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At least 163 records · Page 9

New High-Performance SiC Fiber Developed for Ceramic Composites

Sylramic-iBN fiber is a new type of small-diameter (10-mm) SiC fiber that was developed at the NASA Glenn Research Center and was recently given an R&D 100 Award for 2001. It is produced by subjecting commercially available Sylramic (Dow Corning, Midland, MI) SiC fibers, fabrics, or preforms to a specially designed high-temperature treatment in a controlled nitrogen environment for a specific time. It can be used in a variety of applications, but it currently has the greatest advantage as a reinforcement for SiC/SiC ceramic composites that are targeted for long-term structural applications at temperatures higher than the capability of metallic superalloys. The commercial Sylramic SiC fiber, which is the precursor for the Sylramic-iBN fiber, is produced by Dow Corning, Midland, Michigan. It is derived from polymers at low temperatures and then pyrolyzed and sintered at high temperatures using boron-containing sintering aids (ref. 1). The sintering process results in very strong fibers (>3 GPa) that are dense, oxygen-free, and nearly stoichiometric. They also display an optimum grain size that is beneficial for high tensile strength, good creep resistance, and good thermal conductivity (ref. 2). The NASA-developed treatment allows the excess boron in the bulk to diffuse to the fiber surface where it reacts with nitrogen to form an in situ boron nitride (BN) coating on the fiber surface (thus the product name of Sylramic-iBN fiber). The removal of boron from the fiber bulk allows the retention of high tensile strength while significantly improving creep resistance and electrical conductivity, and probably thermal conductivity since the grains are slightly larger and the grain boundaries cleaner (ref. 2). Also, as shown in the graph, these improvements allow the fiber to display the best rupture strength at high temperatures in air for any available SiC fiber. In addition, for CMC applications under oxidizing conditions, the formation of an in situ BN surface layer creates a more environmentally durable fiber surface not only because a more oxidation-resistant BN is formed, but also because this layer provides a physical barrier between contacting fibers with oxidation-prone SiC surface layers (refs. 3 and 4). This year, Glenn demonstrated that the in situ BN treatment can be applied simply to Sylramic fibers located within continuous multifiber tows, within woven fabric pieces, or even assembled into complex product shapes (preforms). SiC/SiC ceramic composite panels have been fabricated from Sylramic-iBN fabric and then tested at Glenn within the Ultra-Efficient Engine Technology Program. The test conditions were selected to simulate those experienced by hot-section components in advanced gas turbine engines. The results from testing at Glenn demonstrate all the benefits expected for the Sylramic-iBN fibers. That is, the composites displayed the best thermostructural performance in comparison to composites reinforced by Sylramic fibers and by all other currently available high-performance SiC fiber types (refs. 3 and 5). For these reasons, the Ultra-Efficient Engine Technology Program has selected the Sylramic-iBN fiber for ongoing efforts aimed at SiC/SiC engine component development.

DiCarlo, James A.↗

Silicon Carbide Epitaxial Films Studied by Atomic Force Microscopy

Silicon carbide (SiC) holds great potential as an electronic material because of its wide band gap energy, high breakdown electric field, thermal stability, and resistance to radiation damage. Possible aerospace applications of high-temperature, high-power, or high-radiation SiC electronic devices include sensors, control electronics, and power electronics that can operate at temperatures up to 600 C and beyond. Commercially available SiC devices now include blue light-emitting diodes (LED's) and high-voltage diodes for operation up to 350 C, with other devices under development. At present, morphological defects in epitaxially grown SiC films limit their use in device applications. Research geared toward reducing the number of structural inhomogeneities can benefit from an understanding of the type and nature of problems that cause defects. The Atomic Force Microscope (AFM) has proven to be a useful tool in characterizing defects present on the surface of SiC epitaxial films. The in-house High-Temperature Integrated Electronics and Sensors (HTIES) Program at the NASA Lewis Research Center not only extended the dopant concentration range achievable in epitaxial SiC films, but it reduced the concentration of some types of defects. Advanced structural characterization using the AFM was warranted to identify the type and structure of the remaining film defects and morphological inhomogeneities. The AFM can give quantitative information on surface topography down to molecular scales. Acquired, in part, in support of the Advanced High Temperature Engine Materials Technology Program (HITEMP), the AFM had been used previously to detect partial fiber debonding in composite material cross sections. Atomic force microscopy examination of epitaxial SiC film surfaces revealed molecular-scale details of some unwanted surface features. Growth pits propagating from defects in the substrate, and hillocks due, presumably, to existing screw dislocations in the substrates, were imaged. Away from local defects, step bunching was observed to yield step heights of hundreds of angstroms, with possible implications for the uniformity of dopants incorporated in SiC devices during fabrication. The quantitative topographic data from the AFM allow the relevant defect information to be extracted, such as the size and distribution of step bunching and the Burgers vector of screw dislocations. These atomic force microscopy results have furthered the understanding of the dynamic epitaxial SiC growth process. A model describing the observed hillock step bunching has been proposed. This cooperation between researchers involved in crystal growth, electronic device fabrication, and surface structural characterization is likely to continue as atomic force microscopy is used to improve SiC films for high-temperature electronic devices for NASA's advanced turbine engines and space power devices, as well as for future applications in the automotive industry.

