Search NASA⌕ Search

SEARCH · Search NASA

Results for “Printed Sensors”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗
DOE OSTI2024

Sub-millisecond keyhole pore detection in laser powder bed fusion using sound and light sensors and machine learning

Laser powder bed fusion is a mainstream additive manufacturing technology widely used to manufacture complex parts in prominent sectors, including aerospace, biomedical, and automotive industries. However, during the printing process, the presence of an unstable vapor depression can lead to a type of defect called keyhole porosity, which is detrimental to the part quality. In this study, we developed an effective approach to locally detect the generation of keyhole pores during the printing process by leveraging machine learning and a suite of optical and acoustic sensors. Simultaneous synchrotron x-ray imaging allows the direct visualization of pore generation events inside the sample, offering high-fidelity ground truth. A neural network model adopting SqueezeNet architecture using single-sensor data was developed to evaluate the fidelity of each sensor for capturing keyhole pore generation events. Our comparative study shows that the near infrared images gave the highest prediction accuracy, followed by 100 kHz and 20 kHz microphones, and the photodiode sensitive to processing laser wavelength had the lowest accuracy. Using a single sensor, over 90% prediction accuracy can be achieved with a temporal resolution as short as 0.1 ms. A data fusion scheme was also developed with features extracted using SqueezeNet neural network architecture and classification using different machine learning algorithms. Our work demonstrates the correlation between the characteristic optical and acoustic emissions and the keyhole oscillation behavior, and thereby provides strong physics support for the machine learning approach.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Three-Dimensional Printable, Extremely Soft, Stretchable, and Reversible Elastomers from Molecular Architecture-Directed Assembly

3D printing elastomers enables the fabrication of many technologically important structures and devices such as tissue scaffolds, sensors, actuators, and soft robots. However, conventional 3D printable elastomers are intrinsically stiff; moreover, the process of printing often requires external mechanical support and/or post-treatment. In this work, we exploit the self-assembly of a responsive linear-bottlebrush-linear triblock copolymer to create stimuli-reversible, extremely soft, and stretchable elastomers and demonstrate their applicability as inks for in situ direct-write printing 3D structures without the aid of external mechanical support or post-treatment. By developing a procedure for controlled synthesis of such architecturally designed block copolymers, we create elastomers with extensibility up to 600% and Young’s moduli down to ~10 2 Pa, 10 6 times softer than plastics and more than 102 times softer than all existing 3D printable elastomers. Moreover, the elastomers are thermostable and remain to be solid up to 180 °C, yet they are 100% solvent-reprocessable. Their extreme softness, stretchability, thermostability, and solvent-reprocessability bode well for future applications.

36 MATERIALS SCIENCE↗
NASA NTRS1974

Life support subsystem monitoring instrumentation

The recognition of the need for instrumentation in manned spacecraft life-support subsystems has increased significantly over the past several years. Of the required control and monitoring instrumentation, this paper will focus on the monitoring instrumentation as applied to life-support subsystems. The initial approach used independent sensors, independent sensor signal conditioning circuitry, and independent logic circuitry to provide shutdown protection only. This monitoring system was replaced with a coordinated series of printed circuit cards, each of which contains all the electronics to service one sensor and provide performance trend information, fault detection and isolation information, and shutdown protection. Finally, a review of sensor and instrumentation problems is presented, and the requirement for sensors with built-in signal conditioning and provisions for in situ calibration is discussed.

Powell, J. D.↗
NASA NTRS2015

Development and Testing of a Post-Installable Deepwater Monitoring System Using Fiber-Optic Sensors

This paper addresses the design and development of a fiber-optic monitoring system that can be deployed on existing deepwater risers and flowlines; and provides a summary of test article fabrication and the subsequent laboratory testing performed at the National Aeronautics and Space Administration-Johnson Space Center (NASA-JSC). A major challenge of a post-installed instrumentation system is to ensure adequate coupling between the instruments and the riser or flowline of interest. This work investigates the sensor coupling for pipelines that are suspended in a water column (from topside platform to seabed) using a fiber-optic sensor clamp and subsea bonding adhesive. The study involved the design, fabrication, and test of several prototype clamps that contained fiber-optic sensors. A mold was produced by NASA using 3-D printing methods that allowed the casting of polyurethane clamp test articles to accommodate 4-inch and 8-inch diameter pipes. The prototype clamps were installed with a subsea adhesive in a "wet" environment and then tested in the NASA Structures Test Laboratory (STL). The tension, compression, and bending test data showed that the prototype sensor clamps achieved good structural coupling, and could provide high quality strain measurement for active monitoring.

