Results for “adhesion” — Page 9

NASA NTRS1983

Fatigue behavior of adhesively bonded joints

The fatigue damage mechanism of composite to composite adhesively bonded joints was characterized. The mechanics of the possible modes of fatigue damage propagation in these joints when subjected to constant amplitude cyclic mechanical loading were investigated. The possible failure modes in composite bonded joints may be cyclic debonding (i.e., progressive separation of the adhesive), interlaminar damage (delamination), adherend fatigue or a combination of these. Two composite systems - graphite/epoxy adhesively bonded to graphite/epoxy and Kevlar 49/epoxy adhesively bonded to Kevlar 49/epoxy were investigated. Both composite systems consisted of quasi-isotropic lay-ups, i.e., 0 deg/-45 deg/+45 deg/90 degs. The two adhesives, employed in the study were (1) EC 3445 with cure temperature of 250 F for secondary bonding and (2) FM 300 with cure temperature of 350 F for co-cure bonding.

Mall, S.↗

NASA NTRS1983

A fracture mechanics approach for designing adhesively bonded joints

An analytical and experimental investigation was undertaken to determine if the adhesive debond initiation stress could be predicted for arbitrary joint geometries. The analysis was based upon a threshold total strain-energy-release rate (Gth) concept. Two bonded systems were tested: T300/5208 graphite/epoxy adherends bonded with either EC-3445 or FM-300 adhesive. The Gth for each adhesive was determined from cracked-lap-shear (CLS) specimens by initiation tests. Finite-element analyses of various tapered CLS specimen geometries predicted the specimen stress at which the total strain-energy-release rate (GT) equaled Gth at the joint tip. Experiments verified the predictions. The approach described herein predicts the maximum stress at which an adhesive joint can be cycled yet not debond. Furthermore, total strain-energy-release rate appeared to be the driving parameter for cyclic debonding and debond initiation in structural adhesives. In addition, debond initiation and growth were found to occur with virtually no peel stress present.

Johnson, W. S.↗

NASA NTRS1983

Material characterization of structural adhesives in the lap shear mode

A general method for characterizing structural adhesives in the bonded lap shear mode is proposed. Two approaches in the form of semi-empirical and theoretical approaches are used. The semi-empirical approach includes Ludwik's and Zhurkov's equations to describe respectively, the failure stresses in the constant strain rate and constant stress loading modes with the inclusion of the temperature effects. The theoretical approach is used to describe adhesive shear stress-strain behavior with the use of viscoelastic or nonlinear elastic constitutive equations. Three different model adhesives are used in the simple lap shear mode with titanium adherends. These adhesives (one of which was developed at NASA Langley Research Center) are currently considered by NASA for possible aerospace applications. Use of different model adhesives helps in assessment of the generality of the method.

Schenck, S. C.↗

NASA NTRS1984

Future Directions of Research in Adhesion and Friction. Status of Understanding

Four main classes of materials are covered: metals, ceramics, elastomers and polymers. In dealing with adhesion a distinction is drawn between adhesion (which often involves thermodynamic concepts) and the observed adhesive strength, here designated as the pull-off force. With metals the level of understanding of the interfacial bond is well understood theoretically and was elegantly studied experimentally. However the role of surface roughness and especially ductility needs to be incorporated into an overall view of metallic adhesion. The effect of contaminant films has not gone far beyond purely descriptive language. The friction of metals is understood in terms of surface topography, adhesion and deformation and there are now promising solutions using slipline-field theory. These do not however, cope very satisfactorily with work hardening. For surfaces sliding at higher speeds there are now good models which deal with asperity instabilities produced by frictional heating.

Tabor, D.↗

NASA NTRS1985

High-temperature Adhesive Development and Evaluation

High-temperature adhesive systems are evaluated for short and long-term stability at temperatures ranging from 232C to 427C. The resins selected for characterization include: NASA Langley developed polyphenylquinoxaline (PPQ), and commercially available polyimides (PI). The primary method of bond testing is single lap shear. The PPQ candidates are evaluated on 6A1-4V titanium adherends with chromic acid anodize and phosphate fluoride etch surface preparations. The remaining adhesives are evaluated on 15-5 PH stainless steel with a sulfuric acid anodize surface preparation. Preliminary data indicate that the PPQ adhesives tested have stability to 3000 hours at 450F with chromic acid anodize surface preparation. Additional studies are continuing to attempt to improve the PPQ's high-performance by formulating adhesive films with a boron filler and utilizing the phosphate fluoride surface preparation on titanium. Evaluation of the polyimide candidates on stainless-steel adherends indicates that the FM-35 (American Cyanamid), PMR-15 (U.S. Polymeric/Ferro), TRW partially fluorinated polyimide and NR 150B2S6X (DuPont) adhesives show sufficient promise to justify additional testing.

