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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9

Long life assurance study for manned spacecraft long life hardware. Volume 4: Special long life assurance studies

Guidelines for the selection of equipment to be used for manned spacecraft in order to assure a five year maintenance-free service life were developed. A special study was conducted to determine the adequacy of the procedures used to determine the quality and effectiveness of various components. The subjects examined are: (1) temperature cycling for acceptance of electronic assemblies; (2) accelerated testing techniques; (3) electronic part screening techniques; (4) electronic part derating practices; (5) vibration life extension of printed circuit board assemblies; and (6) tolerance funnelling and test requirements.

Source record↗

Connecting Mission Profiles and Radiation Vulnerability Assessment

Radiation vulnerability assessment early in spacecraft development is cheaper and faster than in late development phases. RGENTIC and SEAM are two software platforms that can be coupled to provide this type of early assessment. Specifically, RGENTIC is a tool that outputs descriptions of radiation risks based on a selected mission environment and the system’s electronic part portfolio, while SEAM models how radiation-induced faults in electronic parts propagate through a system. In this work, we propose a spacecraft evaluation flow where RGENTIC’s outputs, which are radiation vulnerabilities of electronic parts for a given mission, become inputs to SEAM, resulting in an automatic part-type template palette presented to users so that they can easily begin modeling the occurrence and propagation of radiation-induced faults in their spacecraft. In this context, fault propagation modeling shows how radiation effects impact the spacecraft’s electronics.

Richard H. Nederlande↗

MIL/JEDEC Standards Update

MIL/JEDEC standards play a vital role in electronic parts procurement and usage on all NASA missions. Through the NASA Electronic Parts Assurance Group (NEPAG) Program, NASA is an active participant in work related to the standards as they apply to electronic parts. This paper will provide an update on those activities.

Agarwal, S.↗

Preliminary Radiation Analysis of the Total Ionizing Dose for the Resource Prospector Mission

NASA's Resource Prospector (RP) is a collaborative project between multiple centers and institutions to search for volatiles at the polar regions of the Moon as a potential resource for oxygen and propellant production. The mission is rated Class D and will be the first In-Situ Resource Utilization (ISRU) demonstration on the lunar surface and at the lunar poles. Given that this mission is rated Class D, the project is considering using commercial off the shelf (COTS) electronics parts to reduce cost. However, COTS parts can be more susceptible to space radiation than typical aerospace electronic parts and carry some additional risk. Thus, prior to parts selection, having a better understanding of the radiation environment can assist designers in the parts selection process. The focus of this paper is to provide a preliminary analysis of the radiation environment from launch, through landing on the surface, and some surface stay as an initial step in determining worst case mission doses to assist designers in screening out electronic parts that would not meet the potential dose levels experienced on this mission.

Rojdev, Kristina↗

JPL preferred parts list: Reliable electronic components

The JPL Preferred Parts List was prepared to provide a basis for selection of electronic parts for JPL spacecraft programs. Supporting tests for the listed parts were designed to comply with specific spacecraft environmental requirements. The list tabulates the electronic, magnetic, and electromechanical parts applicable to all JPL electronic equipment wherein reliability is a major concern. The parts listed are revelant to equipment supplied by subcontractors as well as fabricated at the laboratory.

Covey, R. E.↗

SOI N-Channel Field Effect Transistors, CHT-NMOS80, for Extreme Temperatures

Extreme temperatures, both hot and cold, are anticipated in many of NASA space exploration missions as well as in terrestrial applications. One can seldom find electronics that are capable of operation under both regimes. Even for operation under one (hot or cold) temperature extreme, some thermal controls need to be introduced to provide appropriate ambient temperatures so that spacecraft on-board or field on-site electronic systems work properly. The inclusion of these controls, which comprise of heating elements and radiators along with their associated structures, adds to the complexity in the design of the system, increases cost and weight, and affects overall reliability. Thus, it would be highly desirable and very beneficial to eliminate these thermal measures in order to simplify system's design, improve efficiency, reduce development and launch costs, and improve reliability. These requirements can only be met through the development of electronic parts that are designed for proper and efficient operation under extreme temperature conditions. Silicon-on-insulator (SOI) based devices are finding more use in harsh environments due to the benefits that their inherent design offers in terms of reduced leakage currents, less power consumption, faster switching speeds, good radiation tolerance, and extreme temperature operability. Little is known, however, about their performance at cryogenic temperatures and under wide thermal swings. The objective of this work was to evaluate the performance of a new commercial-off-the-shelf (COTS) SOI parts over an extended temperature range and to determine the effects of thermal cycling on their performance. The results will establish a baseline on the suitability of such devices for use in space exploration missions under extreme temperatures, and will aid mission planners and circuit designers in the proper selection of electronic parts and circuits. The electronic part investigated in this work comprised of a CHT-NMOS80 high temperature N-channel MOSFET (metal-oxide semiconductor field-effect transistor) device that was manufactured by CISSOID. This high voltage, medium-power transistor is fabricated using SOI processes and is designed for extreme wide temperature applications such as geothermal well logging, aerospace and avionics, and automotive industry. It has a high DC current capability and is specified for operation in the temperature range of -55 C to +225 C

Patterson, Richard L.↗

Challenges for Electronics in the Vision for Space Exploration

This presentation has been a brief snapshot discussing electronics and Exploration-related challenges. The vision for Space Exploration creates a new paradigm for NASA missions. This includes transport (Crew Exploration Vehicle-CEV), and lunar and Mars Exploration and human presence. If one considers the additional hazards faced by these concepts versus more traditional NASA missions, multiple challenges surface for reliable utilization of electronic parts. The true challenge is to provide a risk as low as reasonably achievable (ALARA-a traditional biological radiation exposure term), while still providing cost effective solutions. This presentation also discusses the hazard for electronic parts and exploration, the types of electronic parts for exploration, and the critical juncture for space usage of commercial changes in the electronics world.

