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All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Using the System Complexity Metric (SCM) to Compare CO2 Removal Systems

A fundamental cause of difficulty in large engineering projects is their inherent complexity. An impression of complexity occurs if a system is simply difficult to understand, where there is no obvious mental model that correctly predicts its behavior. Higher system complexity is usually associated with higher cost and higher failure rate. Complexity is perceived if a system has many diverse components, multiple interactions and feedback loops, transients and dynamic behavior, and unanticipated failure modes. Identifying and removing these signs of complexity should improve performance and reduce the cost and failure rate. Complexity can be directly measured by the number of components and their interactions. The System Complexity Metric (SCM) is defined as the sum of the number of parts in a system, N, plus the number of the one-way interconnections between them, I. SCM = N + I. The SCM is easily determined by direct inspection of the system block diagram. SCM can be used to compare systems and to guide their redesign to reduce cost and failure rate. Carbon dioxide removal systems are analyzed using SCM, cost, and failure rate. As in previous work, cost is directly proportional to SCM and that failure rate increases as a power of SCM for large differences in SCM. The SCM ranking of carbon dioxide removal systems is the same as their ranking in detailed analysis and practice.

Harry W. Jones↗
NASA NTRSDate not supplied

Using the System Complexity Metric (SCM) to Compare CO2 Reduction Systems

A fundamental cause of difficulty in large engineering projects is their inherent complexity. An impression of complexity occurs if a system is simply difficult to understand, where there is no obvious mental model that correctly predicts its behavior. Higher system complexity is usually associated with higher cost and higher failure rate. Complexity is perceived if a system has many diverse components, multiple interactions and feedback loops, transients and dynamic behavior, and unanticipated failure modes. Identifying and removing these signs of complexity should improve performance and reduce the cost and failure rate. Complexity can be directly measured by the number of components and their interactions. The System Complexity Metric (SCM) is defined as the sum of the number of parts in a system, N, plus the number of the one-way interconnections between them, I. SCM = N + I. The SCM is easily determined by direct inspection of the system block diagram. SCM can be used to compare systems and to guide their redesign to reduce cost and failure rate. Carbon dioxide reduction systems are analyzed using SCM, cost, and failure rate. As in previous work, cost is directly proportional to SCM and that failure rate increases as a power of SCM for large differences in SCM. The SCM ranking of carbon dioxide reduction systems is the same as their ranking in detailed analysis and practice.

Harry W. Jones↗
NASA NTRS1992

An integrated database with system optimization and design features

A customized, mission-specific relational database package was developed to allow researchers working on the Mars oxygen manufacturing plant to enter physical description, engineering, and connectivity data through a uniform, graphical interface and to store the data in formats compatible with other software also developed as part of the project. These latter components include an optimization program to maximize or minimize various criteria as the system evolves into its final design; programs to simulate the behavior of various parts of the plant in Martian conditions; an animation program which, in different modes, provides visual feedback to designers and researchers about the location of and temperature distribution among components as well as heat, mass, and data flow through the plant as it operates in different scenarios; and a control program to investigate the stability and response of the system under different disturbance conditions. All components of the system are interconnected so that changes entered through one component are reflected in the others.

Arabyan, A.↗
NASA NTRS2014

Intentional Collaboration & Innovation Spaces at NASA

Collaboration and Innovation (C&I) are extremely popular terms in corporate jargon, and institutions with reputations for creativity often have clever and fun spaces set aside for hatching ideas and developing products or services. In and of themselves, a room full of "collaboration furniture" and electronics can't make C&I happen, any more than oil makes a gas or diesel engine run. As with the engine, though, quality lubrication is a huge factor in the smooth operation, power, and longevity of C&I activity. This paper describes spaces deliberately set up at numerous NASA field centers to support collaborative and creative thinking and processes. (Sometimes support is not so much a matter of doing things to spark discussion as it is removing constraints imposed by traditional settings and making information sharing as easy as possible.) Some spaces are rooms or suites dedicated to C&I, with significant electronic support and/or intentional lack thereof (to emphasize the human element). Others are small, comfortable "roosting places" that invite conversations of opportunity. Descriptions include the sponsoring organization, underlying goals and philosophies, lessons learned, and opportunities to excel. There is discussion about how such areas might interconnect within centers, across NASA, and with external entities using current technology and what tools and approaches may be in our future.