Seaman, Calvin H.↗
DOE OSTI2022

Two–Photon Printing of Shape–Memory Microstructures and Metasurfaces via Radical–Mediated Thiol–Vinyl Hydrothiolation

Shape-memory resists capable of high-resolution curing into arbitrarily designed structures are increasingly demanded for soft robotics, optical sensors, microscale manufacturing, and biomedicine. Amorphous, shape-memory thiol-vinyl networks were printed using two-photon polymerization (2PP) curing of a simple resin formulated with commercially available reagents. The ability to print high-resolution feature sizes down to 200 nm is attributed to the use of radicalmediated, thiol-vinyl step-growth polymerization that quickly crosslinks the resin, limiting diffusive transport. The thermomechanical behavior of the 2PP-cured material analyzed in compression, tension and three-point bending is similar to the behavior of the UV-polymerized samples. To demonstrate the ability to design, field, and test 4D responsive microstructures, an array of nine springs with coil diameters of 330 μm was printed. Following compressive shapefixing, printed arrays can release 11 μJ of stored elastic strain energy when reheated. Further, a new concept of dichroic-memory of a metamaterial device is demonstrated by printing a twisted woodpile structure with circular dichroism as characterized by Mueller Matrix ellipsometry. Furthermore, our results demonstrate how combining high-resolution 2PP curing with stimuli-responsive molecular architectures can further the engineering of responsive microstructures and metamaterials.

36 MATERIALS SCIENCE↗
NASA NTRS2008

Wearable Wireless Telemetry System for Implantable BioMEMS Sensors

Telemetry systems of a type that have been proposed for the monitoring of physiological functions in humans would include the following subsystems: Surgically implanted or ingested units that would comprise combinations of microelectromechanical systems (MEMS)- based sensors [bioMEMS sensors] and passive radio-frequency (RF) readout circuits that would include miniature loop antennas. Compact radio transceiver units integrated into external garments for wirelessly powering and interrogating the implanted or ingested units. The basic principles of operation of these systems are the same as those of the bioMEMS-sensor-unit/external-RFpowering- and-interrogating-unit systems described in "Printed Multi-Turn Loop Antennas for Biotelemetry" (LEW-17879-1) NASA Tech Briefs, Vol. 31, No. 6 (June 2007), page 48, and in the immediately preceding article, "Hand-Held Units for Short-Range Wireless Biotelemetry" (LEW-17483-1). The differences between what is reported here and what was reported in the cited prior articles lie in proposed design features and a proposed mode of operation. In a specific system of the type now proposed, the sensor unit would comprise mainly a capacitive MEMS pressure sensor located in the annular region of a loop antenna (more specifically, a square spiral inductor/ antenna), all fabricated as an integral unit on a high-resistivity silicon chip. The capacitor electrodes, the spiral inductor/antenna, and the conductor lines interconnecting them would all be made of gold. The dimensions of the sensor unit have been estimated to be about 110.4 mm. The external garment-mounted powering/ interrogating unit would include a multi-turn loop antenna and signal-processing circuits. During operation, this external unit would be positioned in proximity to the implanted or ingested unit to provide for near-field, inductive coupling between the loop antennas, which we have as the primary and secondary windings of an electrical transformer.

