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Study consisted of an analytical approach, in which a mathematical model of existing printed circuit board component mounting techniques was analyzed, and an empirical investigation was performed to determine the extent of damage caused by temperature cycling of the printed circuit boards.
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Spacecraft electronics as used in the NASA community, including the Jet Propulsion Laboratory.
Experimental results will be presented from a continuing investigation into the influence of component size and configuration of thermal cycling lifetimes, observed in a set of quadpak electronic component packages.
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No abstract available
The key advantages of this approach include the fact that the index of interface glass (such as Pb glass n = 1.66) greatly reduces Fresnel losses at the fiber-to-waveguide interface, resulting in lower optical losses. A contiguous structure cannot be misaligned and readily lends itself for use on aircraft or space operation. The epoxy-free, fiber-to-waveguide interface provides an optically pure, sealed interface for low-loss, highpower coupling. Proof of concept of this approach has included successful attachment of the low-melting-temperature glass to the x-y plane of the crystal, successful attachment of the low-meltingtemperature glass to the end face of a standard SMF (single-mode fiber), and successful attachment of a wetted lowmelting- temperature glass SMF to the end face of a KTP crystal. There are many photonic components on the market whose performance and robustness could benefit from this coupling approach once fully developed. It can be used in a variety of fibercoupled waveguide-based components, such as frequency conversion modules, and amplitude and phase modulators. A robust, epoxy-free, contiguous optical interface lends itself to components that require low-loss, high-optical-power handling capability, and good performance in adverse environments such as flight or space operation.
No abstract available
No abstract available
The experimental results for a variety of novel horn designs will be presented and compared to the results predicted by theory.
UNKNOWN
No abstract provided
The goal of this work was to improve off-axis cross-polarization performance and ease of assembly of a circularly polarized microwave antenna element. To ease assembly, the initial design requirement of Hexweb support for the internal circuit part, as well as the radiating disks, was eliminated. There is a need for different plating techniques to improve soldering. It was also desirable to change the design to eliminate soldering as well as the need to use the Hexweb support. Thus, a technique was developed to build the feed without using solder, solving the lathing and soldering issue. Internal parts were strengthened by adding curvature to eliminate Hexweb support, and in the process, the new geometries of the internal parts opened the way for improving the off-axis cross-polarization performance as well. The radiating disks curvatures were increased for increased strength, but it was found that this also improved crosspolarization. Optimization of the curvatures leads to very low off-axis cross-polarization. The feed circuit was curved into a cylinder for improved strength, eliminating Hexweb support. An aperture coupling feed mechanism eliminated the need for feed pins to the disks, which would have required soldering. The aperture coupling technique also improves cross-polarization performance by effectively exciting the radiating disks very close to the antenna s central axis of symmetry. Because of the shape of the parts, it allowed for an all-aluminum design bolted together and assembled with no solder needed. The advantage of a solderless design is that the reliability is higher, with no single-point failure (solder), and no need for special plating techniques in order to solder the unit together. The shapes (curved or round) make for a more robust build without extra support materials, as well as improved offaxis cross-polarization.
Popcorning is a well-known effect in plastic encapsulated microcircuits (PEM) and it occurs in chip tantalum capacitors. The sensitivity of components to the presence of moisture during soldering is characterized by the moisture sensitivity level (MSL); however, contrary to PEMs, there is no standard procedure for establishing MSL for tantalum capacitors.The effect of absorbed moisture on soldering related degradation and failures in tantalum capacitors have not been studied properly yet, and there is no sufficient information regarding the difference in the sensitivity to soldering between polymer and MnO2 capacitors. In this work, 16 types of polymer and 9 types of MnO2 tantalum capacitors with different moisture content have been tested before and after reflow soldering. The level of moisture release during soldering has been estimated and thermo-mechanical analysis used to assess deformation of capacitorsduring soldering simulations. Results show that moisture uptake in similar parts is approximately two times greater in polymer than in MnO2 capacitors. Cracking of the case and degradation of parameters can occur in both types of parts, but MnO2 capacitors are much more likely to fail catastrophically with a short circuit and possible ignition during the first power-on cycle. This type of failure in MnO2 capacitors is lot-related, can occur even at derated voltages and relatively low levels of moisture sorption that corresponds to room conditions. Baking before soldering is an effective measure to prevent failures even in lots susceptible to popcorning damage.