LaBel, Kenneth A.↗

NASA Presentation to TechAmerica G12 Committee

This slide presentation reviews some of the actions that NASA is taking to address the issue of counterfeit electronic parts. While the emphasis is on electronic parts, the vision is broad enough to include materials and software. The effort includes coordination with other agencies, to identify and with the Government-Industry Data Exchange Program (GIDEP). An interim GIDEP Policy for suspected counterfeits was instituted. NASA's recommendation to the policy was for identification of the supplier and suggests allowing access to that information by government only. The issues with the General MIL specification, the testing requirements for radiation issues, the continuing development of Class Y standards for electronic equipment, status of package case isolation tests needed for 750 and 883,enhancement of 750 Internal Visual Inspection are reviewed. Further issues with consistent ESD control conditions across commodities, test methods, humidity limits, etc are briefly reviewed. The cost benefit analysis of film versus Real time radiography are also reviewed.

LaBel, Kenneth A.↗

Current and Future Parts Management at NASA

This presentation provides a high level view of current and future electronic parts management at NASA. It describes a current perspective of the new human space flight direction that NASA is beginning to take and how that could influence parts management in the future. It provides an overview of current NASA electronic parts policy and how that is implemented at the NASA flight Centers. It also describes some of the technical challenges that lie ahead and suggests approaches for their mitigation. These challenges include: advanced packaging, obsolescence and counterfeits, the global supply chain and Commercial Crew, a new direction by which NASA will utilize commercial launch vehicles to get astronauts to the International Space Station.

Sampson, Michael J.↗

EEE Links

The EEE Links Newsletter is a quarterly publication produced by Code 562 in support of the NASA HQ funded NASA Electronic Parts and Packaging (NEPP) Program. The newsletter is produced as an electronic format deliverable made available via the referenced www site administered by Code 562, The newsletter publishes brief articles on topics of interest to NASA programs and projects in the area of electronic parts and packaging. The newsletter does not provide information pertaining to patented or proprietary information. The information provided is at the level of that produced by industry and university researchers and is published at national and international conferences.

Humphrey, Robert↗

NASA EEE Parts 2014 Year in Review

The NASA Electronic Parts and Packaging Program continue to support Electrical, Electronic and Electromagnetic Parts for the agency with an eventful year of workshops, innovations, testing and challenges.

electronic↗

Evaluation of Advanced COTS Passive Devices for Extreme Temperature Operation

Electronic sensors and circuits are often exposed to extreme temperatures in many of NASA deep space and planetary surface exploration missions. Electronics capable of operation in harsh environments would be beneficial as they simplify overall system design, relax thermal management constraints, and meet operational requirements. For example, cryogenic operation of electronic parts will improve reliability, increase energy density, and extend the operational lifetimes of space-based electronic systems. Similarly, electronic parts that are able to withstand and operate efficiently in high temperature environments will negate the need for thermal control elements and their associated structures, thereby reducing system size and weight, enhancing its reliability, improving its efficiency, and reducing cost. Passive devices play a critical role in the design of almost all electronic circuitry. To address the needs of systems for extreme temperature operation, some of the advanced and most recently introduced commercial-off-the-shelf (COTS) passive devices, which included resistors and capacitors, were examined for operation under a wide temperature regime. The types of resistors investigated included high temperature precision film, general purpose metal oxide, and wirewound.

Patterson, Richard↗

Radiation design criteria handbook

Radiation design criteria for electronic parts applications in space environments are provided. The data were compiled from the Mariner/Jupiter Saturn 1977 electronic parts radiation test program. Radiation sensitive device types were exposed to radiation environments compatible with the MJS'77 requirements under suitable bias conditions. A total of 189 integrated circuits, transistors, and other semiconductor device types were tested.

Stanley, A. G.↗

Lead-Free Electronics: Impact for Space Electronics

Pb is used as a constituent in solder alloys used to connect and attach electronic parts to printed wiring boards (PWBs). Similar Pbbearing alloys are electroplated or hot dipped onto the terminations of electronic parts to protect the terminations and make them solderable. Changing to Pb-free solders and termination finishes has introduced significant technical challenges into the supply chain. Tin/lead (Sn/Pb) alloys have been the solders of choice for electronics for more than 50 years. Pb-free solder alloys are available but there is not a plug-in replacement for 60/40 or 63/37 (Sn/Pb) alloys, which have been the industry workhorses.

Sampson, Michael J.↗