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At least 163 records · Page 9

Detection of faults and software reliability analysis

Multiversion or N-version programming was proposed as a method of providing fault tolerance in software. The approach requires the separate, independent preparation of multiple versions of a piece of software for some application. Specific topics addressed are: failure probabilities in N-version systems, consistent comparison in N-version systems, descriptions of the faults found in the Knight and Leveson experiment, analytic models of comparison testing, characteristics of the input regions that trigger faults, fault tolerance through data diversity, and the relationship between failures caused by automatically seeded faults.

Knight, J. C.↗

Detection of faults and software reliability analysis

Specific topics briefly addressed include: the consistent comparison problem in N-version system; analytic models of comparison testing; fault tolerance through data diversity; and the relationship between failures caused by automatically seeded faults.

Knight, J. C.↗

Reliability analysis of a structural ceramic combustion chamber

The Weibull modulus, fracture toughness and thermal properties of a silicon nitride material used to make a gas turbine combustor were experimentally measured. The location and nature of failure origins resulting from bend tests were determined with fractographic analysis. The measured Weibull parameters were used along with thermal and stress analysis to determine failure probabilities of the combustor with the CARES design code. The effect of data censoring, FEM mesh refinement, and fracture criterion were considered in the analysis.

Salem, Jonathan A.↗

Equivalence of physically based statistical fracture theories for reliability analysis of ceramics in multiaxial loading

The present comparison of the Batdorf (1974) flaw density and orientation distribution approach with Evans' (1978) elemental strength approach, with a view to identities in fracture criteria and distribution functions, notes that despite their fundamental differences in multiaxial loading fracture probabilities, the two approaches yield identical predictions. Lamon's (1988) assertion to the contrary, in light of different theoretical predictions by the two methods for the case of alumina disks loaded in flexure, is demonstrated to be in error.

Chao, Luen-Yuan↗

Reliability analysis of a structural ceramic combustion chamber

The Weibull modulus, fracture toughness and thermal properties of a silicon nitride material used to make a gas turbine combustor were experimentally measured. The location and nature of failure origins resulting from bend tests were determined with fractographic analysis. The measured Weibull parameters were used along with thermal and stress analysis to determine failure probabilities of the combustor with the CARES design code. The effect of data censoring, FEM mesh refinement, and fracture criterion were considered in the analysis.

Salem, Jonathan A.↗

PARAGRAPH: A graphics tool for performance and reliability analysis

PARAGRAPH is an animated graphics display package. It consists of two parts: an interface to CSIM (a process based simulation language) and a graphic display system. When a simulation model is executed on CSIM the interface collects pertinent performance analysis data and writes them to a file. This file is then fed to the graphic display system which depicts the execution of the simulation model visually. This report focuses on the graphical display system. Specifically it describes the user interface and features of the display system. It also explains how Interviews (which is based on X-windows) is used as the basis for the design of PARAGRAPH. The last section contains an example in which a basic load balancing simulation model is used to demonstrate the features and the capability of PARAGRAPH.

Lee, Kevin Douglas↗

Human Reliability Analysis: An Overview

Human/process error is potentially a large contributor to failures of aerospace systems. For some systems, such as the space shuttle main engine, large amounts of data are available, and accurate failure rates can be determined empirically. For such systems, the human error is implicit in the empirical failure rate and does not need to be quantified separately. However, for other systems, such as the solid rocket boosters, large amounts of data are not available and the failure rates must be determined by more theoretical means. When empirical data is lacking, structural models and engineering judgment must be employed. In this case, the human/process error must be modeled explicitly. An extensive literature review was performed to determine what methods already exist for modeling human error for aerospace systems. No methods that apply directly were found, although there are a number of methods that have been developed specifically for the nuclear power industry that could probably be modified for space applications. The results of the literature review are presented, as well as recommendations for future research.

Navard, Sharon E.↗

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.

non-destructive techniques↗

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)

PCB quality↗

Bayes Analysis and Reliability Implications of Stress-Rupture Testing a Kevlar/Epoxy COPV Using Temperature and Pressure Acceleration

Composite Overwrapped Pressure Vessels (COPVs) that have survived a long service time under pressure generally must be recertified before service is extended. Flight certification is dependent on the reliability analysis to quantify the risk of stress rupture failure in existing flight vessels. Full certification of this reliability model would require a statistically significant number of lifetime tests to be performed and is impractical given the cost and limited flight hardware for certification testing purposes. One approach to confirm the reliability model is to perform a stress rupture test on a flight COPV. Currently, testing of such a Kevlar49 (Dupont)/epoxy COPV is nearing completion. The present paper focuses on a Bayesian statistical approach to analyze the possible failure time results of this test and to assess the implications in choosing between possible model parameter values that in the past have had significant uncertainty. The key uncertain parameters in this case are the actual fiber stress ratio at operating pressure, and the Weibull shape parameter for lifetime; the former has been uncertain due to ambiguities in interpreting the original and a duplicate burst test. The latter has been uncertain due to major differences between COPVs in the database and the actual COPVs in service. Any information obtained that clarifies and eliminates uncertainty in these parameters will have a major effect on the predicted reliability of the service COPVs going forward. The key result is that the longer the vessel survives, the more likely the more optimistic stress ratio model is correct. At the time of writing, the resulting effect on predicted future reliability is dramatic, increasing it by about one "nine," that is, reducing the predicted probability of failure by an order of magnitude. However, testing one vessel does not change the uncertainty on the Weibull shape parameter for lifetime since testing several vessels would be necessary.

Phoenix, S. Leigh↗