Simons, Rainee N.↗
DOE OSTI2024

Towards a study protocol: A data-driven workflow to identify error sources in direct ink write mechatronics

Abstract Using Direct Ink Write (DIW) technology in a rapid and large-scale production requires reliable quality control for printed parts. Data streams generated during printing, such as print mechatronics, are massive and diverse which impedes extracting insights. In our study protocol approach, we developed a data-driven workflow to understand the behavior of sensor-measured X- and Y- axes positional errors with process parameters, such as print velocity and velocity control. We uncovered patterns showing that instantaneous changes in the velocity, when the build platform accelerates and decelerates, largely influence the positional errors, especially in the X- axis due to the hardware architecture. Since DIW systems share similar mechatronic inputs and outputs, our study protocol approach is broadly applicable and scalable across multiple systems. Graphical abstract

36 MATERIALS SCIENCE↗
DOE OSTI2019

Multiscale porous elastomer substrates for multifunctional on-skin electronics with passive-cooling capabilities

In addition to mechanical compliance, achieving the full potential of on-skin electronics needs the introduction of other features. For example, substantial progress has been achieved in creating biodegradable, self-healing, or breathable, on-skin electronics. However, the research of making on-skin electronics with passive-cooling capabilities, which can reduce energy consumption and improve user comfort, is still rare. Herein, we report the development of multifunctional on-skin electronics, which can passively cool human bodies without needing any energy consumption. This property is inherited from multiscale porous polystyrene-block-poly(ethylene-ran-butylene)-block-polystyrene (SEBS) supporting substrates. The multiscale pores of SEBS substrates, with characteristic sizes ranging from around 0.2 to 7 µm, can effectively backscatter sunlight to minimize heat absorption but are too small to reflect human-body midinfrared radiation to retain heat dissipation, thereby delivering around 6 °C cooling effects under a solar intensity of 840 W∙m -2 . Other desired properties, rooted in multiscale porous SEBS substrates, include high breathability and outstanding waterproofing. The proof-of-concept bioelectronic devices include electrophysiological sensors, temperature sensors, hydration sensors, pressure sensors, and electrical stimulators, which are made via spray printing of silver nanowires on multiscale porous SEBS substrates. The devices show comparable electrical performances with conventional, rigid, nonporous ones. Also, their applications in cuffless blood pressure measurement, interactive virtual reality, and human–machine interface are demonstrated. Notably, the enabled on-skin devices are dissolvable in several organic solvents and can be recycled to reduce electronic waste and manufacturing cost. Such on-skin electronics can serve as the basis for future multifunctional smart textiles with passive-cooling functionalities.

42 ENGINEERING↗
NASA NTRS2013

Plant Habitat Telemetry / Command Interface and E-MIST

Plant Habitat (PH) is an experiment to be taken to the International Space Station (ISS) in 2016. It is critical that ground support computers have the ability to uplink commands to control PH, and that ISS computers have the ability to downlink PH telemetry data to ground support. This necessitates communication software that can send, receive, and process, PH specific commands and telemetry. The objective of the Plant Habitat Telemetry/ Command Interface is to provide this communication software, and to couple it with an intuitive Graphical User Interface (GUI). Initial investigation of the project objective led to the decision that code be written in C++ because of its compatibility with existing source code infrastructures and robustness. Further investigation led to a determination that multiple Ethernet packet structures would need to be created to effectively transmit data. Setting a standard for packet structures would allow us to distinguish these packets that would range from command type packets to sub categories of telemetry packets. In order to handle this range of packet types, the conclusion was made to take an object-oriented programming approach which complemented our decision to use the C++ programming language. In addition, extensive utilization of port programming concepts was required to implement the core functionality of the communication software. Also, a concrete understanding of a packet processing software was required in order to put aU the components of ISS-to-Ground Support Equipment (GSE) communication together and complete the objective. A second project discussed in this paper is Exposing Microbes to the Stratosphere (EMIST). This project exposes microbes into the stratosphere to observe how they are impacted by atmospheric effects. This paper focuses on the electrical and software expectations of the project, specifically drafting the printed circuit board, and programming the on-board sensors. The Eagle Computer-Aided Drafting (CAD) software was used to draft the E-MIST circuit. This required several component libraries to be created. Coding the sensors and obtaining sensor data involved using the Arduino Uno developmental board and coding language, and properly wiring peripheral sensors to the microcontroller (the central control unit of the experiment).

