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Solid state lighting component
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
2017 Project Portfolio: Solid-State Lighting
Overview of SSL projects currently funded by DOE, and those previously funded but since completed. Each profile includes a brief technical description, as well as information about project partners, funding, and the research period. This report is updated annually.
DOE Solid-State Lighting Program: Modest Investments, Extraordinary Impacts
Illustrated overview of the DOE SSL Portfolio’s programs and activities.
Solid state lighting component
An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.
Research Trends and Future Directions for Solid-State Lighting (invited).
Abstract not provided.
Solid state lighting component
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
Developing Novel Chemistry for Solid-State Lighting Phosphors and Other Applications .
Abstract not provided.
Solid-State Lighting and Related Efforts at Sandia (invited).
Abstract not provided.
Comparison of LEDs and Laser Diodes for Solid-State Lighting (invited).
Abstract not provided.