Scott, David W.↗
NASA NTRSDate not supplied

Applying the System Complexity Metric (SCM)

A fundamental cause of difficulty in larger engineering projects is their inherent complexity. An impression of complexity occurs if a system is simply difficult to understand, so that there is no obvious mental model that correctly predicts its behavior. Higher complexity is usually associated with higher cost and higher failure rate. Complexity is indicated by a system having more and diverse components, multiple interactions and feedback loops, transients and dynamic behavior, and often the emergence of unanticipated failure modes. Identifying and removing these signs of complexity should reduce complexity and improve performance. Here we limit complexity measurement to the number of components and their interactions. A System Complexity Metric (SCM) is defined as equal to the sum of the number of parts in a system, N, plus the sum of the one-way interconnections between them, I. SCM = N + I. The SCM is easily determined by direct inspection of system block diagrams. Previous work found that life support system cost was directly proportional to SCM and that failure rate increased faster than SCM squared. SCM can be used to compare systems or to guide their redesign to reduce cost and failure rate. Carbon dioxide removal systems will be analyzed using SCM, cost, and failure rate.

Harry W Jones↗
NASA NTRS1991

Quantitative simulation of extraterrestrial engineering devices

This is a multicomponent, multidisciplinary project whose overall objective is to build an integrated database, simulation, visualization, and optimization system for the proposed oxygen manufacturing plant on Mars. Specifically, the system allows users to enter physical description, engineering, and connectivity data through a uniform, user-friendly interface and stores the data in formats compatible with other software also developed as part of this project. These latter components include: (1) programs to simulate the behavior of various parts of the plant in Martian conditions; (2) an animation program which, in different modes, provides visual feedback to designers and researchers about the location of and temperature distribution among components as well as heat, mass, and data flow through the plant as it operates in different scenarios; (3) a control program to investigate the stability and response of the system under different disturbance conditions; and (4) an optimization program to maximize or minimize various criteria as the system evolves into its final design. All components of the system are interconnected so that changes entered through one component are reflected in the others.

Arabyan, A.↗
NASA NTRSDate not supplied

Eleven Countries, an Integrated Spacecraft: the Story of International Collaboration that Built the Orion Spacecraft and Powered the Success of the Artemis I Mission

The quest to return humans to the Moon in the next step towards humanity's exploration of space is more alive than ever. After a great deal of achievements, failures, and lessons learned, the Artemis I mission set o to the Moon on November 16, 2022, with the goal of testing a new rocket, the Space Launch System, and a new spacecraft, Orion: designed, assembled, and tested across two continents, and 11 countries. Behind this mission, decades of experience with the International Space Station, Autonomous Transfer Vehicle operations, and many other program collaborations built the know-how on how to succeed together in the toughest environment | deep space. The Artemis I mission proved to be an incredible success, meeting 161 total mission objectives, including 21 developed during the flight based on outperforming spacecraft. It was also a case-study in international collaboration, given that ESA, NASA, and industry partners Airbus and Lockheed Martin for the first time had to design, build, test, and fly a fully integrated human-rated spacecraft, with most critical functions dependent and interconnected across U.S. and European systems. The U.S.-built Orion Crew Module and Crew Module Adapter and European-built European Service Module (ESM) shared critical interfaces and commodities, from propulsion, avionics, active/passive thermal, electrical power generation, storage and distribution to the software that managed it all. In this paper, we will describe relevant aspects of the integrated spacecraft design, providing context for the challenges that the team faced in all phases required to get Orion ready to fly, and provide a direct account of how the joint team formed, trained, and supported the operations of the successful Artemis I mission. We will also explore the evolution of the partnerships, given that these allow a multi-national e ort to sustain the program production, share costs, leverage a broader base of engineering expertise, and build more diverse capabilities over the long haul to support the Artemis goals and objectives. Lastly, we will cover critical lessons learned and how the Orion Program has implemented these in preparation of the next Artemis missions to repeat the success of Artemis I. The purpose of this paper is to document knowledge we gained and lessons we learned through the development of an integrated Orion spacecraft, since it is imperative we build on this now, at the dawn of the Artemis Program, an international endeavor to push human space exploration.