Walker, Uriae M.↗
NASA NTRS2013

Pushing the Limits of Cubesat Attitude Control: A Ground Demonstration

A cubesat attitude control system (ACS) was designed at the NASA Marshall Space Flight Center (MSFC) to provide sub-degree pointing capabilities using low cost, COTS attitude sensors, COTS miniature reaction wheels, and a developmental micro-propulsion system. The ACS sensors and actuators were integrated onto a 3D-printed plastic 3U cubesat breadboard (10 cm x 10 cm x 30 cm) with a custom designed instrument board and typical cubesat COTS hardware for the electrical, power, and data handling and processing systems. In addition to the cubesat development, a low-cost air bearing was designed and 3D printed in order to float the cubesat in the test environment. Systems integration and verification were performed at the MSFC Small Projects Rapid Integration & Test Environment laboratory. Using a combination of both the miniature reaction wheels and the micro-propulsion system, the open and closed loop control capabilities of the ACS were tested in the Flight Robotics Laboratory. The testing demonstrated the desired sub-degree pointing capability of the ACS and also revealed the challenges of creating a relevant environment for development testin

Sanders, Devon S.↗
NASA NTRSDate not supplied

Correlated Electromagnetic Levitation Actuator: A Reaction Sphere Based Attitude Control System

To address problems experienced by current reaction wheels and control moment gyroscopebased attitude control systems (ACS), researchers at NASA’s Marshall Space Flight Center have begun developing a reaction sphere actuator based on correlated electromagnetic levitation that will be immune to destructive bearing friction, momentum saturation, and gimbal lock. The Correlated Electromagnetic Levitation Actuator (CELA) advances the state of the art of reaction sphere ACSs by employing the concept of correlated magnetics. It is a frictionless, direct-drive reaction sphere that harnesses a unique technology with an array of applications across multiple disciplines. Correlated electromagnets function in a manner that is analogous to a matched filter; the convolution of two signals is peaked at the index representing the greatest match. For CELA, the signals are the patterns of magnetic flux density as a function of position. The magnitude of the convolution equates to an attractive or repulsive force, and these forces can be azimuthal or radial. The development of CELA is based in four distinct disciplines: Advanced Manufacturing, Prototype Development, Electromagnetic Modeling, and Controls. We are developing novel manufacturing techniques required to build arrays of permanent and electromagnet dipoles on curved surfaces. To print the permanent magnetic array, we have developed a probe with pyramidal magnets that will reside on a robotic arm to induce localized magnetic fields on a surface. The probe also includes the ability to erase dipole patterns from a permanent magnet by heating the surface to its Curie temperature. A number of test articles and prototypes have been developed using additive manufacturing methods. These prototypes have included hemispherical motors to test the drive algorithm, and a levitation test bed that demonstrates a magnetic bearing method based on attractive magnetic forces and ratiometric Hall effect sensors. We developed an array of electromagnetic dipoles on a printed circuit board (PCB) with individual H-bridges controlling each coil. This device created various flux density patterns and we measured their magnetic fields using a custom Hall effect 3-D probe and a LabVIEW virtual instrument. These data will serve as a benchmark for characterizing the accuracy of future models. Current work is focused on modeling the magnetic fields of our prototype arrays using COMSOL Finite Element Analysis and verifying the model against our test data. Accurate modeling will allow us to quickly test new patterns of electromagnets and their macro behavior. Eventually, the magnetic field models will be implemented in our controls simulations to facilitate precise control of the reaction sphere. Initial model results agree with field measurements to within 1 G (5% of measured flux density). Currently, we are testing different material properties of the electromagnets and their magnetic fields and thermal effects. These results will be used to refine the design of the electromagnetic dipoles. Our control efforts have centered on developing commutation, levitation, and field pattern shaping hardware in the form of breadboards and PCBs with software running on a local microcontroller. In addition, our partners developed MATLAB Simulink models to demonstrate a PID controller thatmitigates disturbance forces resulting from the interaction of drive and levitation magnetics. Finally, we have designed a three-axis test stand that will be used in future work to demonstrate CELA’s orientation control capability.

controls↗
NASA NTRSDate not supplied

Correlated Electromagnetic Levitation Actuator: A Reaction Sphere-Based Attitude Control System

