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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9

Design of a flight qualified long-life cryocooler

A second generation Stirling cycle cryogenic refrigerator with a linear drive, magnetic bearings, and clearance seals; designed to produce 5 watts of cooling at 65 Kelvin and to meet Space Shuttle mission requirements is described. The first generation refrigerator met all performance specifications, and operated with no failure for over 12,030 hours. Meeting launch requirements necessitated improvements in the electromagnetic bearings, the radial position sensors, and in the structural design of the moving elements. Organic contamination was eliminated by the use of all metal and ceramic construction. Reductions in system input power are attained by an integral magnetic spring/motor for the displacer and by more efficient linear motors and drive electronics.

Knox, L.↗

Associative Pattern Recognition In Analog VLSI Circuits

Winner-take-all circuit selects best-match stored pattern. Prototype cascadable very-large-scale integrated (VLSI) circuit chips built and tested to demonstrate concept of electronic associative pattern recognition. Based on low-power, sub-threshold analog complementary oxide/semiconductor (CMOS) VLSI circuitry, each chip can store 128 sets (vectors) of 16 analog values (vector components), vectors representing known patterns as diverse as spectra, histograms, graphs, or brightnesses of pixels in images. Chips exploit parallel nature of vector quantization architecture to implement highly parallel processing in relatively simple computational cells. Through collective action, cells classify input pattern in fraction of microsecond while consuming power of few microwatts.

Tawel, Raoul↗

NASA Tech Briefs, November 1995

The contents include: 1) Mission Accomplished; 2) Resource Report: Marshall Space Flight Center; 3) NASA 1995 Software of the Year Award; 4) Microbolometers Based on Epitaxial YBa2Cu3O(sub 7-x) Thin Films; 5) Garnet Random-Access Memory; 6) Fabrication of SNS Weak Links on SOS Substrates; 7) High-Voltage MOSFET Switching Circuit; 8) Asymmetric Switching for a PWM H-Bridge Power Circuit; 9) Better Ohmic Contacts for InP Semiconductor Devices; 10) Low-Bandgap Thermovoltaic Materials and Devices; 11) Digital Frequency-Differencing Circuit; 12) Imaging Magnetometer; 13) Computer-Assisted Monitoring of a Complex System; 14) Buffered Telemetry Demodulator; 15) Compact Multifunction Inspection Head; 16) Optical Detection of Fractures in Ceramic Diaphragms; 17) Eddy-Current Detection of Cracks in Reinforced Carbon/Carbon; 18) Apparent Thermal Conductivity of Multilayer Insulation; 19) Optimizing Misch-Metal Compositions in Metal Hydride Anodes; 20) Device for Sampling Surface Contamination; 21) Probabilistic Failure Assessment for Fatigue; 22) Probabilistic Fatigue and Flaw-Propagation Analysis; 23) Windows Program for Driving the TDU-850 Printer; 24) Subband/Transform MATLAB Functions for Processing Images; 25) Computing Equilibrium Chemical Compositions; 26) Program Processes Thermocouple Readings; 27) ICAN-Second-Generation Integrated Composite Analyzer; 28) Integrated Composite Analyzer with Damping Capabilities; 29) Computing Efficiency of Transfer of Microwave Power; 30) Program Calculates Power Demands of Electronic Designs; 31) Cost-Estimation Program; 32) Program Estimates Areas Required by Electronic Designs; 33) Program to Balance Mapped Turbopump Assemblies; 34) BiblioTech; 35) Controlling Mirror Tilt With a Bimorph Actuator; 36) Burst-Disk Device Simulates Effect of Pyrotechnic Device; 37) Bearing-Mounting Concept Accommodates Thermal Expansion; 38) Parallel-Plate Acoustic Absorbers for Hot Environments; 39) Adjustable-Length Strut Withstands Large Cyclic Loads; 40) Tool Indicates Contact Angles in Bearing Raceways; 41) Gravity Slides With Magnetic Braking; 42) High-Torque, Lightweight, Pneumatically Driven Wrench for Small Spaces; 43) Device for Testing Compatibility of an O-Ring; 44) Magnetic Heat Pump Containing Flow Diverters; 45) Variable-Tilt Helicopter Rotor Mast; 46) "Beach-Ball" Robotic Rovers; 47) Apparatus Would Measure Temperatures of Ball Bearings; 48) Flexible Borescope for Inspecting Ducts; 49) Texturing Copper To Reduce Secondary Emission of Electrons; 50) Automated Laser Cutting in Three Dimensions; 51) Algorithm Helps Monitor Engine Operation; 52) Flexible Revision of Data-Processing Communications; 53) Software for Managing the Use of Land; 54) Thermal Strap Increases Cryocooling Efficiency; 55) Reversible Nut With Engagement Indication; 56) Control Algorithms for Kinematically Redundant Manipulators; 57) Computed Hydrogen-Flow Splits in a Rocket Engine; 58) Pressure and Thermal Modeling of Rocket Launches; 59) Field of View of a Spacecraft Antenna: Analysis and Software; 60) Digital Controller for Laser-Beam-Steering Subsystem; 61) More About Beam-Steering Subsystem for Laser Communication; 62) Digital Controller for Laser-Beam-Steering Subsystem: Part 2; 63) Interface Circuit Board for Space-Shuttle Communications; 64) Automated Planning of Spacecraft Telecommunications; 65) Artifacts of Spectral Analysis of Instrument Readings; 66) Neural-Network Controller for Vibration Suppression; 67) Adaptive Finite-Element Computation in Fracture Mechanics; 68) Attitude Control for the Cassini Spacecraft; 69) Analytical Model for Fluid Dynamics in a Microgravity Environment; 70) Study of Rocket-Engine Joints Bonded by NVCU/NARloy-Z; 71) Improved Silicon Nitride for Advanced Heat Engines; 72) Parameters for Welding Aluminum/Lithium Alloys; 73) Lightweight Composite Intertank Structure; 74) Foil Patches Seal Small Vacuum Leaks; 75) Data Base on Cables and Connectors; 76) Effect of Clock Mode on Radiation Hardnessf an ADC; and 77) Fault-Tolerant Control for a Robotic Inspection System.