Hendricks, C. L.↗

NASA NTRS1985

New processable modified polyimide resins for adhesive and matrix applications

A broad product line of bismaleimide modified epoxy adhesives which are cured by conventional addition curing methods is described. These products fill a market need for 232 C (450 F) service adhesives which are cured in a manner similar to conventional 177 C (350 F) epoxy adhesives. The products described include film adhesives, pastes, and a primer. Subsequent development work has resulted in a new bismaleimide modified epoxy resin which uses a unique addition curing mechanism. This has resulted in products with improved thermomechanical properties compared to conventional bismaleimide epoxy resins. A film adhesive, paste, and matrix resin for composites using this new technology are described. In all cases, the products developed are heat cured by using typical epoxy cure cycles i.e., 1 hour at 177 C (350 F) followed by 2 hours postcure at 246 C (475 F).

Landman, D.↗

NASA NTRS1985

A fracture mechanics approach for designing adhesively bonded joints

An analytical and experimental investigation was undertaken to determine if the adhesive debond initiation stress could be predicted for arbitrary joint geometries. The analysis was based upon a threshold total strain-energy-release rate (Gth) concept. Two bonded systems were tested: T300/5208 graphite/epoxy adherends bonded with either EC-3445 or FM-300 adhesive. The Gth for each adhesive was determined from cracked-lap-shear (CLS) specimens by initiation tests. Finite-element analyses of various tapered CLS specimen geometries predicted the specimen stress at which the total strain-energy-release rate (GT) equaled Gth at the joint tip. Experiments verified the predictions. The approach described herein predicts the maximum stress at which an adhesive joint can be cycled yet not debond. Furthermore, total strain-energy-release rate appeared to be the driving parameter for cyclic debonding and debond initiation in structural adhesives. In addition, debond initiation and growth were found to occur with virtually no peel stress present.

Johnson, W. S.↗

NASA NTRS1985

Durability predictions of adhesively bonded composite structures using accelerated characterization methods

The utilization of adhesive bonding for composite structures is briefly assessed. The need for a method to determine damage initiation and propagation for such joints is outlined. Methods currently in use to analyze both adhesive joints and fiber reinforced plastics is mentioned and it is indicated that all methods require the input of the mechanical properties of the polymeric adhesive and composite matrix material. The mechanical properties of polymers are indicated to be viscoelastic and sensitive to environmental effects. A method to analytically characterize environmentally dependent linear and nonlinear viscoelastic properties is given. It is indicated that the methodology can be used to extrapolate short term data to long term design lifetimes. That is, the method can be used for long term durability predictions. Experimental results for near adhesive resins, polymers used as composite matrices and unidirectional composite laminates is given. The data is fitted well with the analytical durability methodology. Finally, suggestions are outlined for the development of an analytical methodology for the durability predictions of adhesively bonded composite structures.

Brinson, H. F.↗

NASA NTRS1988

Flexibilized copolyimide adhesives

Two copolyimides, LARC-STPI and STPI-LARC-2, with flexible backbones were processed and characterized as adhesives. The processability and adhesive properties were compared to those of a commercially available form of LARC-TPI. Lap shear specimens were fabricated using adhesive tape prepared from each of the three polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to water-boil and to thermal aging at 204 C for up to 1000 hours. The three adhesive systems possess exceptional lap shear strengths at room temperature and elevated temperatures both before and after thermal exposure. LARC-STPI, because of its high glass transition temperature provided high lap shear strengths up to 260 C. After water-boil, LARC-TPI exhibited the highest lap shear strengths at room temperature and 177 C, whereas the LARC-STPI retained a higher percentage of its original strength when tested at 204 C. These flexible thermoplastic copolyimides show considerable potential as adhesives based on this study and because of the ease of preparation with low cost, commercially available materials.