Source record↗

The Design of a Transparent Vertical Multizone Furnace: Application to Thermal Field Tuning and Crystal Growth

We present an innovative design of a vertical transparent multizone furnace which can operate in the temperature range of 25 C to 750 C and deliver thermal gradients of 2 C/cm to 45 C/cm for the commercial applications to crystal growth. The operation of the eight zone furnace is based on a self-tuning temperature control system with a DC power supply for optimal thermal stability. We show that the desired thermal profile over the entire length of the furnace consists of a functional combination of the fundamental thermal profiles for each individual zone obtained by setting the set-point temperature for that zone. The self-tuning system accounts for the zone to zone thermal interactions. The control system operates such that the thermal profile is maintained under thermal load, thus boundary conditions on crystal growth ampoules can be predetermined prior to crystal growth. Temperature profiles for the growth of crystals via directional solidification, vapor transport techniques, and multiple gradient applications are shown to be easily implemented. The unique feature of its transparency and ease of programming thermal profiles make the furnace useful in scientific and commercial applications for determining the optimized process parameters for crystal growth.

Duvual, Walter M. B.↗

Time-Separating Heating and Sensor Functions of Thermistors in Precision Thermal Control Applications

A method allows combining the functions of a heater and a thermometer in a single device, a thermistor, with minimal temperature read errors. Because thermistors typically have a much smaller thermal mass than the objects they monitor, the thermal time to equilibrate the thermometer to the temperature of the object is typically much shorter than the thermal time of the object to change its temperature in response to an external perturbation.

Cho, Hyung J.↗

Control Algorithms For Liquid-Cooled Garments

Three algorithms developed for control of cooling in protective garments. Metabolic rate inferred from temperatures of cooling liquid outlet and inlet, suitably filtered to account for thermal lag of human body. Temperature at inlet adjusted to value giving maximum comfort at inferred metabolic rate. Applicable to space suits, used for automatic control of cooling in suits worn by workers in radioactive, polluted, or otherwise hazardous environments. More effective than manual control, subject to frequent, overcompensated adjustments as level of activity varies.

Drew, B.↗

Gas Flow Detection System

This system provides a portable means to detect gas flow through a thin-walled tube without breaking into the tubing system. The flow detection system was specifically designed to detect flow through two parallel branches of a manifold with only one inlet and outlet, and is a means for verifying a space shuttle program requirement that saves time and reduces the risk of flight hardware damage compared to the current means of requirement verification. The prototype Purge Vent and Drain Window Cavity Conditioning System (PVD WCCS) Flow Detection System consists of a heater and a temperature-sensing thermistor attached to a piece of Velcro to be attached to each branch of a WCCS manifold for the duration of the requirement verification test. The heaters and thermistors are connected to a shielded cable and then to an electronics enclosure, which contains the power supplies, relays, and circuit board to provide power, signal conditioning, and control. The electronics enclosure is then connected to a commercial data acquisition box to provide analog to digital conversion as well as digital control. This data acquisition box is then connected to a commercial laptop running a custom application created using National Instruments LabVIEW. The operation of the PVD WCCS Flow Detection System consists of first attaching a heater/thermistor assembly to each of the two branches of one manifold while there is no flow through the manifold. Next, the software application running on the laptop is used to turn on the heaters and to monitor the manifold branch temperatures. When the system has reached thermal equilibrium, the software application s graphical user interface (GUI) will indicate that the branch temperatures are stable. The operator can then physically open the flow control valve to initiate the test flow of gaseous nitrogen (GN2) through the manifold. Next, the software user interface will be monitored for stable temperature indications when the system is again at thermal equilibrium with the test flow of GN2. The temperature drop of each branch from its "no flow" stable temperature peak to its stable "with flow" temperature will allow the operator to determine whether a minimum level of flow exists. An alternative operation has the operator turning on the software only long enough to record the ambient temperature of the tubing before turning on the heaters and initiating GN2 flow. The stable temperature of the heated tubing with GN2 flow is then compared with the ambient tubing temperature to determine if flow is present in each branch. To help quantify the level of flow in the manifolds, each branch will be bench calibrated to establish its thermal properties using the flow detection system and different flow rates. These calibration values can then be incorporated into the software application to provide more detailed flow rate information.