Source record↗

Convergent Aeronautics Solutions (CAS) High Voltage Hybrid Electric Propulsion (HVHEP) Activity

Overview of Convergent Aeronautics Solutions (CAS) High Voltage Hybrid Electric Propulsion (HVHEP) activity. CAS HVHEP activity demonstrated feasibility of variable frequency, variable high voltage power system using doubly fed electric machines (DFM), and provided 90% reduction in power electronic weight for 35 megawatt system. DFM enables multi-phase (9) ac operation, with enhanced control and integrated protection methods for improved safety through minimization of fault energy.

CAS↗

Assessment of SOI Devices and Circuits at Extreme Temperatures

Electronics designed for use in future NASA space exploration missions are expected to encounter extreme temperatures and wide thermal swings. Such missions include planetary surface exploration, bases, rovers, landers, orbiters, and satellites. Electronics designed for such applications must, therefore, be able to withstand exposure to extreme temperatures and to perform properly for the duration of mission. The Low Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electrical devices, circuits, and systems suitable for applications in deep space exploration missions and aerospace environment. Silicon-On-Insulator (SOI) technology has been under active consideration in the electronics industry for many years due to the advantages that it can provide in integrated circuit (IC) chips and computer processors. Faster switching, less power, radiationtolerance, reduced leakage, and high temp-erature capability are some of the benefits that are offered by using SOI-based devices. A few SOI circuits are available commercially. However, there is a noticeable interest in SOI technology for different applications. Very little data, however, exist on the performance of such circuits under cryogenic temperatures. In this work, the performance of SOI integrated circuits, evaluated under low temperature and thermal cycling, are reported. In particular, three examples of SOI circuits that have been tested for operation at low at temperatures are given. These circuits are SOI operational amplifiers, timers and power MOSFET drivers. The investigations were carried out to establish a baseline on the functionality and to determine suitability of these circuits for use in space exploration missions at cryogenic temperatures. The findings are useful to mission planners and circuit designers so that proper selection of electronic parts can be made, and risk assessment can be established for such circuits for use in space missions.

Elbuluk, Malik↗

Power Distribution for Cryogenic Instruments at 6-40K The James Webb Space Telescope Case

The Integrated Science Instrument Module (ISIM) of the James Webb Space Telescope (JWST) operates its instruments passively cooled at around 40 Kelvin (K), with a warm Instrument Electronic Compartment (IEC) at 300K attached to it. From the warm electronics all secondary signal and power harnesses have to bridge this 300-40K temperature difference and minimize the power dissipation and parasitic heat leak into the cold region. After an introduction of the ISIM with its instruments, the IEC with the electronics, and the harness architecture with a special radiator, this paper elaborates on the cryogenic wire selection and tests performed to establish current de-rating rules for different wire types. Finally failure modes are analyzed for critical instrument interfaces that could inject excessive currents and heat into the harness and cold side, and several solutions for the removal of such failures are presented.