Progar, Donald J.↗

NASA NTRS1988

Adhesion, friction and micromechanical properties of ceramics

The adhesion, friction, and micromechanical properties of ceramics, both in monolithic and coating form, are reviewed. Ceramics are examined in contact with themselves, other harder materials, and metals. For the simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. The first part discusses the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces. The role of chemical bonding in adhesion and friction, and the effects of surface contaminant films and temperature on tribological response with respect to adhesion and friction are discussed. The second part deals with abrasion of ceramics. Elastic, plastic, and fracture behavior of ceramics in solid state contact is discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of ceramic deposited on substrates is also addressed.

Miyoshi, Kazuhisa↗

NASA NTRS1988

Flexible backbone aromatic polyimide adhesives

Continuing research at Langley Research Center on the synthesis and development of new inexpensive flexible aromatic polyimides as adhesives has resulted in a material identified as LARC-F-SO2 with similarities to polyimidesulfone, PISO2, and other flexible backbone polyimides recently reported by Progar and St. Clair. Also prepared and evaluated was an endcapped version of PISO2. These two polymers were compared with LARC-TPI and LARC-STPI, polyimides research in our laboratory and reported in the literature. The adhesive evaluation, primarily based on lap shear strength (LSS) tests at RT, 177 C and 204 C, involved preparing adhesive tapes, conducting bonding studies and exposing lap shear specimens to 204 C air for up to 1000 hrs and to a 72-hour water boil. The type of adhesive failure as well as the Tg was determined for the fractured specimens. The results indicate that LARC-TPI provides the highest LSSs. LARC-F-SO2, LARC-TPI and LARC-STPI all retain their strengths after thermal exposure for 1000 hrs and PISO2 retains greater than 80 percent of its control strengths. After a 72-hr water boil exposure, most of the four adhesive systems showed reduced strengths for all test temperatures although still retaining a high percentage of their original strength (greater than 60 percent) except for one case. The predominant failure type was cohesive with no significant change in the Tgs.

Progar, Donald J.↗

NASA NTRS1988

Adhesively bonded joints: Testing, analysis, and design; Proceedings of the International Symposium, Baltimore, MD, Sept. 10-12, 1986

The papers contained in this volume provide an overview of the state of the art of testing, analysis, and design of adhesively bonded joints. The papers are grouped in the following sections: mechanical testing, stress analysis, failure mechanisms, and design and durability. Specific topics discussed include determination and verification of elastic parameters for adhesives; factors influencing elastic stresses in double cantilever beam specimens; special mixed finite elements for interfacial stress analysis of adhesively bonded joints; debonding characteristics of adhesively bonded woven Kevlar composites; and environmental durability of adhesively bonded joints.

Johnson, W. S.↗

NASA NTRS1988

Adhesion, friction and micromechanical properties of ceramics

The adhesion, friction, and micromechanical properties of ceramics, both in monolithic and coating form, are reviewed. Ceramics are examined in contact with themselves, other harder materials, and metals. For the simplicity of discussion, the tribological properties of concern in the processes are separated into two parts. The first part discusses the pull-off force (adhesion) and the shear force required to break the interfacial junctions between contacting surfaces. The role of chemical bonding in adhesion and friction, and the effects of surface contaminant films and temperature on tribological response with respect to adhesion and friction are discussed. The second part deals with abrasion of ceramics. Elastic, plastic, and fracture behavior of ceramics in solid state contact is discussed. The scratch technique of determining the critical load needed to fracture interfacial adhesive bonds of ceramic deposited on substrates is also addressed.

Miyoshi, Kazuhisa↗

NASA NTRS1989

Flexible backbone aromatic polyimide adhesives

Continuing research at Langley Research Center on the synthesis and development of new inexpensive flexible aromatic polyimides as adhesives has resulted in a material identified as LARC-F-SO2 with similarities to polyimidesulfone, PISO2, and other flexible backbone polyimides recently reported by Progar and St. Clair. Also prepared and evaluated was an endcapped version of PISO2. These two polymers were compared with LARC-TPI and LARC-STPI, polyimides research in our laboratory and reported in the literature. The adhesive evaluation, primarily based on lap shear strength (LSS) tests at RT, 177 C and 204 C, involved preparing adhesive tapes, conducting bonding studies and exposing lap shear specimens to 204 C air for up to 1000 hrs and to a 72-hour water boil. The type of adhesive failure as well as the Tg was determined for the fractured specimens. The results indicate that LARC-TPI provides the highest LSSs. LARC-F-SO2, LARC-TPI and LARC-STPI all retain their strengths after thermal exposure for 1000 hrs and PISO2 retains greater than 80 percent of its control strengths. After a 72-hr water boil exposure, most of the four adhesive systems showed reduced strengths for all test temperatures although still retaining a high percentage of their original strength (greater than 60 percent) except for one case. The predominant failure type was cohesive with no significant change in the Tgs.