Deep Space Exploration↗
NASA NTRS1994

Drag reduction strategies

previously a description was given of an active control scheme using wall transpiration that leads to a 15% reduction in surface skin friction beneath a turbulent boundary layer, according to direct numerical simulation. In this research brief further details of that scheme and its variants are given together with some suggestions as to how sensor/actuator arrays could be configured to reduce surface drag. The research which is summarized here was performed during the first half of 1994. This research is motivated by the need to understand better how the dynamics of near-wall turbulent flow can be modified so that skin friction is reduced. The reduction of turbulent skin friction is highly desirable in many engineering applications. Experiments and direct numerical simulations have led to an increased understanding of the cycle of turbulence production and transport in the boundary layer and raised awareness of the possibility of disrupting the process with a subsequent reduction in turbulent skin friction. The implementation of active feedback control in a computational setting is a viable approach for the investigation of the modifications to the flow physics that can be achieved. Bewley et al. and Hill describe how ideas from optimal control theory are employed to give 'sub-optimal' drag reduction schemes. The objectives of the work reported here is to investigate in greater detail the assumptions implicit within such schemes and their limitations. It is also our objective to describe how an array of sensors and actuators could be arranged and interconnected to form a 'smart' surface which has low skin friction.

Hill, D. Christopher↗
NASA NTRS1995

Weaves as an Interconnection Fabric for ASIM's and Nanosatellites

Many of the micromachines under consideration require computer support, indeed, one of the appeals of this technology is the ability to intermix mechanical, optical, analog, and digital devices on the same substrate. The amount of computer power is rarely an issue, the sticking point is the complexity of the software required to make effective use of these devices. Micromachines are the nano-technologist's equivalent of 'golden screws'. In other words, they will be piece parts in larger assemblages. For example, a nano-satellite may be composed of stacked silicon wafers where each wafer contains hundreds to thousands of micromachines, digital controllers, general purpose computers, memories, and high-speed bus interconnects. Comparatively few of these devices will be custom designed, most will be stock parts selected from libraries and catalogs. The novelty will lie in the interconnections. For example, a digital accelerometer may be a component part in an adaptive suspension, a monitoring element embedded in the wrapper of a package, or a portion of the smart skin of a launch vehicle. In each case, this device must inter-operate with other devices and probes for the purposes of command, control, and communication. We propose a software technology called 'weaves' that will permit large collections of micromachines and their attendant computers to freely intercommunicate while preserving modularity, transparency, and flexibility. Weaves are composed of networks of communicating software components. The network, and the components comprising it, may be changed even while the software, and the devices it controls, are executing. This unusual degree of software plasticity permits micromachines to dynamically adapt the software to changing conditions and allows system engineers to rapidly and inexpensively develop special purpose software by assembling stock software components in custom configurations.

