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At least 163 records · Page 9

Data Center Power Systems: Architectures, Impact on Grid Reliability, Modeling Considerations, and Megawatt-Scale Hardware Testing [Slides]

This slide deck describes typical power systems of large datacenters along with reliability problems to bulk power systems from large-scale integration of datacenters. The slide deck covers the architecture of datacenter power systems, different power electronic converters used inside datacenters, their operation modes, and R&Dopportunities in maintaining grid stability.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Towards A Model-Based Prognostics Methodology for Electrolytic Capacitors: A Case Study Based on Electrical Overstress Accelerated Aging

A remaining useful life prediction methodology for electrolytic capacitors is presented. This methodology is based on the Kalman filter framework and an empirical degradation model. Electrolytic capacitors are used in several applications ranging from power supplies on critical avionics equipment to power drivers for electro-mechanical actuators. These devices are known for their comparatively low reliability and given their criticality in electronics subsystems they are a good candidate for component level prognostics and health management. Prognostics provides a way to assess remaining useful life of a capacitor based on its current state of health and its anticipated future usage and operational conditions. We present here also, experimental results of an accelerated aging test under electrical stresses. The data obtained in this test form the basis for a remaining life prediction algorithm where a model of the degradation process is suggested. This preliminary remaining life prediction algorithm serves as a demonstration of how prognostics methodologies could be used for electrolytic capacitors. In addition, the use degradation progression data from accelerated aging, provides an avenue for validation of applications of the Kalman filter based prognostics methods typically used for remaining useful life predictions in other applications.

Celaya, Jose R.↗

A Model-based Prognostics Methodology for Electrolytic Capacitors Based on Electrical Overstress Accelerated Aging

A remaining useful life prediction methodology for electrolytic capacitors is presented. This methodology is based on the Kalman filter framework and an empirical degradation model. Electrolytic capacitors are used in several applications ranging from power supplies on critical avionics equipment to power drivers for electro-mechanical actuators. These devices are known for their comparatively low reliability and given their criticality in electronics subsystems they are a good candidate for component level prognostics and health management. Prognostics provides a way to assess remaining useful life of a capacitor based on its current state of health and its anticipated future usage and operational conditions. We present here also, experimental results of an accelerated aging test under electrical stresses. The data obtained in this test form the basis for a remaining life prediction algorithm where a model of the degradation process is suggested. This preliminary remaining life prediction algorithm serves as a demonstration of how prognostics methodologies could be used for electrolytic capacitors. In addition, the use degradation progression data from accelerated aging, provides an avenue for validation of applications of the Kalman filter based prognostics methods typically used for remaining useful life predictions in other applications.

Electrolytic capacitors↗

T-shaped emitter metal heterojunction bipolar transistors for submillimeter wave applications

We report on the development of submillimeter wave transistors at JPL. The goal of the effort is to produce advance-reliable high frequency and high power amplifiers, voltage controlled oscillators, active multipliers, and high-speed mixed-signal circuits for space borne applications. The technology in development to achieve this is based on the Indium Phosphide (InP) Heterojunction Bipolar Transistor (HBT). The HBT is well suited for high speed, high power and uniform (across wafer) performance, due to the ability to tailor the material structure that electrons traverse through by well-controlled epitaxial growth methods. InP with its compatible lattice matched alloys such as indium gallium arsenide (InGaAs) and indium aluminium arsenide (InAlAs) provides for high electron velocities and high voltage breakdown capabilities. The epitaxial methods for this material system are fairly mature, however the implementation of high performance and reliable transistors are still under development by many laboratories. Our most recently fabricated, second generation mesa HBTs at JPL have extrapolated current gain cutoff frequency (FJ of 142GHz and power gain cutoff frequency (Fm,) of approximately 160GHz. This represents a 13% and 33% improvement of Ft and F, respectively, compared to the first generation mesa HBTs [l]. Analysis based on the University of California, Santa Barbara (UCSB) device model, RF device characteristics can be significantly improved by reducing base contact resistance and base metal contact width. We will describe our effort towards increasing transistor performance and yield.