Progar, Donald J.↗

NASA NTRS1992

Preliminary evaluation of adhesion strength measurement devices for ceramic/titanium matrix composite bonds

The adhesive bond between ceramic cement and a titanium matrix composite substrate to be used in the National Aerospace Plane program is evaluated. Two commercially available adhesion testers, the Sebastian Adherence Tester and the CSEM REVETEST Scratch Tester, are evaluated to determine their suitability for quantitatively measuring adhesion strength. Various thicknesses of cements are applied to several substrates, and bond strengths are determined with both testers. The Sabastian Adherence Tester has provided limited data due to an interference from the sample mounting procedure, and has been shown to be incapable of distinguishing adhesion strength from tensile and shear properties of the cement itself. The data from the scratch tester has been found to be difficult to interpret due to the porosity and hardness of the cement. Recommendations are proposed for a more reliable adhesion test method.

Pohlchuck, Bobby↗

NASA NTRS1993

System integration and demonstration of adhesive bonded high temperature aluminum alloys for aerospace structure, phase 2

Adhesive bonding materials and processes were evaluated for assembly of future high-temperature aluminum alloy structural components such as may be used in high-speed civil transport aircraft and space launch vehicles. A number of candidate high-temperature adhesives were selected and screening tests were conducted using single lap shear specimens. The selected adhesives were then used to bond sandwich (titanium core) test specimens, adhesive toughness test specimens, and isothermally aged lap shear specimens. Moderate-to-high lap shear strengths were obtained from bonded high-temperature aluminum and silicon carbide particulate-reinforced (SiC(sub p)) aluminum specimens. Shear strengths typically exceeded 3500 to 4000 lb/in(sup 2) and flatwise tensile strengths exceeded 750 lb/in(sup 2) even at elevated temperatures (300 F) using a bismaleimide adhesive. All faceskin-to-core bonds displayed excellent tear strength. The existing production phosphoric acid anodize surface preparation process developed at Boeing was used, and gave good performance with all of the aluminum and silicon carbide particulate-reinforced aluminum alloys investigated. The results of this program support using bonded assemblies of high-temperature aluminum components in applications where bonding is often used (e.g., secondary structures and tear stoppers).

Falcone, Anthony↗

NASA NTRS1994

Frictional behavior and adhesion of Ag and Au films applied to aluminum oxide by oxygen-ion assisted Screen Cage Ion Plating (SCIP)

A modified dc-diode ion plating system, by utilizing a metallic screen cage as a cathode, is introduced for coating nonconductors such as ceramics. Screen cage ion plating (SCIP) is used to apply Ag and Au lubricating films on aluminum oxide surfaces. This process has excellent ability to coat around corners to produce three-dimensional coverage of the substrate. A dramatic increase in adhesion is achieved when plating is performed in a reactive 50 percent O2 - 50 percent Ar glow discharge compared to the adhesion when plating is performed in 100 percent Ar. The presence of oxygen ion assistance contributes to the excellent adhesion as measured in a pull-type adhesion tester. The Ag and Au film adhesion is significantly increased (less than 70MPa) and generally exceeds the cohesion of the substrate such that portions of the alumina are pulled out.

Spalvins, Talivaldis↗

NASA NTRS1993

A test of the adhesion approximation for gravitational clustering

We quantitatively compare a particle implementation of the adhesion approximation to fully non-linear, numerical 'N-body' simulations. Our primary tool, cross-correlation of N-body simulations with the adhesion approximation, indicates good agreement, better than that found by the same test performed with the Zel-dovich approximation (hereafter ZA). However, the cross-correlation is not as good as that of the truncated Zel-dovich approximation (TZA), obtained by applying the Zel'dovich approximation after smoothing the initial density field with a Gaussian filter. We confirm that the adhesion approximation produces an excessively filamentary distribution. Relative to the N-body results, we also find that: (a) the power spectrum obtained from the adhesion approximation is more accurate than that from ZA or TZA, (b) the error in the phase angle of Fourier components is worse than that from TZA, and (c) the mass distribution function is more accurate than that from ZA or TZA. It appears that adhesion performs well statistically, but that TZA is more accurate dynamically, in the sense of moving mass to the right place.

Melott, Adrian L.↗