Influence of current density on microstructure of pulse electrodeposited tin coatings
Pulse electrodeposited tin coatings on copper substrate have been synthesized from an aqueous solution containing sodium stannate (Na{sub 2}SnO{sub 3}.3H{sub 2}O) and sodium hydroxide (NaOH). The effect of current density on surface morphology of the deposits has been investigated. As deposited coatings are characterized by X-ray diffraction, scanning electron microscopy, electron backscatter diffraction, and line profile analysis. The X-ray diffraction analysis shows that the deposits consist of tetragonal ({beta}-Sn) structure with microcrystalline grains. The deposits plated at lower current density exhibit (110) texture which decreases with increasing current densities. The effects of current density on Cu-Sn diffusion and whisker growth of the electrodeposited tin coatings are also reported here. - Highlights: Black-Right-Pointing-Pointer Pulse electrodeposition of Sn from aqueous alkaline solution without adding any organic additive. Black-Right-Pointing-Pointer Effect of current density on morphology and whisker growth in tin coatings aged for 1 year. Black-Right-Pointing-Pointer Solution bath is stable and can be operated over a wide range of current density.