transistor↗

Network Security Challenges and Countermeasures for Software-Defined Smart Grids: A Survey

The rise of grid modernization has been prompted by the escalating demand for power, the deteriorating state of infrastructure, and the growing concern regarding the reliability of electric utilities. The smart grid encompasses recent advancements in electronics, technology, telecommunications, and computer capabilities. Smart grid telecommunication frameworks provide bidirectional communication to facilitate grid operations. Software-defined networking (SDN) is a proposed approach for monitoring and regulating telecommunication networks, which allows for enhanced visibility, control, and security in smart grid systems. Nevertheless, the integration of telecommunications infrastructure exposes smart grid networks to potential cyberattacks. Unauthorized individuals may exploit unauthorized access to intercept communications, introduce fabricated data into system measurements, overwhelm communication channels with false data packets, or attack centralized controllers to disable network control. An ongoing, thorough examination of cyber attacks and protection strategies for smart grid networks is essential due to the ever-changing nature of these threats. Previous surveys on smart grid security lack modern methodologies and, to the best of our knowledge, most, if not all, focus on only one sort of attack or protection. This survey examines the most recent security techniques, simultaneous multi-pronged cyber attacks, and defense utilities in order to address the challenges of future SDN smart grid research. The objective is to identify future research requirements, describe the existing security challenges, and highlight emerging threats and their potential impact on the deployment of software-defined smart grid (SD-SG).

24 POWER TRANSMISSION AND DISTRIBUTION↗

A Perspective on Multi-Source Energy Harvesting Technology Using Piezoelectric and Thermoelectric Materials

Energy harvesting using various locally available energy sources such as vibration energy, heat, sound, or magnetic field have become attractive topics for supplying power to modular electronic devices making them run independently in extreme environments. In this paper, we will be discussing the perspectives on thermoelectric (TE) and piezoelectric materials and devices, and then the concept of multi-source energy harvester using piezoelectric and thermoelectric devices and integration of them into a reliable and independent power source. TE materials having low thermal conductivity and high figure-of-merit ( zT ) are developed to convert even a small temperature gradient efficiently into electrical energy with the state-of-the-art conversion efficiency of ~15% and output power of ~56 W from single device. The piezoelectric device architecture is configured using high performance piezoelectric ceramics (Cu-Mn-PIN-PMN-PT). These ceramics exhibit high piezoelectric coefficient with high mechanical quality factor and low dielectric loss factor. Using these piezoelectric materials, power density as high a 2 mW/cm 2 is demonstrated in 1-1.5 g vibration environments. The piezoelectric device is attached on the surface of TE module to capture both the vibration and thermal energy sources to realize dual mode energy harvester. The multi-energy transfer strategy opens opportunities for a future generation of wireless and modular electronic devices. These devices would be useful in powering wearable electronic devices, micro sensor chargers, etc. in extreme environmental conditions using body heat/thermal sources and induced motion/vibrations.