To address problems experienced by current reaction wheels and control moment gyroscopebased attitude control systems (ACS), researchers at National Aeronautics and Space Administration’s (NASA’s) Marshall Space Flight Center (MSFC) have begun developing a reaction sphere actuator based on correlated electromagnetic levitation that will be immune to destructive bearing friction, momentum saturation, and gimbal lock. The Correlated Electromagnetic Levitation Actuator (CELA) advances the state of the art of reaction sphere ACSs by employing the concept of correlated magnetics. It is a frictionless, direct-drive reaction sphere that harnesses a unique technology with an array of applications across multiple disciplines. Correlated electromagnets function in a manner that is analogous to a matched filter; the convolution of two signals is peaked at the index representing the greatest match. For CELA, the signals are the patterns of magnetic flux density as a function of position. The magnitude of the convolution equates to an attractive or repulsive force, and these forces can be azimuthal or radial. The development of CELA is based in four distinct disciplines: Advanced Manufacturing, Prototype Development, Electromagnetic Modeling, and Controls. We are developing novel manufacturing techniques required to build arrays of permanent and electromagnet dipoles on curved surfaces. To print the permanent magnetic array, we have developed a probe with pyramidal magnets that will reside on a robotic arm to induce localized magnetic fields on a surface. We have also used high temperature ovens to erase dipole patterns from a permanent magnet by heating the surface to its Curie temperature. A number of test articles and prototypes have been developed using additive manufacturing methods. These prototypes have included hemispherical motors to test the drive algorithm, and a levitation test bed that demonstrates a magnetic bearing method based on attractive magnetic forces and ratiometric Hall effect sensors. We developed an array of electromagnetic dipoles on a printed circuit board (PCB) with individual H-bridges controlling each coil. This device created various flux density patterns and we measured their magnetic fields using a custom Hall effect 3-D probe and a LabVIEW virtual instrument. These data will serve as a benchmark for characterizing the accuracy of future models. Current work is focused on modeling the magnetic fields of our prototype arrays using COMSOL finite element analysis (FEA) and verifying the model against our test data. Accurate modeling will allow us to quickly test new patterns of electromagnets and their macro behavior. Eventually, the magnetic field models will be implemented in our controls simulations to facilitate precise control of the reaction sphere. Initial model results agree with field measurements to within 1 G (5% of measured flux density). Currently, we are testing different material properties of the electromagnets and their magnetic fields and thermal effects. These results will be used to refine the design of the electromagnetic dipoles. Our control efforts have centered on developing commutation, levitation, and field pattern shaping hardware in the form of breadboards and PCBs with software running on a local microcontroller. In addition, our partners developed MATLAB Simulink models to demonstrate a PID controller that mitigates disturbance forces resulting from the interaction of drive and levitation magnetics. Finally, we have designed a three-axis test stand that will be used in future work to demonstrate CELA’s orientation control capability.

reaction sphere↗
DOE OSTI2022

Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature

Landslides are a global and frequent natural hazard, affecting many communities and infrastructure networks. Technological solutions are needed for long-term, large-scale condition monitoring of infrastructure earthworks or natural slopes. However, current instruments for slope stability monitoring are often costly, require a complex installation process and/or data processing schemes, or have poor resolution. Wireless sensor networks comprising low-power, low-cost sensors have been shown to be a crucial part of landslide early warning systems. Here, we present the development of a novel sensing approach that uses linear arrays of three-axis accelerometers for monitoring changes in sensor inclination, and thus the surrounding soil’s deformation. By combining these deformation measurements with depth-resolved temperature measurements, we can link our data to subsurface thermal–hydrological regimes where relevant. In this research, we present a configuration of cascaded I2C sensors that (i) have ultra-low power consumption and (ii) enable an adjustable probe length. From an electromechanical perspective, we developed a novel board-to-board connection method that enables narrow, semi-flexible sensor arrays and a streamlined assembly process. The low-cost connection method relies on a specific FR4 printed circuit board design that allows board-to-board press fitting without using electromechanical components or solder connections. The sensor assembly is placed in a thin, semi-flexible tube (inner diameter 6.35 mm) that is filled with an epoxy compound. The resulting sensor probe is connected to an AA-battery-powered data logger with wireless connectivity. We characterize the system’s electromechanical properties and investigate the accuracy of deformation measurements. Our experiments, performed with probes up to 1.8 m long, demonstrate long-term connector stability, as well as probe mechanical flexibility. Furthermore, our accuracy analysis indicates that deformation measurements can be performed with a 0.390 mm resolution and a 95% confidence interval of ±0.73 mm per meter of probe length. This research shows the suitability of low-cost accelerometer arrays for distributed soil stability monitoring. In comparison with emerging low-cost measurements of surface displacement, our approach provides depth-resolved deformation, which can inform about shallow sliding surfaces.

