Extreme temperature thermal cycling tests and results for flight qualification
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extreme temperature thermal cycling reliability pa↗
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Extreme temperature thermal cycling tests and results to assess reliability of hardware for flight qualification
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thermal cycling extreme temperature flight qualifi↗
Effect of thermal cycling in a Mach 0.3 burner rig on properties and structure of directionally solidified gamma/gamma prime-delta eutectic
An experimental study was carried out to evaluate the effect of cyclic thermal exposures on the mechanical properties of a gamma/gamma prime-delta eutectic alloy parallel to the growth direction. The alloy had a nominal composition by weight of Ni-20 Nb-6 Cr-2.5 Al and was directionally solidified at 3 cm/hr in a furnace with a thermal gradient of at least 200 C/cm. Bars of the alloy were exposed in a Mach 0.3 burner rig and cycled 300 times between 1100 and 425 C. Oxidation-erosion characteristics of the alloy were determined by weight loss measurements at 300-cycle intervals. After cyclic exposure, stress rupture and tensile tests were performed at both 760 and 1040 C. Microstructural changes from cyclic exposure were determined. Thermal cycling resulted in gamma prime coarsening and Widmanstaetten delta precipitation in the gamma phase. An unidentified precipitate, presumably gamma prime, was observed within the delta phase. These microstructural changes did not affect the mechanical properties of the eutectic. High oxidation-erosion weight loss rate was observed.
Gray, H. R.↗
The effect of thermal cycling on the structure and properties of a Co, Cr, Ni-TaC directionally solidified eutectic composite
A Co, Cr, Ni-TaC directionally solidified eutectic composite was subjected to thermal fatigue between 427-1093°C. The material suffered degradation in microstructure and elevated temperature mechanical properties. The loss in properties varied with the maximum cycling temperature and number of cycles. This behavior is attributed to the increasing solubility of the TaC in the matrix with temperature from 0.4% at room temperature to 2.2% at 1200°C. During the thermal cycling, the TaC is subjected to solution and reprecipitation which form serrations on the fibers since the easy growth planes of the TaC are not coincident with the fiber faces exposed to the matrix.
Composites↗
Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview
Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.
Kirschman, Randall K.↗
CSP and BGA assembly reliability in a fast ramp rate thermal cycle environment
Inspection results along with SEM and optical cross-sectional photos revealing damage and failure mechanisms will also be presented.
scale package FPBGA FCBGA↗
Reliability and Failure Analyses of Thermally Cycled Ball Grid Array Assemblies
Reliability of Ball Grid Arrays was assessed as part of a consortium effort led by the Jet Propulsion Laboratory.
reliability Ball Grid Arrays thermal cycle failure↗
The Dependence of the Change in the Coefficient of Thermal Expansion of Graphite Fiber Reinforced Polyimide IM7-K3B on Microcracking due to Thermal Cycling
Composite IM7-K3B was subjected to a simulated high speed aircraft thermal environment to determine the effects of microcracking on the change in CTE. IM7-K3B is a graphite fiber reinforced polyimide laminate, manufactured by Dupont. The lay-up for the material was (0.90((Sub 3)(Sub s))). The specimens were placed in a laser-interferometric dilatometer to obtain thermal expansion measurements and were then repeatedly cycled between -65 F and 350 F up to 1000 cycles. After cycling they were scanned for microcracks at a magnification of 400x. The material was expected not to crack and to have a near zero CTE. Some microcracking did occur in all specimens and extensive microcracking occurred in one specimen. Further testing is required to determine how closely the CTE and microcracking are related.
Stewart, Melissa C.↗
Thermal cycling test results of CSP and RF assemblies
A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP thermal cycle solder joint ↗
Effect of thermal cycling ramp rate on CSP assembly reliability
A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.
accelerated thermal cycle chip scale package solde↗
(abstract) Variations in Polarimetric Backscatter of Saline Ice Grown Under Diurnal Thermal Cycling Condition
An experiment was carried out in January 1994 at the Geophysical Research Facility in the Cold Regions Research and Engineering Laboratory. To investigate effects on polarimetric scattering signatures of sea ice growth under diurnal temperature variations, an ice sheet was grown for 2.5 days for the thickness of 10 cm and a polarimetric radar operating at C-band was used to obtain backscattering data in conjunction with ice-characterization measurements. The ice sheet was grown in the late morning of January 19, 1994. The initial growth rate was slow due to high insolation and temperature. As the air temperature dropped during the night, the growth rate increased significantly. The air temperature changed drastically from about -10(deg)C to -35(deg)C between day and night. The temperature cycle was repeated during the next day and the growth rate varied in the same manner. The surface of the ice was partially covered by frost flowers and the areal coverage increased as the ice became thicker. Throughout the ice growth duration of 2.5 days, polarimetric backscatter data were collected at roughly every centimeter of ice growth. For each set of radar measurements of saline ice, a set of calibration measurements was carried out with trihedrial corner reflectors and a metallic sphere. Measured polarimetric backscattering coefficients of the ice sheet reveal a strong correlation between radar data and temperature variations. As the temperature increased (decreased), the backscatter increased (decreased) correspondingly. From the ice-characterization data, temperatures of the air, at the ice-air interface, and in the ice layer had the same variation trend. Another interesting experimental observation is that the salinity measured as a function of ice depth from a sample of 10-cm thich ice indicated that the salinity variations had a similar cycle as the temperature; i.e., the salinity profile recorded the history of the temperature variations. Characterization data of the ice sheet are used in a theoretical model for scattering from saline ice with frost cover to explain the observed polarimetric signatures.
