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NASA NTRS2009

Lunar Sample Compendium

The Lunar Sample Compendium is a succinct summary of what has been learned from the study of Apollo and Luna samples of the Moon. Basic information is compiled, sample-by-sample, in the form of an advanced catalog in order to provide a basic description of each sample. Information presented is carefully attributed to the original source publication, thus the Compendium also serves as a ready access to the now vast scientific literature pertaining to lunar smples. The Lunar Sample Compendium is a work in progress (and may always be). Future plans include: adding sections on additional samples, adding new thin section photomicrographs, replacing the faded photographs with newly digitized photos from the original negatives, attempting to correct the age data using modern decay constants, adding references to each section, and adding an internal search engine.

Meyer, C.↗

NASA NTRS2010

Tissuelike 3D Assemblies of Human Broncho-Epithelial Cells

Three-dimensional (3D) tissuelike assemblies (TLAs) of human broncho-epithelial (HBE) cells have been developed for use in in vitro research on infection of humans by respiratory viruses. The 2D monolayer HBE cell cultures heretofore used in such research lack the complex cell structures and interactions characteristic of in vivo tissues and, consequently, do not adequately emulate the infection dynamics of in-vivo microbial adhesion and invasion. In contrast, the 3D HBE TLAs are characterized by more-realistic reproductions of the geometrical and functional complexity, differentiation of cells, cell-to-cell interactions, and cell-to-matrix interactions characteristic of human respiratory epithelia. Hence, the 3D HBE TLAs are expected to make it possible to perform at least some of the research in vitro under more-realistic conditions, without need to infect human subjects. The TLAs are grown on collagen-coated cyclodextran microbeads under controlled conditions in a nutrient liquid in the simulated microgravitational environment of a bioreactor of the rotating- wall-vessel type. Primary human mesenchymal bronchial-tracheal cells are used as a foundation matrix, while adult human bronchial epithelial immortalized cells are used as the overlying component. The beads become coated with cells, and cells on adjacent beads coalesce into 3D masses. The resulting TLAs have been found to share significant characteristics with in vivo human respiratory epithelia including polarization, tight junctions, desmosomes, and microvilli. The differentiation of the cells in these TLAs into tissues functionally similar to in vivo tissues is confirmed by the presence of compounds, including villin, keratins, and specific lung epithelium marker compounds, and by the production of tissue mucin. In a series of initial infection tests, TLA cultures were inoculated with human respiratory syncytial viruses and parainfluenza type 3 viruses. Infection was confirmed by photomicrographs that showed signs of damage by viruses and virus titers (see figure) that indicated large increases in the populations of viruses during the days following inoculation.

Goodwin, Thomas J.↗

NASA NTRS2010

High Temperature VARTM of Phenylethynyl Terminated Imides (PETI) Resins

Fabrication of composite structures using vacuum assisted resin transfer molding (VARTM) is generally more affordable than conventional autoclave techniques. Recent efforts have focused on adapting VARTM for the fabrication of high temperature composites. Due to their low melt viscosity and long melt stability, certain phenylethynyl terminated imides (PETI) can be processed into composites using high temperature VARTM (HT-VARTM). However, one of the disadvantages of the current HT-VARTM resin systems has been the high porosity of the resultant composites. For aerospace applications a void fraction of less than 2% is desired. In the current study, two PETI resins, LARCTM PETI-330 and LARCTM PETI-8 have been used to fabricate test specimens using HT-VARTM. The resins were infused into carbon fiber preforms at 260 C and cured between 316 C and 371 C. Modifications to the thermal cycle used in the laminate fabrication have reduced the void content significantly (typically < 3%) for carbon fiber biaxially woven fabric. Photomicrographs of the panels were taken and void contents were determined by acid digestion. For carbon fiber uniaxial fabric, void contents of less than 2% have been obtained using both PETI-8 and PETI-330. Mechanical properties of the panels were determined at both room and elevated temperatures. These include short beam shear and flexure tests. The results of this work are presented herein.

Ghose, Sayata↗

NASA NTRS2010

Phenylethynyl Terminated Imide (PETI) Composites Made by High Temperature VARTM

Fabrication of composite structures using vacuum assisted resin transfer molding (VARTM) is generally more affordable than conventional autoclave techniques. Recent efforts have focused on adapting VARTM for the fabrication of high temperature composites. Due to their low melt viscosity and long melt stability, certain phenylethynyl terminated imides (PETI) can be processed into composites using high temperature VARTM (HT-VARTM). However, one of the disadvantages of the current HT-VARTM resin systems has been the high porosity of the resultant composites. For aerospace applications, a void fraction of <2% is desired. In the current study, two PETI resins, LARC. PETI-330 and LARC. PETI-8 have been used to fabricate test specimens using HT-VARTM. The resins were infused into carbon fiber preforms at 260 C and cured between 316 and 371 C. Photomicrographs of the panels were taken and void contents were determined by acid digestion. Modifications to the thermal cycle used in the laminate fabrication have reduced the void content significantly; typically .3% for carbon fiber biaxially woven fabric and less than 2% for carbon fiber uniaxial fabric. Mechanical properties (short beam shear and flexure) of the panels were determined at both room and elevated temperatures. The results of this work are presented herein. This paper is declared a work of the U.S. Government and is not subject to copyright protection in the United States.

