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Introduction to Flight Test Engineering [Introduction Aux Techniques Des Essais En Vol]

Flight test is at the core of what organizations must do in order to validate the operation and systems on an aircraft. While the AGARDograph series 300 and 160 series deal with aspects of this testing, this volume pulls it all together as an introduction to the process required to do effective flight test engineering. This volume was originally published in 1995. Its utility has been proven in that many flight test organizations and universities have requested copies for their engineers and students. It was felt that re-issuing it in a new format designed for electronic publication would be valuable to the community. This second printing changes none of the text, but rather reformats it. All the original references to AGARD (instead of RTO) are left in place so that none of the flavor of the original publication is lost. This is the Introductory Volume to the Flight Test Techniques Series. It is a general introduction to the various activities and aspects of Flight Test Engineering that must be considered when planning, conducting, and reporting a flight test program. Its main intent is to provide a broad overview to the novice engineer or to other people who have a need to interface with specialists within the flight test community. The first two Sections provide some insight into the question of why flight test and give a short history of flight test engineering. Sections 3 through 10 deal with the preparation for flight testing. They provide guidance on the preliminary factors that must be considered; the composition of the test team; the logistic support requirements; the instrumentation and data processing requirements; the flight test plan; the associated preliminary ground tests; and last, but by no means least, discuss safety aspects. Sections 11 through 27 describe the various types of flight tests that are usually conducted during the development and certification of a new or modified aircraft type. Each Section offers a brief introduction to the topic under consideration, and the nature and the objectives of the tests to be conducted. It lists the test instrumentation (and, where appropriate, other test equipment and facilities) required, describes the test maneuvers to be executed, and indicates the way in which the test data is selected, analyzed, and presented. The various activities that should take place between test flights are presented next. Items that are covered are: who to debrief; what type of reports to send where: types of data analysis required for next flight; review of test data to make a comparison to predicted data and some courses of action if there is not good agreement; and comments on selecting the next test flight. The activities that must take place upon completion of the test program are presented. The types of reports and briefings that should take place and a discussion of some of the uses of the flight test data are covered. A brief forecast is presented of where present trends may be leading.

Test facilities↗

Microwave Temperature Profiler Mounted in a Standard Airborne Research Canister

Many atmospheric research aircraft use a standard canister design to mount instruments, as this significantly facilitates their electrical and mechanical integration and thereby reduces cost. Based on more than 30 years of airborne science experience with the Microwave Temperature Profiler (MTP), the MTP has been repackaged with state-of-the-art electronics and other design improvements to fly in one of these standard canisters. All of the controlling electronics are integrated on a single 4 ~5-in. (.10 ~13- cm) multi-layer PCB (printed circuit board) with surface-mount hardware. Improved circuit design, including a self-calibrating RTD (resistive temperature detector) multiplexer, was implemented in order to reduce the size and mass of the electronics while providing increased capability. A new microcontroller-based temperature controller board was designed, providing better control with fewer components. Five such boards are used to provide local control of the temperature in various areas of the instrument, improving radiometric performance. The new stepper motor has an embedded controller eliminating the need for a separate controller board. The reference target is heated to avoid possible emissivity (and hence calibration) changes due to moisture contamination in humid environments, as well as avoiding issues with ambient targets during ascent and descent. The radiometer is a double-sideband heterodyne receiver tuned sequentially to individual oxygen emission lines near 60 GHz, with the line selection and intermediate frequency bandwidths chosen to accommodate the altitude range of the aircraft and mission.

Mahoney, Michael J.↗

Linear Array Photodiode and Data Acquisition System Development for Multi-Point Line FLDI Measurements

The continuous development and advancement of multi-point line focused laser differential interferometry (FLDI) instruments requires larger numbers of acquisition channels to make more finely spatially resolved measurements of high-frequency flow fluctuations. No current off-the-shelf system exists for these line FLDI measurements, and so a single unified system consisting of a linear array photodiode, required electronics, and a data acquisition system has been developed to enhance the measurement resolution, both spatially and temporally. A printed circuit board was developed on which the linear array photodiode is mounted for inclusion into an existing FLDI system, and amplifier breakout boards incorporate electronics to condition the signal for the data acquisition system while retaining the necessary high frequency response. The data acquisition system uses a National Instruments chassis and multiple oscilloscope modules, with a specially-designed LabVIEW user interface for laboratory and wind tunnel setup, calibration, and testing. Details regarding the development of the linear array photodiode system and the data acquisition system are provided, and systematic testing of all components is presented, culminating in a test of the system integrated into an existing line FLDI system for measurements of a turbulent jet.

Joshua M Weisberger↗

Tool forms right angles in component leads

Hand tool forms right angles in electronic component leads so they fit the spaced holes of a printed circuit board. This tool firmly holds the leads at points near the component ends to prevent damage and provide accuracy.