Gorlick, Michael M.↗
NASA NTRS2011

Innovative Comparison of Transient Ignition Temperature at the Booster Interface, New Stainless Steel Pyrovalve Primer Chamber Assembly "V" (PCA) Design Versus the Current Aluminum "Y" PCA Design

An assessment of four spacecraft pyrovalve anomalies that occurred during ground testing was conducted by the NASA Engineering & Safety Center (NESC) in 2008. In all four cases, a common aluminum (Al) primer chamber assembly (PCA) was used with dual NASA Standard Initiators (NSIs) and the nearly simultaneous (separated by less than 80 microseconds) firing of both initiators failed to ignite the booster charge. The results of the assessment and associated test program were reported in AIAA Paper AIAA-2008-4798, NESC Independent Assessment of Pyrovalve Ground Test Anomalies. As a result of the four Al PCA anomalies, and the test results and findings of the NESC assessment, the Mars Science Laboratory (MSL) project team decided to make changes to the PCA. The material for the PCA body was changed from aluminum (Al) to stainless steel (SS) to avoid melting, distortion, and potential leakage of the NSI flow passages when the device functioned. The flow passages, which were interconnected in a Y-shaped configuration (Y-PCA) in the original design, were changed to a V-shaped configuration (V-PCA). The V-shape was used to more efficiently transfer energy from the NSIs to the booster. Development and qualification testing of the new design clearly demonstrated faster booster ignition times compared to the legacy AL Y-PCA design. However, the final NESC assessment report recommended that the SS V-PCA be experimentally characterized and quantitatively compared to the Al Y-PCA design. This data was deemed important for properly evaluating the design options for future NASA projects. This test program has successfully quantified the improvement of the SS V-PCA over the Al Y-PCA. A phase B of the project was also conducted and evaluated the effect of firing command skew and enlargement of flame channels to further assist spacecraft applications.

Saulsberry, Regor L.↗
NASA NTRS2014

SpaceCube v2.0 Space Flight Hybrid Reconfigurable Data Processing System

This paper details the design architecture, design methodology, and the advantages of the SpaceCube v2.0 high performance data processing system for space applications. The purpose in building the SpaceCube v2.0 system is to create a superior high performance, reconfigurable, hybrid data processing system that can be used in a multitude of applications including those that require a radiation hardened and reliable solution. The SpaceCube v2.0 system leverages seven years of board design, avionics systems design, and space flight application experiences. This paper shows how SpaceCube v2.0 solves the increasing computing demands of space data processing applications that cannot be attained with a standalone processor approach.The main objective during the design stage is to find a good system balance between power, size, reliability, cost, and data processing capability. These design variables directly impact each other, and it is important to understand how to achieve a suitable balance. This paper will detail how these critical design factors were managed including the construction of an Engineering Model for an experiment on the International Space Station to test out design concepts. We will describe the designs for the processor card, power card, backplane, and a mission unique interface card. The mechanical design for the box will also be detailed since it is critical in meeting the stringent thermal and structural requirements imposed by the processing system. In addition, the mechanical design uses advanced thermal conduction techniques to solve the internal thermal challenges.The SpaceCube v2.0 processing system is based on an extended version of the 3U cPCI standard form factor where each card is 190mm x 100mm in size The typical power draw of the processor card is 8 to 10W and scales with application complexity. The SpaceCube v2.0 data processing card features two Xilinx Virtex-5 QV Field Programmable Gate Arrays (FPGA), eight memory modules, a monitor FPGA with analog monitoring, Ethernet, configurable interconnect to the Xilinx FPGAs including gigabit transceivers, and the necessary voltage regulation. The processor board uses a back-to-back design methodology for common parts that maximizes the board real estate available. This paper will show how to meet the IPC 6012B Class 3A standard with a 22-layer board that has two column grid array devices with 1.0mm pitch. All layout trades such as stack-up options, via selection, and FPGA signal breakout will be discussed with feature size results. The overall board design process will be discussed including parts selection, circuit design, proper signal termination, layout placement and route planning, signal integrity design and verification, and power integrity results. The radiation mitigation techniques will also be detailed including configuration scrubbing options, Xilinx circuit mitigation and FPGA functional monitoring, and memory protection.Finally, this paper will describe how this system is being used to solve the extreme challenges of a robotic satellite servicing mission where typical space-rated processors are not sufficient enough to meet the intensive data processing requirements. The SpaceCube v2.0 is the main payload control computer and is required to control critical subsystems such as autonomous rendezvous and docking using a suite of vision sensors and object avoidance when controlling two robotic arms.