Piezoelectric↗

Advanced Signal Conditioners for Data-Acquisition Systems

Signal conditioners embodying advanced concepts in analog and digital electronic circuitry and software have been developed for use in data-acquisition systems that are required to be compact and lightweight, to utilize electric energy efficiently, and to operate with high reliability, high accuracy, and high power efficiency, without intervention by human technicians. These signal conditioners were originally intended for use aboard spacecraft. There are also numerous potential terrestrial uses - especially in the fields of aeronautics and medicine, wherein it is necessary to monitor critical functions. Going beyond the usual analog and digital signal-processing functions of prior signal conditioners, the new signal conditioner performs the following additional functions: It continuously diagnoses its own electronic circuitry, so that it can detect failures and repair itself (as described below) within seconds. It continuously calibrates itself on the basis of a highly accurate and stable voltage reference, so that it can continue to generate accurate measurement data, even under extreme environmental conditions. It repairs itself in the sense that it contains a micro-controller that reroutes signals among redundant components as needed to maintain the ability to perform accurate and stable measurements. It detects deterioration of components, predicts future failures, and/or detects imminent failures by means of a real-time analysis in which, among other things, data on its present state are continuously compared with locally stored historical data. It minimizes unnecessary consumption of electric energy. The design architecture divides the signal conditioner into three main sections: an analog signal section, a digital module, and a power-management section. The design of the analog signal section does not follow the traditional approach of ensuring reliability through total redundancy of hardware: Instead, following an approach called spare parts tool box, the reliability of each component is assessed in terms of such considerations as risks of damage, mean times between failures, and the effects of certain failures on the performance of the signal conditioner as a whole system. Then, fewer or more spares are assigned for each affected component, pursuant to the results of this analysis, in order to obtain the required degree of reliability of the signal conditioner as a whole system. The digital module comprises one or more processors and field-programmable gate arrays, the number of each depending on the results of the aforementioned analysis. The digital module provides redundant control, monitoring, and processing of several analog signals. It is designed to minimize unnecessary consumption of electric energy, including, when possible, going into a low-power "sleep" mode that is implemented in firmware. The digital module communicates with external equipment via a personal-computer serial port. The digital module monitors the "health" of the rest of the signal conditioner by processing defined measurements and/or trends. It automatically makes adjustments to respond to channel failures, compensate for effects of temperature, and maintain calibration.

Lucena, Angel↗

Piezoresistive stress sensors on (110) silicon wafers

Structural reliability of electronic packages has become an increasing concern for a variety of reasons including the advent of higher integrated circuit densities, power density levels, and operating temperatures. A powerful method for experimental evaluation of die stress distributions is the use of test chips incorporating integral piezoresistive sensors. In this paper, the basic equations needed for the design of stress sensors fabricated on the surface of (110) oriented silicon wafers have been presented. Several sensor rosette configurations have been explored, including the familiar three-element 0-45-90 rosette. Rosette designs have been found which minimize the necessary calibration procedures and permit more stress components to be measured. It has been established that stress sensors on the surface of (110) test chips are sensitive to four out of the six stress components at a point.

Kang, Y. L.↗

Rotating Unbalanced-Mass Devices for Scanning: Proof-of-Concept Test Results

This experiment proves the concept of line-of-sight scanning space-based and balloon-borne instruments and telescopes with rotating unbalanced-mss (RUM) devices. Extending the concept to free-flying spacecraft is straightforward. When line-of-sight scanning is required, but optical or electronic line-of-sight scanning is impossible, then scanning with RUM devices can offer huge power and mass savings, better system reliability and stability, and improved scan accuracy. This is especially true with large instruments and telescopes scanning at high frequencies.

Alhorn, Dean C.↗

Brushless Excitation for Wound-field Synchronous Machines using Multi-harmonic Windings

Wound-field synchronous machines (WFSM) are promising alternatives to electric machines with permanent magnets (PM). The ability to control the rotor field in these machines makes them well-suited to safety critical applications, while the absence of rare-earth permanent magnets makes these machines sustainable. The WFSM rotor excitation schemes have traditionally used carbon brushes, which significantly reduces the reliability of these machines, limiting their widespread adoption. To overcome this limitation and improve the reliability of WFSMs, several brushless rotor excitation schemes have been developed. However, most of these systems require additional windings or dedicated power electronics, making them expensive and limiting achievable power-density. In this paper a new brushless excitation scheme is proposed. In this scheme, a multiphase, multi-harmonic stator winding is designed. This winding can independently control two spatial harmonics in the airgap of the machine; the first to create torque and the second to wirelessly transfer power to the rotor to excite it.