Rumler, Peter↗

Piezoresistive stress sensors on (110) silicon wafers

Structural reliability of electronic packages has become an increasing concern for a variety of reasons including the advent of higher integrated circuit densities, power density levels, and operating temperatures. A powerful method for experimental evaluation of die stress distributions is the use of test chips incorporating integral piezoresistive sensors. In this paper, the basic equations needed for the design of stress sensors fabricated on the surface of (110) oriented silicon wafers have been presented. Several sensor rosette configurations have been explored, including the familiar three-element 0-45-90 rosette. Rosette designs have been found which minimize the necessary calibration procedures and permit more stress components to be measured. It has been established that stress sensors on the surface of (110) test chips are sensitive to four out of the six stress components at a point.

Kang, Y. L.↗

Power-Amplifier Module for 145 to 165 GHz

A power-amplifier module that operates in the frequency range of 145 to 165 GHz has been designed and constructed as a combination of (1) a previously developed monolithic microwave integrated circuit (MMIC) power amplifier and (2) a waveguide module. The amplifier chip was needed for driving a high-electron-mobility-transistor (HEMT) frequency doubler. While it was feasible to connect the amplifier and frequency-doubler chips by use of wire bonds, it was found to be much more convenient to test the amplifier and doubler chips separately. To facilitate separate testing, it was decided to package the amplifier and doubler chips in separate waveguide modules. Figure 1 shows the resulting amplifier module. The amplifier chip was described in "MMIC HEMT Power Amplifier for 140 to 170 GHz" (NPO-30127), NASA Tech Briefs, Vol. 27, No. 11, (November 2003), page 49. To recapitulate: This is a three-stage MMIC power amplifier that utilizes HEMTs as gain elements. The amplifier was originally designed to operate in the frequency range of 140 to 170 GHz. The waveguide module is based on a previously developed lower frequency module, redesigned to support operation in the frequency range of 140 to 220 GHz. Figure 2 presents results of one of several tests of the amplifier module - measurements of output power and gain as functions of input power at an output frequency of 150 GHz. Such an amplifier module has many applications to test equipment for power sources above 100 GHz.

Samoska, Lorene↗

A Design of a Modular GPHS-Stirling Power System for a Lunar Habitation Module

Lunar habitation modules need electricity and potentially heat to operate. Because of the low amounts of radiation emitted by General Purpose Heat Source (GPHS) modules, power plants incorporating these as heat sources could be placed in close proximity to habitation modules. A design concept is discussed for a high efficiency power plant based on a GPHS assembly integrated with a Stirling convertor. This system could provide both electrical power and heat, if required, for a lunar habitation module. The conceptual GPHS/Stirling system is modular in nature and made up of a basic 5.5 KWe Stirling convertor/GPHS module assembly, convertor controller/PMAD electronics, waste heat radiators, and associated thermal insulation. For the specific lunar application under investigation eight modules are employed to deliver 40 KWe to the habitation module. This design looks at three levels of Stirling convertor technology and addresses the issues of integrating the Stirling convertors with the GPHS heat sources assembly using proven technology whenever possible. In addition, issues related to the high-temperature heat transport system, power management, convertor control, vibration isolation, and potential system packaging configurations to ensure safe operation during all phases of deployment will be discussed.

