Results for “3D “printable” layers”

NASA NTRS2017

Transparent Conductive Ink for Additive Manufacturing

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.

Patlan, X. J.↗

NASA NTRSDate not supplied

Development of Additive Manufacturing Technologies for 3D Printing of Spacecraft Heat Shields

Introduction: Ablative heat shields are an enabling technology for entry into planetary atmospheres. From the PICA heatshields used for several Mars rovers to the carbon phenolic material used for Galileo’s Jupiter entry probe, the heat shield manages the heat load transferred to the payload, protecting the sensitive scientific instruments carried on entry probes. The Additive Manufacturing of Thermal Protection Systems (AMTPS) project, an Early Career Initiative (ECI) funded by NASA’s Space Technology Mission Directorate and led by NASA Johnson Space Center, seeks to develop materials and processes for 3D printing ablative heat shields for spacecraft. Current methods for producing ablative heat shields are extremely labor intensive and re-quire extensive hands-on processes and quality control characterization. Additive manufacturing (AM) offers the possibility of reduced production times, improved reliability, and enhanced performance via graded compositions. Costs will also be reduced by reducing the time and labor required for heat shield production. Direct integration of the heat shield onto the structure during processing simplifies integration and reduces risk. Material Development: A critical challenge for the project is development of a material system that can (1) be printed in a near-net shape process and (2) perform well as an ablator. Achieving printability requires the material to flow under applied pressure, but maintain its shape once extruded from the printer nozzle. Ablative performance is measured by a multitude of markers, including char yield, char strength, thermal conductivity, and recession rate. Furthermore, there are several mechanical and thermal property considerations for vehicle integration including coefficient of thermal expansion (CTE) and residual stress. AM technology will be leveraged to grade the material formulation and properties through the thickness of the heat shield, an architecture not possible with current manufacturing processes. To this end, “robust” material formulations have been pre-pared with higher density for use on the surface where most ablation will occur. “Insulative” material formulations, with lower density and lower thermal conductivity, are prepared for use in the depth of the heat shield. This graded architecture will re-duce the overall mass of the heat shield and reduce costs and/or increase scientific payload capacities. To achieve a material system with the required properties, multiple resins have been investigated in collaboration with NASA Ames Research Center. To tune printability and performance, resin additives were studied to improve flexibility of the cured material while maintaining acceptable ablative performance. Material coupons were printed and studied via a suite of mechanical and thermal characterization methods. Arc jet testing was conducted at NASA Ames Research Center to evaluate ablative performance and thermal protection under conditions expected in atmospheric entry. Manufacturing Scale-Up: A partnership with Oak Ridge National Laboratory (ORNL) aims to enable full-scale fabrication of a 3D printed heat shield. Leveraging expertise in manufacturing and 3D printing at ORNL, a mid-scale manufacturing demonstration unit will be built and tested, using a dual-layer ablative system printed directly onto the titanium structure. Work on robotic system integration is ongoing and efforts to scale up material mixing with a material compound will ensure accurate and homogenous composition. Flight Test: A hypersonic sub-orbital flight test will provide a rigorous test of material performance ranging from ablation, thermal management, and mechanical integrity. Design of the capsule has taken place in collaboration with the University of Kentucky. Data collected from the flight will inform future design efforts in material formulation, printing methodology, and heat shield-capsule integration.

additive manufacturing↗