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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

3D Integrated Sensing Solutions

We will present the proposed research project to develop 3D-integrated sensors using advanced manufacturing capability for novel sensors, heterogeneously integrated with energy efficient readout circuits. The lack of precision timing in particle tracking detectors and the absence of low power, high throughput communications solutions to read them out limits progress in multiple fields of fundamental science. The aim of the project is to develop technology to enable large-scale particle detectors with 3D-integrated ASIC designs to simultaneously achieve 10 μm position resolution and 10 ps precision timing, with low-power consumption and high throughput rates. This research program leverages the unique combination of facilities and cross-disciplinary expertise of scientists and engineers at SLAC, FNAL, and LLNL and industrial partners.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2025

28nm front end ASIC and 12” LGADs for 3D integration

The 3DIntSenS Collaboration—a joint effort between SLAC, Fermilab, and LLNL—is developing enabling technologies for next-generation radiation imaging detectors that combine ultra-fine spatial resolution (≈10 μm) with precision timing (<20 ps), while maintaining low power <1 W/cm2 and high data throughput. The approach leverages 3D integration between advanced CMOS readout ASICs and finely pixelated LGAD sensors to achieve the performance and scalability required for large-area, high-rate applications. High-granularity, precision-timing detectors are essential for scientific advances in HEP, NP, BES, and FES, but widespread adoption is limited by the cost and complexity of 3D integration. To close this gap, the collaboration is developing LGAD sensors compatible with 12-inch commercial CMOS processes, enabling cost-effective integration with high-performance ASICs under development. We present the design and results from a 28 nm CMOS ASIC prototype, including a low-jitter front end, and in-pixel TDC demonstrating sub-10 ps timing resolution. We also report on the co-design and characterization of reticle-scale LGAD sensors with 50 μm and 100 μm pixels and introduce the next 10k-pixel ASIC designed for full 3D integration. These advances represent a critical step toward scalable, high-resolution radiation imaging systems for future scientific instrumentation.

England, Troy [Fermilab] (ORCID:0000000154405255)↗
DOE OSTI2026

Two 28-nm front-end ASICs for ultra-fine spatial resolution and precision timing to be 3D integrated with 12 LGADs

The 3DIntSenS Collaboration—a joint effort between SLAC, Fermilab, and LLNL—is developing enabling technologies for next-generation radiation imaging detectors that combine ultra-fine spatial resolution (about 10 µm) with precision timing (<20 ps), while maintaining low power <1 W/cm2 and high data throughput. The approach leverages 3D integration between advanced CMOS readout ASICs and finely pixelated LGAD sensors to achieve the performance and scalability required for large-area, high-rate applications. High-granularity, precision-timing detectors are essential for scientific advances in HEP, NP, BES, and FES, but widespread adoption is limited by the cost and complexity of 3D integration. To close this gap, the collaboration is developing LGAD sensors compatible with 12-inch commercial CMOS processes, enabling cost-effective integration with high-performance ASICs under development. We present two 28 nm CMOS ASIC prototypes, including a low-jitter front end, and in-pixel TDC demonstrating sub-10 ps timing resolution. These advances represent a critical step toward scalable, high-resolution radiation imaging systems for future scientific instrumentation.

England, Troy [Fermilab] (ORCID:0000000154405255)↗
DOE OSTI2026

Two 28-nm front-end ASICs for ultra-fine spatial resolution and precision timing to be 3D integrated with 12 LGADs

The 3DIntSenS Collaboration—a joint effort between SLAC, Fermilab, and LLNL—is developing enabling technologies for next-generation radiation imaging detectors that combine ultra-fine spatial resolution (about 10 µm) with precision timing (<20 ps), while maintaining low power <1 W/cm2 and high data throughput. The approach leverages 3D integration between advanced CMOS readout ASICs and finely pixelated LGAD sensors to achieve the performance and scalability required for large-area, high-rate applications. High-granularity, precision-timing detectors are essential for scientific advances in HEP, NP, BES, and FES, but widespread adoption is limited by the cost and complexity of 3D integration. To close this gap, the collaboration is developing LGAD sensors compatible with 12-inch commercial CMOS processes, enabling cost-effective integration with high-performance ASICs under development. We present two 28 nm CMOS ASIC prototypes, including a low-jitter front end, and in-pixel TDC demonstrating sub-10 ps timing resolution. These advances represent a critical step toward scalable, high-resolution radiation imaging systems for future scientific instrumentation.