Gadiyar, Nishanth [ORNL] (ORCID:0000000348267524)↗

Modular Pulsed Plasma Electric Propulsion System for Cubesats

Current capabilities of CubeSats must be improved in order to perform more ambitious missions. Electric propulsion systems will play a key role due to their large specific impulse. Compared to other propulsion alternatives, their simplicity allows an easier miniaturization and manufacturing of autonomous modules into the nano and pico-satellite platform. Pulsed Plasma Thrusters (PPTs) appear as one of the most promising technologies for the near term. The utilization of solid and non-volatile propellants, their low power requirements and their proven reliability in the large scale make them great candidates for rapid implementation. The main challenges are the integration and miniaturization of all the electronic circuitry into a printed circuit board (PCB) that can satisfy the strict requirements that CubeSats present. NASA Ames and the George Washington University have demonstrated functionality and control of three discrete Micro-Cathode Arc Thrusters (CAT) using a bench top configuration that was compatible with the ARC PhoneSat Bus. This demonstration was successfully conducted in a vaccum chamber at the ARC Environmental Test Laboratory. A new effort will integrate a low power Plasma Processing Unit and two plasma thrusters onto a single printed circuit board that will utilize less than 13 U of Bus volume. The target design will be optimized for the accommodation into the PhoneSatEDISON Demonstration of SmallSatellite Networks (EDSN) bus as it uses the same software interface application, which was demonstrated in the previous task. This paper describes the design, integration and architecture of the proposed propulsion subsystem for a planned Technology Demonstration Mission. In addition, a general review of the Pulsed Plasma technology available for CubeSats is presented in order to assess the necessary challenges to overcome further development.

PCB↗

Reliability Effects of Surge Current Testing of Solid Tantalum Capacitors

Solid tantalum capacitors are widely used in space applications to filter low-frequency ripple currents in power supply circuits and stabilize DC voltages in the system. Tantalum capacitors manufactured per military specifications (MIL-PRF-55365) are established reliability components and have less than 0.001% of failures per 1000 hours (the failure rate is less than 10 FIT) for grades D or S, thus positioning these parts among electronic components with the highest reliability characteristics. Still, failures of tantalum capacitors do happen and when it occurs it might have catastrophic consequences for the system. This is due to a short-circuit failure mode, which might be damaging to a power supply, and also to the capability of tantalum capacitors with manganese cathodes to self-ignite when a failure occurs in low-impedance applications. During such a failure, a substantial amount of energy is released by exothermic reaction of the tantalum pellet with oxygen generated by the overheated manganese oxide cathode, resulting not only in destruction of the part, but also in damage of the board and surrounding components. A specific feature of tantalum capacitors, compared to ceramic parts, is a relatively large value of capacitance, which in contemporary low-size chip capacitors reaches dozens and hundreds of microfarads. This might result in so-called surge current or turn-on failures in the parts when the board is first powered up. Such a failure, which is considered as the most prevalent type of failures in tantalum capacitors [I], is due to fast changes of the voltage in the circuit, dV/dt, producing high surge current spikes, I(sub sp) = Cx(dV/dt), when current in the circuit is unrestricted. These spikes can reach hundreds of amperes and cause catastrophic failures in the system. The mechanism of surge current failures has not been understood completely yet, and different hypotheses were discussed in relevant literature. These include a sustained scintillation breakdown model [1-3]; electrical oscillations in circuits with a relatively high inductance [4-6]; local overheating of the cathode [5,7, 8]; mechanical damage to tantalum pentoxide dielectric caused by the impact of MnO2 crystals [2,9, 10]; or stress-induced-generation of electron traps caused by electromagnetic forces developed during current spikes [11]. A commonly accepted explanation of the surge current failures is that at unlimited current supply during surge current conditions, the self-healing mechanism in tantalum capacitors does not work, and what would be a minor scintillation spike if the current were limited, becomes a catastrophic failure of the part [l, 12]. However, our data show that the scintillation breakdown voltages are significantly greater that the surge current breakdown voltages, so it is still not clear why the part, which has no scintillations, would fail at the same voltage during surge current testing (SCT).