Chose, Sayata↗

NASA NTRS2010

Evaluation of Sandwich Structure Bonding In Out-of-Autoclave Processing

The out-of-autoclave-vacuum-bag-only (OOA-VBO) process is low in capital expenditures compared to the traditional autoclave, however, the material challenges for OOA-VBO workable material systems are high. Presently there are few such aerospace grade prepreg materials available commercially. In this study, we evaluated processing and properties of honeycomb sandwich structure (HC/SS) panels fabricated by co-curing composite face sheet with adhesives by the OOA-VBO process in an oven. The prepreg materials were IM7/MTM 45-1 and T40-800B/5320. Adhesives studied were AF-555M, XMTA-241/PM15, FM-309-1M and FM-300K. Aluminum H/C cores with and without perforations were included. It was found that adhesives in IM7/MTM 45-1/AF-555M, T40-800B/5320/FM 309-1M and T40-800B/5320/FM-300K panels all foamed but yielded high flatwise tensile (FWT) strength values above 8,275 kPA (1,200 psi). IM7/MTM 45-1/XMTA-241/PM15 did not foam, yet yielded a low FWT strength. SEM photomicrographs revealed that the origin of this low strength was poor adhesion in the interfaces between the adhesive and face sheet composite due to poor wetting associated with the high initial viscosity of the XMTA-241/PM15 adhesive.

Hou, Tan-Hung↗

NASA NTRS2010

Phenylethynyl Terminated Imide (PETI) Composites Made by High Temperature Vartm

The use of composites as primary structures on aerospace vehicles has increased dramatically over the past decade. As these advanced structures increase in size and complexity, their production costs have grown significantly. A major contributor to these manufacturing costs is the requirement of elevated pressures, during high temperature processing, to create fully consolidated composite parts. Recently, NASA Langley has licensed a series of low viscosity Phenyl Ethynyl Terminated Imide, PETI, oligomers that possess a wide processing window to allow for Resin Transfer Molding, RTM, processing. These resins, PETI-8 and PETI-330, demonstrate void fractions of approx.1% under elevated pressure consolidation. However, when used with a standardized thermal curing cycle in a High Temperature Vacuum Assisted RTM (HT-VARTM) process, they display undesirable void contents in excess of 7%. It was determined previously that under the thermal cycles used for laminate fabrication, the phenylethynyl endcap underwent degradation leading to volatile evolution. Modifications to the processing cycle used in the laminate fabrication have reduced the void content significantly (typically less than 3%) for carbon fiber biaxially woven fabric. For carbon fiber uniaxial fabric, void contents of less than 2% have been obtained using both PETI-8 and PETI-330. The resins were infused into carbon fiber preforms at 260 C and cured between 316 C and 371 C. Photomicrographs of the panels were taken and void contents were determined by acid digestion. Mechanical properties of the panels were determined at both room and elevated temperatures. These include short beam shear and flexure tests. The results of this work are presented herein.

Ghose, Sayata↗

NASA NTRS2011

Infusion Processing of Phenylethynyl Terminated Imides by High Temperature RTM and VARTM

Fabrication of composite structures using infusion processes such as resin transfer molding (RTM) and vacuum assisted resin transfer molding (VARTM) is generally more affordable than conventional autoclave techniques. Recent efforts have focused on adapting both technologies for the fabrication of high temperature (HT) resistant composites. Due to their low melt viscosity and long melt stability, certain phenylethynyl terminated imides (PETI) can be processed into composites using these high temperature out-of-autoclave processes. In the current study, two PETI resins, LARC(TradeMark) PETI-330 and LARC(TradeMark) PETI-8 have been used to make test specimens using both RTM and VARTM. For aerospace applications, a void fraction of less than 2% is desired. Traditionally, RTM has had the advantage over VARTM for generating composites with low void content. However, the process is limited in terms of size. Work at NASA LaRC has incorporated modifications to the thermal cycle used in laminate fabrication that have reduced the void content significantly (typically 1-3%) using the current HT-VARTM process. For composite fabrication by both RTM and VARTM, the resins were infused into three carbon fiber preforms (T650-35-3k 5HS, IM7-6k 5HS, and IM7-6k Uniweave) at 316 C and 260 C respectively and cured up to 371 C. The details of the RTM processing carried out at the University of Akron are discussed in this work along with a brief description of the HT-VARTM processing carried out at NASA-LaRC. Photomicrographs of the panels were taken and void contents were determined by acid digestion. Mechanical properties (short beam shear, SBS) of the panels fabricated by both infusion processes were determined at room temperature as well as at various elevated temperatures. The results of this work are presented herein.

