strategy is beneficial for improving the overlap between Mn 3d and O 2p orbitals. Importantly, this finding sheds light on the design of layered oxide cathodes with highly reversible anionic redox for sodium storage.

25 ENERGY STORAGE↗
DOE OSTI2022

Understanding the fundamental driver of semiconductor radiation tolerance with experiment and theory

Space is the operating environment of a multitude of systems that our society is heavily reliant on today, however, maintaining operability there necessitates special consideration of the electronic systems' tolerance of space radiation. Electronic systems are critically dependent on the electronic properties of their semiconductor components, which are modified by space radiation with an adverse impact on the space system performance. What innate property allows some semiconductors to sustain little damage while others accumulate defects rapidly with dose is poorly understood, which limits the extent to which radiation tolerance can be implemented as a design criterion. Here, to gain insight into what properties are drivers of semiconductor radiation tolerance, the first step is to generate a dataset of the relative radiation tolerance of a broad sampling of semiconductors. To accomplish this, Rutherford backscatter channeling experiments are used to compare the displaced lattice atom buildup in InAs, InP, GaP, GaN, ZnO, MgO, and Si as a function of stepwise alpha particle dose. With this experimental information on radiation-induced incorporation of interstitial defects in hand, hybrid density functional theory electron densities (and their derived quantities) are calculated and their gradient and Laplacian are evaluated to obtain key fundamental information about the interactions in each material. It is shown that simple, undifferentiated values (which are typically used to describe bond strength) are insufficient to predict radiation tolerance. Instead, the curvature of the electron density at bond critical points provides a measure of radiation tolerance consistent with the experimental results obtained. This curvature and associated forces surrounding bond critical points have the potential to disfavor the localization of displaced lattice atoms at these points, favoring their diffusion toward perfect lattice positions. With this criterion to predict radiation tolerance, simple density functional theory simulations can be conducted on potential new materials to gain insight into how they may operate in demanding high radiation environments.

36 MATERIALS SCIENCE↗
NASA NTRS1990

Fiber pushout test: A three-dimensional finite element computational simulation

A fiber pushthrough process was computationally simulated using three-dimensional finite element method. The interface material is replaced by an anisotropic material with greatly reduced shear modulus in order to simulate the fiber pushthrough process using a linear analysis. Such a procedure is easily implemented and is computationally very effective. It can be used to predict fiber pushthrough load for a composite system at any temperature. The average interface shear strength obtained from pushthrough load can easily be separated into its two components: one that comes from frictional stresses and the other that comes from chemical adhesion between fiber and the matrix and mechanical interlocking that develops due to shrinkage of the composite because of phase change during the processing. Step-by-step procedures are described to perform the computational simulation, to establish bounds on interfacial bond strength and to interpret interfacial bond quality.

Mital, Subodh K.↗
NASA NTRS1991

Fiber pushout test - A three-dimensional finite element computational simulation

A fiber pushthrough process was computationally simulated using three-dimensional finite element method. The interface material is replaced by an anisotropic material with greatly reduced shear modulus in order to simulate the fiber pushthrough process using a linear analysis. Such a procedure is easily implemented and is computational very effective. It can be used to predict fiber pushthrough load for a composite system at any temperature. The average interface shear strength obtained from pushthrough load can easily be separated into its two components: one that comes from frictioal stresses and the other that comes from chemical adhesion between fiber and the matrix and mechanical interlocking that develops due to shrinkage of the composite because of phase change during the processing. Step-by-step procedures are described to perform the computational simulation, to establish bounds on interfacial bond strength and to interpret interfacial bond quality.

Mital, Subodh K.↗
DOE OSTI2025

Adhesively Bonded Copper and Polyimide for Flexible Printed Circuit Boards: A Data-Driven Degradation Study Under Accelerated Aging

The long-term durability of polyimide laminated adhesive based flexible printed circuit boards (PCBs) is critical to the microelectronics industry. The interface of the adhesive layer binding the polyimide and copper layers is particularly vulnerable since decreased bonding strength can lead to deadhesion, performance loss, and premature device failure. Here, in this study, adhesive-bonded polyimide and copper samples are subjected to 1000 h of damp heat exposure (85 °C/85%RH) to evaluate the impact of moisture and copper inclusion on the adhesive bonding performance. Significant copper diffusion through the adhesive layer is observed, which, combined with moisture uptake, is found to substantially weaken interfacial adhesion in copper-containing samples, thereby reducing device lifetime. Observed surface and bulk material changes are correlated to adhesion strength using the network structural equation modeling (netSEM) approach, resulting in a robust predictive model of performance degradation based on measurable materials properties.

Chemistry↗
NASA NTRS1989

RSRM nozzle fixed housing cooldown test

Flight 5 aft segments with nozzles were exposed to -17 F temperatures while awaiting shipment to KSC in February, 1989. No records were found which show that any previous nozzles were exposed to air temperatures as low as those seen by the Flight 5 nozzles. Thermal analysis shows that the temperature of the fixed housing, and forward and aft exit cone components dropped as low as -10 F. Structural analysis of the nozzles at these low temperatures show the forward and aft exit cone adhesive bonds to have a positive margin of safety, based on a 2.0 safety factor. These analyses show the normal and shear stresses in the fixed housing bond as low values. However, the hoop and meridinal stresses were predicted to be in the 4000 psi range; the failure stress allowable of EA913NA adhesive at -7 F. If the bonds did break in directions perpendicular to the surfaces, called bond crazing, no normal bond strength would be lost. Testing was conducted in two phases, showing that no degradation to the adhesive bonds occurred while the Flight 5 nozzles were subjected to subzero temperatures. The results of these tests are documented. Phase 1 testing cooled a full-scale RSRM insulated fixed housing to -13 F, with extensive bondline inspections. Phase 2 testing cooled the witness panel adhesive tensile buttions to -13 F, with failure strengths recorded before, during, and after the cooldown.

Bolieau, D. J.↗
NASA NTRS1974

Method of making an explosively welded scarf joint

A method is presented for obtaining a bond joint between thin metal members without the addition of a bonding agent. The method yields bond strengths comparable to the parent metal. The method comprises overlapping the materials at the edges and bonding them by explosive welding while also making use of the explosive force to shape the materials into an essentially planar configuration.

Bement, L. J.↗
NASA NTRS1995

Tensile Behavior of Al2o3/feal + B and Al2o3/fecraly Composites

The feasibility of Al2O3/FeAl + B and Al2O3/FeCrAlY composites for high-temperature applications was assessed. The major emphasis was on tensile behavior of both the monolithics and composites from 298 to 1100 K. However, the study also included determining the chemical compatibility of the composites, measuring the interfacial shear strengths, and investigating the effect of processing on the strength of the single-crystal Al2O3 fibers. The interfacial shear strengths were low for Al203/FeAl + B and moderate to high for Al203/FeCrAlY. The difference in interfacial bond strengths between the two systems affected the tensile behavior of the composites. The strength of the Al203 fiber was significantly degraded after composite processing for both composite systems and resulted in poor composite tensile properties. The ultimate tensile strength (UTS) values of the composites could generally be predicted with either rule of mixtures (ROM) calculations or existing models when using the strength of the etched-out fiber. The Al2O3/FeAl + B composite system was determined to be unfeasible due to poor interfacial shear strengths and a large mismatch in coefficient of thermal expansion (CTE). Development of the Al2O3/FeCrAlY system would require an effective diffusion barrier to minimize the fiber strength degradation during processing and elevated temperature service.

Draper, S. L.↗