Glenn, C. G.↗

Lumped Parameter Modeling for Rapid Vibration Response Prototyping and Test Correlation for Electronic Units

Present preliminary work using lumped parameter models to approximate dynamic response of electronic units to random vibration; Derive a general N-DOF model for application to electronic units; Illustrate parametric influence of model parameters; Implication of coupled dynamics for unit/board design; Demonstrate use of model to infer printed wiring board (PWB) dynamics from external chassis test measurement.

random vibration↗

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗

Synthesis and characterization of high-T(sub c) screen-printed Y-Ba-Cu-O films on alumina

Thick films of YBa2Cu3O(sub 7-x) have been deposited on highly polished alumina substrates by the screen printing technique. To optimize the post-printing heat treatment, the films were baked at various temperatures for different lengths of time and oxygen-annealed at a lower temperature. The resulting films were characterized by electrical resistivity measurements, x-ray diffraction, and optical and scanning electron microscopy. Properties of the films were found to be highly sensitive to the post-printing thermal treatment. Films baked for 15 min at 1000 C in oxygen were hard, adherent, near single phase, and superconducting with T(sub c)(onset) approx 96 K, T(sub c)(zero) approx 66 K and Delta T sub c (10 to 90 percent) approx 10 K.

Bansal, Narottam P.↗

Synthesis and characterization of high-T(c) screen-printed Y-Ba-Cu-O films on alumina

Thick films of YBa2Cu3O(sub 7-x) have been deposited on highly polished alumina substrates by the screen printing technique. To optimize the post-printing heat treatment, the films were baked at various temperatures for different lengths of time and oxygen-annealed at a lower temperature. The resulting films were characterized by electrical resistivity measurements, X-ray diffraction, and optical and scanning electron microscopy. Properties of the films were found to be highly sensitive to the post-printing thermal treatment. Films baked for 15 min at 1000 C in oxygen were hard, adherent, near single phase, and superconducting with T(sub c) (onset) approx 96 KK, T(sub c) (zero) approx 66 K and Delta T sub c (10 to 90 percent) approx 10 K.

Bansal, Narottam P.↗

3D Printed Ceramic Reinforced Polymer Composites Microstructure and Mechanical Properties

In Fused Filament Fabrication (FFF) 3D printing a part is made by extruding material layer by layer. Benefits of FFF are the ability to print complex shapes quickly and at a lower cost compared to other manufacturing methods. In this work, filaments composed of either silicon carbide (SiC) or zirconium silicate ceramic particulates in a polylactic-acid (PLA) matrix were used to print specimens for microstructural analysis and mechanical testing. Pure PLA samples were also printed and tested as a baseline for comparison. A Design of Experiments approach was used to test the interactions between three different parameters and their effect on ultimate strength, Young’s modulus, and yield strength. For compression test specimens, these parameters were infill percentage, number of shells, and print orientation angle. For tensile test specimens, the parameters were layer height, number of shells, and infill orientation angle. Pre- and post-compression test samples were evaluated by scanning electron microscopy for microstructural analysis. Infill percentage had the greatest effect on mechanical properties while number of shells and print orientation angle had minor effects. When changing the layer lines from perpendicular to parallel, relative to the loading direction, SiC-PLA had higher mechanical properties while pure PLA properties had decreased, and zirconium silicate-PLA had mix results.

Fused filament fabrication↗

International Space Station (ISS) 3D Printer Performance and Material Characterization Methodology

In order for human exploration of the Solar System to be sustainable, manufacturing of necessary items on-demand in space or on planetary surfaces will be a requirement. As a first step towards this goal, the 3D Printing In Zero-G (3D Print) technology demonstration made the first items fabricated in space on the International Space Station. From those items, and comparable prints made on the ground, information about the microgravity effects on the printing process can be determined. Lessons learned from this technology demonstration will be applicable to other in-space manufacturing technologies, and may affect the terrestrial manufacturing industry as well. The flight samples were received at the George C. Marshall Space Flight Center on 6 April 2015. These samples will undergo a series of tests designed to not only thoroughly characterize the samples, but to identify microgravity effects manifested during printing by comparing their results to those of samples printed on the ground. Samples will be visually inspected, photographed, scanned with structured light, and analyzed with scanning electron microscopy. Selected samples will be analyzed with computed tomography; some will be assessed using ASTM standard tests. These tests will provide the information required to determine the effects of microgravity on 3D printing in microgravity.

Bean, Q. A.↗

LANDSAT imagery of the Central Andes

The central Andes of South America extend from approximately 14 deg. S to 28 deg. S as an unbroken chain of mountains and volcanoes over 2000 km long. It is here that the Nazca plate dives under the South American plate at angles varying from 10 deg to 30 deg. Very little is known about the volcanoes comprising this classic, subduction-type plate margin. A catalogue of the volcanoes in the central Andes is being prepared by Dr. P.W. Francis and Dr. C.A. Wood at the NASA Lunar and Planetary Institute. At present, more than 800 volcanoes of Cenozoic age have been recognized in the chain, with an estimated 75-80 major, active Quarternary volcanoes. Approximately one hundred 1536 x 1536 pixel color composite Optronics positives were produced from six full LANDSAT Thermatic Mapper scenes and three partial TM scenes. These positives cover a large portion of the central Andes. The positives were produced from LANDSAT data using the VAX imaging package, LIPS. The scenes were first transferred from magnetic tape to disk. The LIPS package was then used to select volcanically interesting areas which were then electronically enhanced. Finally, the selected areas were transferred back to tape and printed on the Optronics equipment. The pictures are color composites using LANDSAT TM bands 7,4, and 2 in the red, green, and blue filters, respectively.