Xilinx FPGA↗
NASA NTRS2006

Evaluation of Open Cell Foam Heat Transfer Enhancement for Liquid Rocket Engine

As NASA pursues the exploration mission, advanced propulsion for the next generation of spacecraft will be needed. These new propulsion systems will require higher performance and increased durability, despite current limitations on materials. A break-through technology is needed in the thrust chamber. In this paper the idea of using a porous metallic foam is examined for its potential cooling enhancement capabilities. The goal is to increase the chamber wall cooling without creating an additional pressure drop penalty. A feasibility study based on experiments at laboratory-scale conditions was performed and analysis at rocket conditions is underway. In the experiment, heat transfer and pressure drop data were collected using air as the coolant in a copper or nickel foam filled annular channel. The foam-channel performance was evaluated based on comparison with conventional microchannel cooling passages under equal pressure drop conditions. The heat transfer enhancement of the foam channel over the microchannel ranges from 130% to 172%. The enhancement is relatively independent of the pressure drop and increases with decreasing pore size. A direct numerical simulation model of the foam heat exchange has been built. The model is based on the actual metal foam microstructure of thin ligaments (0.2- 0.3 mm in diameter) that form a network of interconnected open-cells. The cell dimension is around 2 mm. The numerical model was built using the FLUENT CFD code. Comparison of the pressure drop results predicted by the current model with those experimental data of Leong and Jin [8] shows favorable comparisons. Pressure drop predictions have been made using hydrogen as a coolant at typical rocket conditions. Conjugate heat transfer analysis using the foam filled channel is planned for the future.

Chung, J. N.↗
NASA NTRS2017

Axiomatic Design of Space Life Support Systems

Systems engineering is an organized way to design and develop systems, but the initial system design concepts are usually seen as the products of unexplained but highly creative intuition. Axiomatic design is a mathematical approach to produce and compare system architectures. The two axioms are:- Maintain the independence of the functional requirements.- Minimize the information content (or complexity) of the design. The first axiom generates good system design structures and the second axiom ranks them. The closed system human life support architecture now implemented in the International Space Station has been essentially unchanged for fifty years. In contrast, brief missions such as Apollo and Shuttle have used open loop life support. As mission length increases, greater system closure and increased recycling become more cost-effective.Closure can be gradually increased, first recycling humidity condensate, then hygiene wastewater, urine, carbon dioxide, and water recovery brine. A long term space station or planetary base could implement nearly full closure, including food production. Dynamic systems theory supports the axioms by showing that fewer requirements, fewer subsystems, and fewer interconnections all increase system stability. If systems are too complex and interconnected, reliability is reduced and operations and maintenance become more difficult. Using axiomatic design shows how the mission duration and other requirements determine the best life support system design including the degree of closure.

