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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9

Rift in Antarctic Glacier: a Unique Chance to Study Ice Shelf Retreat

It happened again, but this time it was caught in the act. During the last week of September 2011 a large transverse rift developed across thefloating terminus of West Antarcticas PineIsland Glacier, less than 5 years after its lastlarge calving event, in 2007 (Figure 1). PineIsland Glaciers retreat has accelerated substantiallyin the past 2 decades, and it is nowlosing 50 gigatons of ice per year, or roughly 25 of Antarcticas total annual contributionto sea level rise [Rignot et al., 2008]. The glaciers recent accelerated retreat is likely triggered by ocean warming and increased submarine melting. As such, it is of significant interest to glaciologists and of heightened societal relevance.

Pine Island Glacier↗

NASA Past, Present, and Future: The Use of Commercial Off The Shelf (COTS) Electronics in Space

NASA has a long history of using commercial grade electronics in space. In this presentation we will provide a brief history of NASA's trends and approaches to commercial grade electronics focusing on processing and memory systems. This will include providing summary information on the space hazards to electronics as well as NASA mission trade space. We will also discuss developing recommendations for risk management approaches to Electrical, Electronic and Electromechanical (EEE) parts usage in space. Two examples will be provided focusing on a near-earth Polar-orbiting spacecraft as well as a mission to Mars. The final portion will discuss emerging trends impacting usage.

Commercial off the Shelf (COTS); Electronic and El↗

NASA Past, Present, and Future: The Use of Commercial Off The Shelf (COTS) Electronics in Space

NASA has a long history of using commercial grade electronics in space. In this presentation we will provide a brief history of NASA's trends and approaches to commercial grade electronics focusing on processing and memory systems. This will include providing summary information on the space hazards to electronics as well as NASA mission trade space. We will also discuss developing recommendations for risk management approaches to Electrical, Electronic and Electromechanical (EEE) parts usage in space. Two examples will be provided focusing on a near-earth Polar-orbiting spacecraft as well as a mission to Mars. The final portion will discuss emerging trends impacting usage.

Electronic and Electromechanical (EEE) parts↗

Ice Sheet and Ice Shelf Freshwater Forcing of the NASA GISS ModelE GCM

Recent mass loss from ice sheets and ice shelves is now persistent and prolonged enough that it impacts downstream oceanographic conditions. To demonstrate this, we use an ensemble of coupled GISS-E2.1-G (a CMIP6 model) simulations forced with historical estimates of anomalous freshwater, in addition to other climate forcings, from 1990 through 2019. In this ensemble there are detectable differences in zonal-mean sea surface temperatures (SST) and sea ice in the Southern Ocean, and in regional sea level around Antarctica and in the western North Atlantic. These impacts mostly improve the model's representation of historical changes, including reversing the forced trends in Southern Ocean surface temperature and Antarctic sea ice. The changes in SST may have implications for estimates of the SST pattern effect on climate sensitivity and for cloud feedbacks. We conclude that the changes are sufficiently large that model groups should strive to include more accurate estimates of these drivers in all-forcing historical simulations in future coupled model intercomparisons.

Ice sheet↗

Teardown analysis for detecting shelf-life degradation

Analysis is guideline in examining component materials, analytically determining physical properties and chemical compositions, and developing control data necessary for ascertaining effects of environments and their influence on deterioration and degradation mechanisms.

Eckstein, A. S.↗