Teverovsky, Alexander↗

Body of Knowledge for Silicon Carbide Power Electronics

Wide band gap semiconductors, such as silicon carbide (SiC), have emerged as very promising materials for future electronic components due to the tremendous advantages they offer in terms of power capability, extreme temperature tolerance, and high frequency operation. This report documents some issues pertaining to SiC technology and its application in the area of power electronics, in particular those geared for space missions. It also serves as a body of knowledge (BOK) in reference to the development and status of this technology obtained via literature and industry survey as well as providing a listing of the major manufacturers and their capabilities. Finally, issues relevant to the reliability of SiC-based electronic parts are addressed and limitations affecting the full utilization of this technology are identified.

Silicon Carbide Power Electronics↗

Thermal Characterization of the Universal Multizone Crystallizator

The Universal Multizone Crystallizator (UMC) is a special apparatus for crystal growth under terrestrial and microgravity conditions. The use of twenty-five zones allows the, UMC to be used for several normal freezing growth techniques. The thermal profile is electronically translated along the stationary sample by systematically reducing the power to the control zones. Elimination of mechanical translation devices increases the systems reliability while simultaneously reducing the size and weight. This paper addresses the UMC furnace design, sample cartridge, typical thermal profiles and corresponding power requirements necessary for two normal freezing techniques: dynamic gradient freeze and zone melting crystal growth.

Watring, D. A.↗

The Universal Multizone Crystallizator (UMC) Furnace: An International Cooperative Agreement

The Universal Multizone Crystallizator (UMC) is a special apparatus for crystal growth under terrestrial and microgravity conditions. The use of twenty-five zones allows the UMC to be used for several normal freezing growth techniques. The thermal profile is electronically translated along the stationary sample by systematically reducing the power to the control zones. Elimination of mechanical translation devices increases the systems reliability while simultaneously reducing the size and weight. This paper addresses the UMC furnace design, sample cartridge and typical thermal profiles and corresponding power requirements necessary for the dynamic gradient freeze crystal growth technique. Results from physical vapor transport and traveling heater method crystal growth experiments are also discussed.

Watring, D. A.↗

NASA Ames Research Center 60 MW Power Supply Modernization

The NASA Ames Research Center 60 MW DC Power Supply was built in 1974 to provide controlled DC power for the Thermophysics Facility Arc Jet Laboratory. The Power Supply has gradually losing reliability due to outdated technology and component life limitation. NASA has decided to upgrade the existing rectifier modules with contemporary high-power electronics and control equipment. NASA plans to complete this project in 2001. This project includes a complete replacement of obsolete thyristor stacks in all six rectifier modules and rectifier bridge control system. High power water-cooled thyristors and freewheeling diodes will be used. The rating of each of the six modules will be 4000 A at 5500 V. The control firing angle signal will be sent from the Facility Control System to six modules via fiberoptic cable. The Power Supply control and monitoring system will include a Master PLC in the Facility building and a Slave PLC in each rectifier module. This system will also monitor each thyristor level in each stack and the auxiliary equipment.

Choy, Yuen Ching↗

Advanced Self-Calibrating, Self-Repairing Data Acquisition System

An improved self-calibrating and self-repairing Data Acquisition System (DAS) for use in inaccessible areas, such as onboard spacecraft, and capable of autonomously performing required system health checks, failure detection. When required, self-repair is implemented utilizing a "spare parts/tool box" system. The available number of spare components primarily depends upon each component's predicted reliability which may be determined using Mean Time Between Failures (MTBF) analysis. Failing or degrading components are electronically removed and disabled to reduce power consumption, before being electronically replaced with spare components.

Pedro J Medelius↗

The Effects of Thermal Cycling on Gallium Nitride and Silicon Carbide Semiconductor Devices for Aerospace Use

Electronics designed for use in NASA space missions are required to work efficiently and reliably under harsh environment conditions. These Include radiation, extreme temperatures, thermal cycling, to name a few. Preliminary data obtained on new Gallium Nitride and Silicon Carbide power devices under exposure to radiation followed by long term thermal cycling are presented. This work was done in collaboration with GSFC and JPL in support of the NASA Electronic Parts and Packaging (NEPP) Program

Patterson, Richard L.↗