Moss, Thomas↗

Development of an Emulation-simulation Thermal Control Model for Space Station Application

Analysis techniques to evaluate the effects of changing thermal loads and the methods utilized to control temperature distributions in the orbital space station are essential. Analysis techniques including a user-friendly computer program, were developed which should prove useful in thermal design and system analysis of the the space station. The program uses a data base and user input to compute costs, sizes, and power requirements for individual components and complete systems. User input consists of selecting mission parameters, selecting thermal acquisition configurations, transport systems and distances, and thermal rejection configurations.

Colwell, G. T.↗

Microelectrophoretic apparatus and process

New gel tray and lid assemblies designed for use in conjunction with slotted electrophoretic membranes were developed to take advantage of recently improved microelectrophoretic accessories which include a multisample applicator capable of applying up to 10 samples consecutively or simultaneously, and a temperature control plate for dissipating the heat produced by electrophoresis in a gel. The trays and membranes can be marketed ready for use as electrophoretic media or impregnated with various specific substrates and dyes

Grunbaum, B. W.↗

Instrumentation for calibration and control of a continuous-flow cryogenic tunnel

Those aspects of selection and application of calibration and control instrumentation that are influenced by the extremes in the temperature environment to be found in cryogenic tunnels are described with emphasis on the instrumentation and data acquisition system used in the Langley 0.3 m transonic cryogenic tunnel. Typical calibration results obtained in a 20 by 60 cm two dimensional test section are included.

Ladson, C. L.↗

Instrumentation for calibration and control of a continuous-flow cryogenic tunnel

Aspects of selection and application of calibration and control instrumentation that are influenced by the extremes in the temperature environment to be found in cryogenic tunnels are described. The instrumentation and data acquisition system used in the 0.3-m transonic cryogenic tunnel along with typical calibration data obtained in a 20 by 60 cm two dimensional test section are described.

Ladson, C. L.↗

Miniaturized Cassegrainian concentrator concept demonstration

High concentration ratio photovoltaic systems for space applications have generally been considered impractical because of perceived difficulties in controlling solar cell temperatures to reasonably low values. A miniaturized concentrator system is now under development which surmounts this objection by providing acceptable solar cell temperatures using purely passive cell cooling methods. An array of identical miniaturized, rigid Cassegrainian optical systems having a low f-number with resulting short dimensions along their optical axes are rigidly mounted into a frame to form a relatively thin concentrator solar array panel. A number of such panels, approximately 1.5 centimeters thick, are wired as an array and are folded against one another for launch in a stowed configuration. Deployment on orbit is similar to the deployment of conventional planar honeycomb panel arrays or flexible blanket arrays. The miniaturized concept was conceived and studied in the 1978-80 time frame. Progress in the feasibility demonstration to date is reported.

Patterson, R. E.↗

The Lewis Strain Gauge Laboratory: Status and plans

An in-house lab was established for developing, testing, and evaluating high-temperature strain gauges and to aid in in-house applications of high-temperature strain instrumentation. The lab is automated to provide computer control of oven temperatures, imposed strain, and data sampling.

Hobart, Howard F.↗

Cryogenic Behavior of the High Temperature Crystal Oscillator PX-570

Microprocessors, data-acquisition systems, and electronic controllers usually require timing signals for proper and accurate operation. These signals are, in most cases, provided by circuits that utilize crystal oscillators due to availability, cost, ease of operation, and accuracy. Stability of these oscillators, i.e. crystal characteristics, is usually governed, amongst other things, by the ambient temperature. Operation of these devices under extreme temperatures requires, therefore, the implementation of some temperature-compensation mechanism either through the manufacturing process of the oscillator part or in the design of the circuit to maintain stability as well as accuracy. NASA future missions into deep space and planetary exploration necessitate operation of electronic instruments and systems in environments where extreme temperatures along with wide-range thermal swings are countered. Most of the commercial devices are very limited in terms of their specified operational temperature while very few custom-made and military-grade parts have the ability to operate in a slightly wider range of temperature. Thus, it is becomes mandatory to design and develop circuits that are capable of operation efficiently and reliably under the space harsh conditions. This report presents the results obtained on the evaluation of a new (COTS) commercial-off-the-shelf crystal oscillator under extreme temperatures. The device selected for evaluation comprised of a 10 MHz, PX-570-series crystal oscillator. This type of device was recently introduced by Vectron International and is designed as high temperature oscillator [1]. These parts are fabricated using proprietary manufacturing processes designed specifically for high temperature and harsh environment applications [1]. The oscillators have a wide continuous operating temperature range; making them ideal for use in military and aerospace industry, industrial process control, geophysical fields, avionics, and engine control. They exhibit low jitter and phase noise, consume little power, and are suited for high shock and vibration applications. The unique package design of these crystal oscillators offers a small ceramic package footprint, as well as providing both through-hole mounting and surface mount options.