Komer, C. A.↗

Industrial Applications of Graphite Fluoride Fibers

Based on fluorination technology developed during 1934 to 1959, and the fiber technology developed during the 1970s, a new process was developed to produce graphite fluoride fibers. In the process, pitch based graphitized carbon fibers are at first intercalated and deintercalated several times by bromine and iodine, followed by several cycles of nitrogen heating and fluorination at 350 to 370 C. Electrical, mechanical, and thermal properties of this fiber depend on the fluorination process and the fluorine content of the graphite fluoride product. However, these properties are between those of graphite and those of PTFE (Teflon). Therefore, it is considered to be a semiplastic. The physical properties suggest that this new material may have many new and unexplored applications. For example, it can be a thermally conductive electrical insulator. Its coefficient of thermal expansion (CTE) can be adjusted to match that of silicon, and therefore, it can be a heat sinking printed circuit board which is CTE compatible with silicon. Using these fibers in printed circuit boards may provide improved electrical performance and reliability of the electronics on the board over existing designs. Also, since it releases fluorine at 300 C or higher, it can be used as a material to store fluorine and to conduct fluorination. This application may simplify the fluorination process and reduce the risk of handling fluorine.

Hung, Ching-Cheh↗

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗

Additive Manufacturing of Oxide Dispersion Strengthened Multi Principle Element Alloys for Future Aerospace Applications

Oxide Dispersion Strengthened (ODS) materials have long been of interest for their high temperature applications, and additive manufacturing enables their manufacturing viability. The ODS multi-principle element alloy NiCoCr was prepared using powder metallurgy techniques, additively manufactured, and evaluated for its processingmicrostructure-property relationships. The high temperature foundations of nickel-base superalloys and ODS materials were combined with the manufacturing advantages of 3D printing and the chemical simplicity of NiCoCr to inspire this work, which was divided into powder and printed material assessments. The project was achieved through multiple iterative project loops to assess the processing parameters’ impact on the microstructure and mechanical properties of the feedstock powder and printed material. The powder investigations (Chapter 3) focused on understanding the oxide coating that formed on the metal powder following acoustic mixing. Time of Flight Secondary Ion Mass Spectrometry was used to semi-quantitatively assess the amount of yttrium on the surface of the mixed powders, and indicated that a combination of higher mixing condition energy and moderate mixing time resulted in the most oxide coating on the NiCoCr powder. The results were supported by a qualitative assessment of scanning electron images of coated powder particles. Following mixing, the ODS NiCoCr was consolidated by Laser Powder Bed Fusion. The evaluations of the printed material (Chapter 4) frst considered screening experiments including Archimedes’ density, porosity, and grain size and number metrics from electron backscatter diffraction data. After the ideal additive manufacturing parameters were identifed, both the oxide homogeneity and yield strength were discussed for the idealized printed material. Overall, the project suggests that the combined use of qualitative or semi-quantitative powder surface analysis with Archimedes’ density analyses can be a valid high-throughput technique which can lead to process optimization of Laser Powder Bed Fusion additively manufactured ODS material.

Laura G Wilson↗

Universal Controller for Spacecraft Mechanisms

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Levanas, Greg↗

Connector with cable-to-chassis strain relief

Electronic connector adapted from readily available components simplifies electronic packaging and interconnection wiring in assemblies that consist of several identical printed-wiring boards.

Tuskind, K. W.↗

Structural Design and Analysis of a Light-Weight Laminated Composite Heat Sink for Spaceflight PWBs

In order to reduce the overall weight in spaceborne electronic systems, a conventional metallic heat sink typically used for double-sided printed wiring boards was suggested to be replaced by light-weight and high-strength laminated composite materials. Through technology validation assurance (TVA) approach, it has been successfully demonstrated that using laminated composite heat sink can not only reduce the weight of the heat sink by nearly 50%, but also significantly lower the internal thermally-induced stresses that are largely responsible for potential delamination under cyclic temperature variations. With composite heat sink, both thermal and dynamic performance of the double-sided printed wiring board (PWB) exceeds that of its counterpart with metallic heat sink. Also included in this work is the original contribution to the understanding of creep behavior of the worst-case leadless chip carrier (LCC) surface mount solder joint. This was identified as the interconnection most susceptible to thermal fatigue damage in the PWB assembly.

Fan, Mark S.↗