Ghose, Sayata↗

NASA NTRS2012

Processing and Properties of Vacuum Assisted Resin Transfer Molded Phenylethynyl Terminated Imide Composites

Polyimide composites are very attractive for applications that require a high strength to weight ratio and thermal stability. Recent work at NASA Langley Research Center (LaRC) has concentrated on developing new polyimide resin systems that can be processed without the use of an autoclave for advanced aerospace applications. Due to their low melt viscosities and long melt stability, certain phenylethynyl terminated imides (PETI) can be processed into composites using high temperature vacuum assisted resin transfer molding (HT-VARTM). VARTM has shown the potential to reduce the manufacturing cost of composite structures. In the current study, two PETI resins, LARC(Trademark) PETI-330 and LARC(Trademark) PETI-9, were infused into carbon fiber preforms at 260 C and cured at temperatures up to 371 C. Photomicrographs of polished cross sections were taken and void contents, determined by acid digestion, were below 4.5%. Mechanical properties including short block compression (SBC), compression after impact (CAI), and open hole compression (OHC) were determined at room temperature, 177 C, and 288 C. Both PETI-9 and PETI-330 composites demonstrated very good retention of mechanical properties at elevated temperatures. SBC and OHC properties after aging for 1000 hours at temperatures up to 288 C were also determined.

Cano, Roberto J.↗

NASA NTRS2013

Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗

NASA NTRS2014

Evaluation of RTM370 Polyimide Composites by Resin Film Infusion (RFI)

RTM370 imide oligomer based on 2,3,3',4'-biphenyl dianhydride (a-BPDA), 3,4'-oxydianiline (3,4'-ODA) and terminated with the 4-phenylethynylphthalic (PEPA) endcap has been shown to exhibit a low melt viscosity (10-30 poise) at 280 C with a pot-life of 1-2 h and a high cured glass-transition temperature (Tg) of 370 C. RTM370 resin has been successfully infused into fiberglass-stitched T650-35 carbon-fabric preforms (ranged from 3- to 6-mm thick) by resin film infusion (RFI). The resulting composite panels were inspected by ultrasonic C-scan and by photomicrographs before and after post-curing as a quality control. Mechanical tests such as unnotched compression (UNC), open-hole compression (OHC), and short-beam shear strength (SBS) at ambient and elevated temperatures were performed before and after isothermal aging at 288 C for 1000 h to assess high-temperature performance. Thermal cycling of RTM370 stitched composites was also conducted from -54 C to 288 C for up to 1600 cycles to evaluate the microcrack resistance of RTM370 polyimide composites fabricated by RFI.

Polyimide↗

NASA NTRS2009

Reliability of recolumned area array packages

This report presents qualification guidelines developed for recolumned, high I/O ceramic column grid array (CCGA) packages assembled onto printed wiring/circuit boards (PWBs/PCBs). It includes recolumn and assembly process development for two types of CCGA packages: those with and those without interposer. Thermal cycle test results and photomicrographs showing damage progress for recolumned CCGA assemblies are documented and presented.

Ghaffarian, Reza↗

NASA NTRS2010

Reliability of area array packages with 1500-2500 I/Os

This report first provides a literature survey for designing, manufacturing, and reliability test results for area array packages with 1500 to 2500 inputs/outputs (I/Os). It then presents test matrix on design, yield, and workmanship defects on assembly and environmental testing, including thermal cycle and mechanical drop-test evaluation results for FCBGA1704, FPBGA432, and PBGA676 I/Os packages assembled onto printed circuit/wiring boards (PCBs/PWBs). Finally, it summarizes lessons learned from test results for assembly and environmental testing along with optical, scanning electron microscopy (SEM), and x-ray photomicrographs showing damage progress.

Ghaffarian, Reza↗

NASA NTRS2012

Reliability of CGA/LGA/HDI Package Board/Assembly

This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of −55°C to maximum temperatures of either 100°C or 125°C with slow ramp-up rate (3°C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects’ use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

Ghaffarian, Reza↗

NASA NTRS2012

3D X-ray CT for BGA/CGA Workmanship Defect Detection

Commercial-off-the-shelf (COTS) advanced microelectronic technologies in high-reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. One of the key drawbacks of advanced electronic packages with hidden solder joint interconnections, such as the column grid array (CGA), is that inspection can be challenging—whether visually or using X-rays. In general, inspection for solder joint integrity is poor, except for identifying shorts. The new, advanced X-ray systems, especially the 3D computer tomography version, may be able to provide the three-dimensional features that are extremely difficult to resolve under the 2D systems.This report presents both 2D and 3D X-ray images along with their representative optical photomicrographs for a number of advanced electronics package assemblies including 3D stack and CGA assemblies before and after thermal cycling.

Ghaffarian, Reza↗

NASA NTRS1947