Patterson, Richard↗

Packaging Technology Developed for High-Temperature SiC Sensors and Electronics

A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.

Chen, Liang-Yu↗

Thermal Switch for Satellite Temperature Control

An active radiator tile (ART) thermal valve has been fabricated using silicon micromachining. Intended for orbital satellite heat control applications, the operational principal of the ART is to control heat flow between two thermally isolated surfaces by bring the surfaces into intimate mechanical contact using electrostatic actuation. Prototype devices have been tested in a vacuum and demonstrate thermal actuation voltages as low as 40 volts, very good thermal insulation in the OFF state, and a large increase in radiative heat flow in the ON state. Thin, anodized aluminum was developed as a coating for high infrared emissivity and high solar reflectance.

Ziad, H.↗

Containerless high temperature property measurements

Containerless processing in the low gravity environment of space provides the opportunity to increase the temperature at which well controlled processing of and property measurements on materials is possible. This project was directed towards advancing containerless processing and property measurement techniques for application to materials research at high temperatures in space. Containerless high temperature material property studies include measurements of the vapor pressure, melting temperature, optical properties, and spectral emissivities of solid boron. The reaction of boron with nitrogen was also studied by laser polarimetric measurement of boron nitride film growth. The optical properties and spectral emissivities were measured for solid and liquid silicon, niobium, and zirconium; liquid aluminum and titanium; and liquid Ti-Al alloys of 5 to 60 atomic pct. titanium. Alternative means for noncontact temperature measurement in the absence of material emissivity data were evaluated. Also, the application of laser induced fluorescence for component activity measurements in electromagnetic levitated liquids was studied, along with the feasibility of a hybrid aerodynamic electromagnetic levitation technique.

Nordine, Paul C.↗

A Precise Calibration Technique for Measuring High Gas Temperatures

A technique was developed for direct measurement of gas temperatures in the range of 2050 K - 2700 K with improved accuracy and reproducibility. The technique utilized the low-emittance of certain fibrous Materials, and the uncertainty of the technique was limited by the uncertainty in the melting points of the materials, i.e., +/- 15 K. The materials were pure, thin, metal-oxide fibers whose diameters varied from 60 mm to 400 mm in the experiments. The sharp increase in the emittance of the fibers upon melting was utilized as indication of reaching a known gas temperature. The accuracy of the technique was confirmed by both calculated low emittance values of transparent fibers, of order 0.01, up to a few degrees below their melting point and by the fiber-diameter independence of the results. This melting-point temperature was approached by increments not larger than 4 K, which was accomplished by controlled increases of reactant flow rates in hydrogen-air and/or hydrogen- oxygen flames. As examples of the applications of the technique, the gas-temperature measurements were used (a) for assessing the uncertainty in infering gas temperatures from thermocouple measurements, and (b) for calibrating an IR camera to measure gas temperatures. The technique offers an excellent calibration reference for other gas-temperature measurement methods to improve their accuracy and reliably extending their temperature range of applicability.

Gokoglu, Suleyman A.↗

Challenges and Progress in the Development of High-Temperature Shape Memory Alloys Based on NiTiX Compositions for High-Force Actuator Applications

Interest in high-temperature shape memory alloys (HTSMA) has been growing in the aerospace, automotive, process control, and energy industries. However, actual materials development has seriously lagged component design, with current commercial NiTi alloys severely limited in their temperature capability. Additions of Pd, Pt, Au, Hf, and Zr at levels greater than 10 at.% have been shown to increase the transformation temperature of NiTi alloys, but with few exceptions, the shape memory behavior (strain recovery) of these NiTiX systems has been determined only under stress free conditions. Given the limited amount of basic mechanical test data and general lack of information regarding the work attributes of these materials, a program to investigate the mechanical behavior of potential HTSMAs, with transformation temperatures between 100 and 500 C, was initiated. This paper summarizes the results of studies, focusing on both the practical temperature limitations for ternary TiNiPd and TiNiPt systems based on the work output of these alloys and the ability of these alloys to undergo repeated thermal cycling under load without significant permanent deformation or "walking". These issues are ultimately controlled by the detwinning stress of the martensite and resistance to dislocation slip of the individual martensite and austenite phases. Finally, general rules that govern the development of useful, high work output, next-generation HTSMA materials, based on the lessons learned in this work, will be provided

Padula, Santo, II↗