Schmitz, Paul C.↗

Modular Pulsed Plasma Electric Propulsion System for Cubesats

Current capabilities of CubeSats must be improved in order to perform more ambitious missions. Electric propulsion systems will play a key role due to their large specific impulse. Compared to other propulsion alternatives, their simplicity allows an easier miniaturization and manufacturing of autonomous modules into the nano and pico-satellite platform. Pulsed Plasma Thrusters (PPTs) appear as one of the most promising technologies for the near term. The utilization of solid and non-volatile propellants, their low power requirements and their proven reliability in the large scale make them great candidates for rapid implementation. The main challenges are the integration and miniaturization of all the electronic circuitry into a printed circuit board (PCB) that can satisfy the strict requirements that CubeSats present. NASA Ames and the George Washington University have demonstrated functionality and control of three discrete Micro-Cathode Arc Thrusters (CAT) using a bench top configuration that was compatible with the ARC PhoneSat Bus. This demonstration was successfully conducted in a vaccum chamber at the ARC Environmental Test Laboratory. A new effort will integrate a low power Plasma Processing Unit and two plasma thrusters onto a single printed circuit board that will utilize less than 13 U of Bus volume. The target design will be optimized for the accommodation into the PhoneSatEDISON Demonstration of SmallSatellite Networks (EDSN) bus as it uses the same software interface application, which was demonstrated in the previous task. This paper describes the design, integration and architecture of the proposed propulsion subsystem for a planned Technology Demonstration Mission. In addition, a general review of the Pulsed Plasma technology available for CubeSats is presented in order to assess the necessary challenges to overcome further development.

PCB↗

A simple method for computing the relativistic Compton scattering kernel for radiative transfer

Correct computation of the Compton scattering kernel (CSK), defined to be the Klein-Nishina differential cross section averaged over a relativistic Maxwellian electron distribution, is reported. The CSK is analytically reduced to a single integral, which can then be rapidly evaluated using a power series expansion, asymptotic series, and rational approximation for sigma(s). The CSK calculation has application to production codes that aim at understanding certain astrophysical, laser fusion, and nuclear weapons effects phenomena.

Prasad, M. K.↗

A Perspective on Multi-Source Energy Harvesting Technology Using Piezoelectric and Thermoelectric Materials

Energy harvesting using various locally available energy sources such as vibration energy, heat, sound, or magnetic field have become attractive topics for supplying power to modular electronic devices making them run independently in extreme environments. In this paper, we will be discussing the perspectives on thermoelectric (TE) and piezoelectric materials and devices, and then the concept of multi-source energy harvester using piezoelectric and thermoelectric devices and integration of them into a reliable and independent power source. TE materials having low thermal conductivity and high figure-of-merit ( zT ) are developed to convert even a small temperature gradient efficiently into electrical energy with the state-of-the-art conversion efficiency of ~15% and output power of ~56 W from single device. The piezoelectric device architecture is configured using high performance piezoelectric ceramics (Cu-Mn-PIN-PMN-PT). These ceramics exhibit high piezoelectric coefficient with high mechanical quality factor and low dielectric loss factor. Using these piezoelectric materials, power density as high a 2 mW/cm 2 is demonstrated in 1-1.5 g vibration environments. The piezoelectric device is attached on the surface of TE module to capture both the vibration and thermal energy sources to realize dual mode energy harvester. The multi-energy transfer strategy opens opportunities for a future generation of wireless and modular electronic devices. These devices would be useful in powering wearable electronic devices, micro sensor chargers, etc. in extreme environmental conditions using body heat/thermal sources and induced motion/vibrations.

Piezoelectric↗

Solar wind halo electrons from 1-4 AU

Observations from the Ulysses solar wind electron spectrometer are used to make a first examination of the evolution of the solar wind suprathermal or halo electron population as a function of heliocentric distance beyond 1 AU. As the core population cools with increasing heliocentric distance, no gap is formed between the core and halo populations. Rather, the halo electrons extend to increasingly lower energies. As predicted previously on theoretical grounds, the ratio of the core electron temperature to the low energy cutoff of the halo population appears to be roughly constant with a value of about 7.5. The total integrated heat flux drops rapidly with increasing heliocentric distance; a best fit power law of R exp -2.36 is found. In addition, it is found that the ratio of the halo to core densities is roughly constant over heliocentric distance with the halo representing 4 percent of the total electron distribution. These results suggest that the halo population may not consist of truly noninteractive test particles over the heliocentric range of 1-4 AU.

Mccomas, D. J.↗

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.