Vibration testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is a follow-on to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Lead-Free Solder Project which was the first group to test the reliability of lead-free solder joints against the requirements of the aerospace/miLItary community. Twenty seven test vehicles were subjected to the vibration test conditions (in two batches). The random vibration Power Spectral Density (PSD) input was increased during the test every 60 minutes in an effort to fail as many components as possible within the time allotted for the test. The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The number of test minutes required to fail a given component attached with SnPb solder was then compared to the number of test minutes required to fail the same component attached with lead-free solder. A complete modal analysis was conducted on one test vehicle using a laser vibrometer system which measured velocities, accelerations, and displacements at one . hundred points. The laser vibrometer data was used to determine the frequencies of the major modes of the test vehicle and the shapes of the modes. In addition, laser vibrometer data collected during the vibration test was used to calculate the strains generated by the first mode (using custom software). After completion of the testing, all of the test vehicles were visually inspected and cross sections were made. Broken component leads and other unwanted failure modes were documented.
Driven by advancements in microelectronics manufacturing, this research investigates the oblique (non-axisymmetric) impact of liquid-metal droplets on flat substrates. The problem of interest is relevant to the development of the novel technology of on-demand dispension (printing) of microscopic solder deposits for the surface mounting of microelectronic devices. The technology, known as solder jetting, features on-demand deposition of miniature solder droplets (30 to 120 microns in diameter) in very fine, very accurate patterns using techniques analogous to those developed for the ink-jet printing industry. Despite its promise, severe limitations exist currently with regards to the throughput rates of the technology; some of these limitations are largely due to the lack of the capability for reliable prediction of solder bump positioning and shapes, especially under ballistic deposition conditions where the droplet impact phenomena are inherently three-dimensional. The study consists of a theoretical and an experimental component. The theoretical work uses a finite element formulation to simulate numerically the non-axisymmetric (3-D) fluid mechanics and heat transfer phenomena of a liquid solder droplet impacting at an angle alpha on a flat substrate. The work focuses on the pre-solidification regime. The modeling of the most challenging fluid mechanics part of the process has been completed successfully. It is based upon the full laminar Navier-Stokes equations employing a Lagrangian frame of reference. Due to the large droplet deformation, the surface (skin) as well as the volumetric mesh have to be regenerated during the calculations in order to maintain the high accuracy of the numerical scheme. The pressure and velocity fields are then interpolated on the newly created mesh. The numerical predictions are being tested against experiments, for cases where wetting phenomena are not important. For the impact parameters used in the example shown (We = 2.38, Fr = 16300, Re = 157), the droplet rolls along the substrate, but its shape remains practically axisymmetric for all impact angles within the range from 0 to 60 deg. Interestingly, the substrate/droplet contact area during the recoiling phase of the impact is not a monotonically decreasing function of time. The experimental component of the research tests the numerical predictions and provides necessary input data (contact angles) for the theoretical model. The experiments are performed in microgravity (2.2s drop tower of the NASA GRC) in order to allow for the use of mm-size solder droplets, which make feasible the performance of accurate measurements, while maintaining similitude of the relevant fluid dynamic groups (Re, Fr, We, Ste). Preliminary oblique impact experiments have been performed using water droplets in normal gravity.
The figure depicts the main parts of a prototype miniature, lightweight, onetime- opening valve. Like some other miniature one-time-opening valves reported in previous issues of NASA Tech Briefs, this valve is opened by melting a material that blocks the flow path. This valve is designed to remain closed at some temperature between room temperature and cryogenic temperature until the time of opening. The prototype valve includes a 1/8-in. (3-mm) aluminum tube, one end of which is plugged with a solder comprising about 37 weight percent of lead and 63 weight percent of tin. The tube and the solder both have a coefficient of thermal expansion of 23 micron/m-K at room temperature. Before plugging, the interior surface of the plug end of the tube is cleaned with a commercial flux paste developed specifically for preparing aluminum for bonding with lead/tin solder. The solder is then melted into the cleaned end of the tube, forming the plug. In a test, the plugged tube was pressurized to 1,000 psi (6.9 MPa) with helium and leak-tested. It was then cooled to a temperature of 77 K (about 196 C) and again leak-tested at the same pressure. Finally, at a lower pressure, the plugged end of the tube was heated to about 200 C (the melting temperature of the solder is 183 C), causing the solder plug to be ejected (see figure). It has been estimated that in a subsequent version of the valve, the plug could be melted by electrical heating, using a nichrome wire having a mass of only 10 g.