Axiomatic design↗
NASA NTRS2007

Toward a III-V Multijunction Space Cell Technology on Si

High efficiency compound semiconductor solar cells grown on Si substrates are of growing interest in the photovoltaics community for both terrestrial and space applications. As a potential substrate for III-V compound photovoltaics, Si has many advantages over traditional Ge and GaAs substrates that include higher thermal conductivity, lower weight, lower material costs, and the potential to leverage the extensive manufacturing base of the Si industry. Such a technology that would retain high solar conversion efficiency at reduced weight and cost would result in space solar cells that simultaneously possess high specific power (W/kg) and high power density (W/m2). For terrestrial solar cells this would result in high efficiency III-V concentrators with improved thermal conductivity, reduced cost, and via the use of SiGe graded interlayers as active component layers the possibility of integrating low bandgap sub-cells that could provide for extremely high conversion efficiency.1 In addition to photovoltaics, there has been an historical interest in III-V/Si integration to provide optical interconnects in Si electronics, which has become of even greater relevance recently due to impending bottlenecks in CMOS based circuitry. As a result, numerous strategies to integrate GaAs with Si have been explored with the primary issue being the approx.4% lattice mismatch between GaAs and Si. Among these efforts, relaxed, compositionally-graded SiGe buffer layers where the substrate lattice constant is effectively tuned from Si to that of Ge so that a close lattice match to subsequent GaAs overlayers have shown great promise. With this approach, threading dislocation densities (TDDs) of approx.1 x 10(exp 6)/sq cm have been uniformly achieved in relaxed Ge layers on Si,5 leading to GaAs on Si with minority carrier lifetimes greater than 10 ns,6 GaAs single junction solar cells on Si with efficiencies greater than 18%,7 InGaAs CW laser diodes on Si,8 and room temperature GaInP red laser diodes on Si.9 Here we report on the first high performance dual junction GaInP/GaAs solar cells grown on Si using this promising SiGe engineered substrate approach.

Ringel, S. A.↗
NASA NTRS2011

Optimization of Indium Bump Morphology for Improved Flip Chip Devices

Flip-chip hybridization, also known as bump bonding, is a packaging technique for microelectronic devices that directly connects an active element or detector to a substrate readout face-to-face, eliminating the need for wire bonding. In order to make conductive links between the two parts, a solder material is used between the bond pads on each side. Solder bumps, composed of indium metal, are typically deposited by thermal evaporation onto the active regions of the device and substrate. While indium bump technology has been a part of the electronic interconnect process field for many years and has been extensively employed in the infrared imager industry, obtaining a reliable, high-yield process for high-density patterns of bumps can be quite difficult. Under the right conditions, a moderate hydrogen plasma exposure can raise the temperature of the indium bump to the point where it can flow. This flow can result in a desirable shape where indium will efficiently wet the metal contact pad to provide good electrical contact to the underlying readout or imager circuit. However, it is extremely important to carefully control this process as the intensity of the hydrogen plasma treatment dramatically affects the indium bump morphology. To ensure the fine-tuning of this reflow process, it is necessary to have realtime feedback on the status of the bumps. With an appropriately placed viewport in a plasma chamber, one can image a small field (a square of approximately 5 millimeters on each side) of the bumps (10-20 microns in size) during the hydrogen plasma reflow process. By monitoring the shape of the bumps in real time using a video camera mounted to a telescoping 12 magnifying zoom lens and associated optical elements, an engineer can precisely determine when the reflow of the bumps has occurred, and can shut off the plasma before evaporation or de-wetting takes place.