characterization polarimetric radar salinity tempe↗
Thermal Cycling Fatigue in DIPs Mounted with Eutectic Tin-Lead Solder Joints in Stub and Gullwing Geometries
It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was first to make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age. Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.
fatigue failure solder joints failure mechanisms s↗
Resilient clamp holds fuel cell stack through resilient clamp holds fuel cell stack through thermal cycle
Resilient clamping device holds a stack of fuel cells during thermal expansion and contraction periods. The clamp has torsion bar action which maintains seal integrity over a wide stress range.
Shinn, B. H.↗
Representative Modules for Accelerated Thermal Cycling and Static Load Testing
In this work, we explore the influence of module size on the rate of interconnect solder bond thermomechanical fatigue (TMF) damage and the probability of cell fracture. For the solder bond TMF damage evaluation, structural mechanics models of crystalline silicon PV models are created to solve with the Finite Element Method. For the probability of cell fracture evaluation, Weibull analysis and weakest link theory are employed to resolve the probability of crystalline silicon PV cell fracture when measured as bare cells and when stressed in reduced- and full-sized modules. Results conclusively demonstrate that the rate of solder bond TMF damage is independent of module size, interconnect location across the cell and cell location across the module and that smaller, representative, modules must be loaded to a much higher level than their parent full-sized modules to achieve an equivalent driving force for cell fracture.
accelerated testing↗
Effect of thermal cycling on interface bonding requirements in Al2O3 fiber-reinforced superalloy composites
CTE (coefficient of thermal expansion) mismatch-induced stresses as they affect the fiber-matrix bond integrity of Al2O3 fiber-reinforced superalloy composites are examined. Of the three individual stress components, only the radial stress directly affects the integrity of the fiber-matrix interface. It is noted that a compressive radial stress leads to a clamping action on the fiber and is therefore beneficial to the integrity of the fiber-matrix bond. A radial tensile stress, on the other hand, can cause debonding of the fiber from the matrix for a weak fiber-matrix bond.
Misra, Ajay K.↗
Prolonging thermal barrier coated specimen life by thermal cycle management
Measurements were made of the rate of increase in temperature of a ZrO2-8Y2O3 thermal barrier coated (TBC) specimen for various values of fuel/air (F/A) ratios when the specimen is exposed to a 0.3 Mach burner flame. For rod specimens in a carousel, the heating rates increased with (F/A) ratio and were higher at the inward facing surface for a given (F/A). Plate specimens were more sensitive to burner variations. Calculated results are given for the radial stress in the coated rod specimens for variations in (F/A) ratios from 0.04 to 0.065. Over this range, the radial stress varies from 4.3 to 5.3 MPa. The results indicate that controlling the heating rate of a TBC by controlling the (F/A) ratio offers a potential method to prolong TBC cyclic life; uncontrolled (F/A) ratios will produce scatter in experimental results. Geometric arrangement can have an equivalent effect, but is usually fixed by design.
Hendricks, R. C.↗
Reusable thermal cycling clamp
A reusable metal clamp for retaining a fused quartz ampoule during temperature cycling in the range of 20 deg C to 1000 deg C is described. A compressible graphite foil having a high radial coefficient of thermal expansion is interposed between the fused quartz ampoule and metal clamp to maintain a snug fit between these components at all temperature levels in the cycle.
Debnam, W. J., Jr.↗
Degradation of REBCO coated conductors due to a combination of epoxy impregnation, thermal cycles, and quench: Characteristics and a method of alleviation
REBa2Cu3Ox (REBCO) coated conductors are an enabling technology for >1 GHz nuclear magnetic resonance spectrometers that need >23.5 T solenoids, compact high-field fusion reactors beyond the International Thermonuclear Experimental Reactor, and 20 T class accelerator magnets. An in-depth understanding of stress and strain management is critically needed for these applications. Here, we report experimental data and an analysis of damages of REBCO-coated conductors in several scenarios relevant for their applications in high-field magnets and unique to their multi-layer thin film structure. The examined scenarios include failure induced by quench, failure induced by epoxy impregnation, and failure induced by a combination of epoxy impregnation and quench. The root cause is film blistering and peeling induced by thermally interfacial stresses characteristic of multilayered heteroepitaxial thin film structures on thick substrates utilized. The quantitative stress analysis is introduced using simple and easy to use formulas and clearly indicates how materials and structural characteristics affect the magnitude and the distribution of stresses and deflections. Finally, a simple method is introduced for removing degradation of REBCO coated conductors due to epoxy impregnation. Our data and analysis help our understanding of the practical limit of REBCO-coated conductors and can be utilized as a guidance for the physical design of REBCO coated conductors and high-current cables assembled from them and for minimizing damages.
Yin, Shijian (ORCID:0000000224312274)↗