deformation monitoring↗
DOE OSTI2021

Additive manufacturing print-heads for exotic material applications

Described herein is an additive manufacturing apparatus that is well-suited for constructing piezoelectric sensors. The additive manufacturing apparatus includes an extrusion nozzle formed of a conductive material such as aluminum. The extrusion nozzle has a channel by way of which printing material exits the extrusion nozzle, wherein a build plate is configured to receive the printing material responsive to the printing material exiting the extrusion nozzle. An arc suppressor formed of a semiconductor is coupled to the extrusion nozzle and is configured to dissipate excess charge that would otherwise exist on the extrusion nozzle when a relatively high bias voltage is applied to the extrusion nozzle. Thus, the arc suppressor mitigates arcing between the extrusion nozzle and the build plate. Arc suppressing gas is also optionally introduced into a printing region, thereby further mitigating arcing between the extrusion nozzle and the build plate.

Washburn, Cody M.↗
DOE OSTI2021

Design Optimization for Printed Melt Wire Arrays Encapsulation

As part of the Nuclear Energy Enabling Technology (NEET) Advanced Sensor and Instrumentation (ASI) Program, Idaho National Laboratory (INL) has recently established in-house capabilities to fabricate and test new advanced-manufactured sensors for measuring peak irradiation temperature within a nuclear test reactor. Although methods of real-time temperature monitoring, such as thermocouples, may be used, the complexity of feedthroughs and attachments to collect real-time measurements greatly increases the cost of the experiment. Instead, passive monitoring techniques may be used for peak- temperature measurement that exploit the melting point of well-characterized materials (standard melt wires) to infer peak reactor temperatures. However, limited available space for instrumentation during experiments introduces an additional challenge. To accommodate this, INL has expanded its temperature- detection instrumentation capabilities to include advanced manufactured (AM) melt wires for peak irradiation temperature measurements. These melt wires can determine peak temperatures while also accommodate space limitations in irradiation experiments. In an effort to improve performance reliability of AM meltwire capabilities, a process was developed and tested to identify the significance of entrapping a high purity inert atmosphere within the packaging of printed melt wire arrays. The materials used in this study were aluminum, zinc, and tin encapsulated in high purity helium within a stainless steel (SS) 316 container. Tin, with a low melting point of approximately 230°C, Zn with a mid-melting point of approximately 420°C, and Al with a high melting point of approximately 660°C. This report describes the design, fabrication process, furnace testing and X-ray Computed Tomography (XCT) evaluation. Results show a successful outcome in creating an inert gas encapsulation and high-resolution evaluation methods.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2026

Quench Propagation On Rare-Earth Barium Copper Oxide (REBCO) Tape

Rare-earth barium copper oxide (REBCO) high-temperature superconductors can carry high currents with zero electrical resistance, enabling applications in high-field magnets, energy systems, and fusion devices. However, localized losses of superconductivity, known as quenches, pose a severe risk due to REBCO’s mechanical brittleness and slow quench propagation, complicating early detection. This work investigates quench propagation and thermal response through controlled experiments. A segmented REBCO tape soldered onto a printed circuit board (PCB) with multiple voltage taps and temperature sensors was submerged in liquid nitrogen at 77 K. In the first test, current ramping produced a quench near 360 A, consistent with theoretical current limits, but resulted in local burnout. In the second test, a heater-induced quench at 300 A propagated bidirectionally with velocities ranging from 164–226 mm/s. These results provide critical parameters for improving REBCO quench detection and protection system design while accounting for REBCO’s limited bendability.

Ju, Han [Northern Illinois U.]↗