Jones, Todd J.↗
NASA NTRS2003

NASA Tech Briefs, January 2003

Topics covered include: Optoelectronic Tool Adds Scale Marks to Photographic Images; Compact Interconnection Networks Based on Quantum Dots; Laterally Coupled Quantum-Dot Distributed-Feedback Lasers; Bit-Serial Adder Based on Quantum Dots; Stabilized Fiber-Optic Distribution of Reference Frequency; Delay/Doppler-Mapping GPS-Reflection Remote-Sensing System; Ladar System Identifies Obstacles Partly Hidden by Grass; Survivable Failure Data Recorders for Spacecraft; Fiber-Optic Ammonia Sensors; Silicon Membrane Mirrors with Electrostatic Shape Actuators; Nanoscale Hot-Wire Probes for Boundary-Layer Flows; Theodolite with CCD Camera for Safe Measurement of Laser-Beam Pointing; Efficient Coupling of Lasers to Telescopes with Obscuration; Aligning Three Off-Axis Mirrors with Help of a DOE; Calibrating Laser Gas Measurements by Use of Natural CO2; Laser Ranging Simulation Program; Micro-Ball-Lens Optical Switch Driven by SMA Actuator; Evaluation of Charge Storage and Decay in Spacecraft Insulators; Alkaline Capacitors Based on Nitride Nanoparticles; Low-EC-Content Electrolytes for Low-Temperature Li-Ion Cells; Software for a GPS-Reflection Remote-Sensing System; Software for Building Models of 3D Objects via the Internet; "Virtual Cockpit Window" for a Windowless Aerospacecraft; CLARAty Functional-Layer Software; Java Library for Input and Output of Image Data and Metadata; Software for Estimating Costs of Testing Rocket Engines; Energy-Absorbing, Lightweight Wheels; Viscoelastic Vibration Dampers for Turbomachine Blades; Soft Landing of Spacecraft on Energy-Absorbing Self-Deployable Cushions; Pneumatically Actuated Miniature Peristaltic Vacuum Pumps; Miniature Gas-Turbine Power Generator; Pressure-Sensor Assembly Technique; Wafer-Level Membrane-Transfer Process for Fabricating MEMS; A Reactive-Ion Etch for Patterning Piezoelectric Thin Film; Wavelet-Based Real-Time Diagnosis of Complex Systems; Quantum Search in Hilbert Space; Analytic Method for Computing Instrument Pointing Jitter; and Semiselective Optoelectronic Sensors for Monitoring Microbes.

Source record↗
NASA NTRS2018

The Way to the Future Has Already Started: ICAO Aeronautical Telecommunication Network (ATN) Using Internet Protocol Suite (IPS) Standards and Protocol Evolution Update

Millions of people are able to exchange information over phones, computers, tablets and an array of new interconnected devices such as sensors, cameras, home appliances and others are increasingly becoming networked. At the core of this sizeable interconnection is a set of underlying protocols that enable millions of devices to seamlessly talk to each other. Aviation, as many other industries have, utilizes the internet protocol for ground-to-ground network communications and efforts are underway to bring it to the cockpit.In 2015, the International Civil Aviation Organization (ICAO) published the second edition of Document 9896 (Doc 9896) titled: Manual on the Aeronautical Telecommunication Network (ATN) using Internet Protocol Suite (IPS) Standards and Protocol. This manual adopted the Internet protocol version 6 (IPv6) for Internet layer interoperability. Document 9896 defined data communications protocols and services to be used for implementing aeronautical telecommunication network (ATN) using the Internet protocol suite (IPS). The document provided technical specifications that addressed security, network and transport protocols, described applications, supported by ATN/IPS and provided communications guidance. The international aviation community working under the guidance of ICAO initiated work on updates to Doc 9896. Under the ICAO Communication Panel, Working Group Internetworking (WG-I) got this challenging task. Key areas of work for WG-I are related to ATN/IPS Security and ANT/IPS Mobility. Two sub-groups have been assembled to work on these elements. The ICAO anticipates the release of updated Doc 9896 in 2020. Additional ATN/IPS standardization efforts include Radio Technical Commission for Aeronautics Special Committee 223 (RTCA SC-223) IPS profile development, Airlines Electronic Engineering Committee (AEEC) A658 Roadmap of IPS future activities and European Organization for Civil Aviation Equipment (EUROCAE) WG-108 development of guidance documentation.This paper describes ICAO WG-I approach to update key areas of the document in closed coordination with AEEC, RTCA and EUROCAE committees supporting the development of ATN/IPS. Additionally, the paper will explore WG-I mobility solutions under investigation, security developments, IPv6 addressing challenges and other proposed updates. Finally, as new operational expectations such as Free Route and Remote Piloted Aircraft System integration are currently pushing the boundaries set by old operational concepts, the paper identifies the emerging new challenges that will drive the ATN/IPS development beyond 2020. They are related to future voice utilization, System Wide Information Management and Remotely Piloted Aircraft System deployment. IPS systems are seen as the only way forward.

Apaza, Rafael↗
NASA NTRSDate not supplied

Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated Circuits

A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/- 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.

DC Powered Oven↗