High Temperature, Packaging, Alumina, Thick Film↗

Development of a Portable Oxygen Monitoring System for Operations in the International Space Station Airlock

NASA is currently engaged in an activity to facilitate effective operations on the International Space Station (ISS) after the Space Shuttle retires. Currently, the Space Shuttle delivers crew and cargo to and from ISS. The Space Shuttle provides the only large scale method of hardware return from ISS to the ground. Hardware that needs to be periodically repaired, refurbished, or recalibrated must come back from ISS on the Shuttle. One example of NASA flight hardware that is used on ISS and refurbished on the ground is the Compound Specific Analyzer for Oxygen (CSA-O2). The CSA-O2 is an electrochemical sensor that is used on orbit for about 12 months (depending on Shuttle launch schedules), then returned to the ground for sensor replacement. The shuttle is scheduled to retire in 2010, and the ISS is scheduled to operate until 2016. NASA needs a hand held sensor that measures oxygen in the ISS environment and has a 5-10 year service life. After conducting a survey of oxygen sensor systems, NASA selected a Tunable Diode Laser Absorption Spectrometer (TDLAS) as the method of measurement that best addresses the needs for ISS. These systems are compact, meet ISS accuracy requirements, and because they use spectroscopic techniques, the sensors are not consumed or altered after making a measurement. TDLAS systems have service life ratings of 5-10 years, based on the lifetime of the laser. NASA is engaged in modifying a commercially available sensor, the Vaisala OMT 355, for the ISS application. The Vaisala OMT 355 requires three significant modifications to meet ISS needs. The commercial sensor uses a wall mount power supply, and the ISS sensor needs to use a rechargeable battery as its source of power. The commercial sensor has a pressure correction setpoint: the sensor can be adjusted to operate at reduced pressure conditions, but the sensor does not self correct dynamically and automatically. The ISS sensor needs to operate in the airlock, and make accurate measurements in an environment that can change from 14.7 psia to 10.2 psia in 15 minutes. The commercial sensor needs to be repackaged into a configuration that is more compact, and better suited for ISS airlock operations. NASA has recently completed a prototype of the reconfigured system. The unit has been repackaged in a way that the optical path of the spectrometer is unchanged, but the electronics has been integrated into a case measuring 10.7 X 7.2 X 3.0 inches. Two flight qualified rechargeable batteries have been integrated into system. The batteries can power the sensor for 10 hours on a single charge. A pressure sensor has been added to the system. The modified unit automatically compensates for changes in pressure, and meets 0.2% accuracy requirements for oxygen measurements in an environment with 18 to 32% oxygen across a pressure range of 10.0 to 15.0 psia.

Graf, John↗

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500oC are reviewed.

high temperature↗

Performance of a High-Fidelity 4kW-Class Engineering Model PPU and Integration with HiVHAc System

The High Voltage Hall Accelerator (HiVHAc) propulsion system consists of a thruster, power processing unit (PPU), and propellant feed system. An engineering model PPU was developed by Colorado Power Electronics, Inc. funded by NASA's Small Business Innovative Research Program. This PPU uses an innovative 3-phase resonant converter to deliver 4 kW of discharge power over a wide range of input and output voltage conditions. The PPU includes a digital control interface unit that automatically controls the PPU and a xenon flow control module (XFCM). It interfaces with a control computer to receive highlevel commands and relay telemetry through a MIL-STD-1553B interface. The EM PPU was thoroughly tested at GRC for functionality and performance at temperature limits and demonstrated total efficiencies a high as 95 percent. Integrated testing of the unit was performed with the HiVHAc thruster and the XFCM to demonstrate closed-loop control of discharge current with anode flow. Initiation of the main discharge and power throttling were also successfully demonstrated and discharge oscillations were characterized.

Power Processing Unit↗

Performance of a High-Fidelity 4kW-Class Engineering Model PPU and Integration with HiVHAc System

The High Voltage Hall Accelerator (HiVHAc) propulsion system consists of a thruster,power processing unit (PPU), and propellant feed system. An engineering model PPU was developed by Colorado Power Electronics, Inc. funded by NASA's Small Business Innovative Research Program. This PPU uses an innovative 3-phase resonant converter to deliver 4 kW of discharge power over a wide range of input and output voltage conditions.The PPU includes a digital control interface unit that automatically controls the PPU and a xenon flow control module (XFCM). It interfaces with a control computer to receive high level commands and relay telemetry through a MIL-STD-1553B interface. The EM PPU was thoroughly tested at GRC for functionality and performance at temperature extremes and demonstrated total efficiencies a high as 95 percent. It was integrated with the HiVHAc thruster and the XFCM to demonstrate closed-loop control of discharge current with anode flow. Initiation of the main discharge and power throttling were also successfully demonstrated and discharge oscillations were characterized.

Electric Propulsion↗