England, Troy [Fermilab] (ORCID:0000000154405255)↗
DOE OSTI2024

“Hybridizing heat-integrated 3D printed modules with mass manufacturable, low pressure drop fiber sorbents” (Final Report)

The overall objective of this proposal was to research, develop, and evaluate a modular direct air capture (DAC) system that is simple and scalable. This system was based on the adsorption of CO 2 into commercial polyamines supported by porous fiber sorbents, which can be produced at kilometer per hour scales using our pre-pilot spinning line. We have housed these fiber materials in novel 3D printed modular housing systems that provide easy-to-manufacture and localized heat integration and flow control. This hybridization of fiber sorbent technology with modular housing provided several advantages that led to lower air pressure drops, higher sorbent productivity, as well as ease of manufacturing and assembly unrivaled by existing and emerging heat integrated contactor designs. The modular housing was fabricated with the following features, at a minimum: (i) a tapered air intake to reduce pressure drop related to entrance effects, (ii) a structured network of heat transfer channels to enable localized cooling and heating during adsorption and desorption, respectively, and (iii) low pressure drop supports for the fiber sorbents. This hybrid manufacturing approach provides a facile method for taking fiber sorbents from lab scale to pilot scale as it dramatically simplifies the fabrication of heat integrated contactor structures.

42 ENGINEERING↗
DOE OSTI2023

3D–Integrated, Multi–Functional Carbon Fibers for Stable, High–Areal–Capacity Batteries

Increasing lithium-ion batteries' (LIBs) electrode areal capacity can boost energy density and lower manufacturing costs, but faces challenges in manufacturing, rate performance, and cycling stability. A conductive framework made of commercial micro-sized carbon fibers (Cfs) is presented that serves as a host for both the LiNi 0.5 Mn 0.3 Co 0.2 O 2 (NMC 532) cathode and Cfs anode. The Cf framework has multiple functions that offer high electronic conductivity (270 mS cm –1 ), low tortuosity (1.7), low Li + diffusion resistance (22 Ω), and high thermal conductivity (200 W mK –1 ). Additionally, the Cf-integrated electrodes can have an extremely high mass loading of NMC 532 (70 mg cm –2 ) with a theoretical capacity of 14 mAh cm –2 . Thus, the practical full cells assembled with the Cfs-enabled electrodes exhibit an initial areal capacity of 4.1 mAh cm –2 and capacity retention of 90.4% at 500 cycles at a cycling rate of C/3, 1.5 mA cm –2 . Data collected from the operando isothermal microcalorimetry suggest that full cells utilizing the Cf anode experience less heat release from side reactions compared to cells utilizing a conventional graphite anode. Finally, this present approach is scalable and cost-effective and can fabricate practical LIBs that boast high areal capacity, rate performance, and a lengthy cycling lifetime.

25 ENERGY STORAGE↗
DOE OSTI2025

Towards Scalable 3D Integration of 2T-nC FeRAM with Hundreds of Layer Stacking

In this article, we study the limits of the number of capacitors and read history dependence in a 2T-nC ferroelectric random-access memory (FeRAM) cell, paving the way for its high-density integration toward hundreds of stacked layers. Through a comprehensive experimental and simulation study on the scaling behavior of the 2T-nC FeRAM architecture, we demonstrate: (i) successful fabrication of 2T-64C cells with robust memory operation and clearly distinguishable ‘0’ and ‘1’ states, even in 64- capacitor configurations; (ii) that the parasitic capacitance of the floating node originates predominantly from the linear component of the ferroelectric capacitor, and its impact on n-scaling—due to degraded sense margin—can be mitigated by floating unselected capacitors with enough TΩ isolation; (iii) that sharing write and read transistors among n capacitors introduces a read history dependence issue due to fluctuating floating node voltage (VFN); and (iv) that a proposed FN discharge scheme can effectively eliminate read-sequence dependence, at the cost of reduced read endurance.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Physics Basis, Optimization, and Control for Integrated 3D Edge Long-pulse Tokamak Scenarios

The aim of this project with international collaborations (PI: J.-K. Park of Princeton Plasma Physics Laboratory) is to develop a unified physics basis and predictive capability for the control of edge-localized modes (ELMs) with optimized non-axisymmetric (3D) fields, by leveraging the unique research capabilities of international KSTAR tokamak in Korea. At the University of California, Irvine, we use a fusion simulation code GTC to study the effects of the 3D magnetic fields (including both magnetic islands and stochastic magnetic field lines) on microturbulence. We focus on the effects of 3D equilibrium on turbulent and neoclassical transport that leads to ELM suppression. During the project period, the UCI team of this collaboration has made significant progress in understanding turbulent transport in 3D geometry including both tokamaks with RMP and stellarators. Four UCI postdoctoral researchers, Drs. Javier Nicolau, Gyungjin Choi, Pengfei Liu, and Xishuo Wei were partially supported by this project and collaborating with the entire project team. We have published 4 journal papers and gave several invited talks. This project advance physics understand of 3D effects on microturbulence, specially effects of magnetic islands. It will contribute to the DOE SciDAC ISEP project in the area of GTC development for general 3D geometry capability, rigorous verification and validation, and readiness for the emerging exascale computing. Through collaborations with computational scientists, the project helps to advance high performance computing in the area of GPU acceleration, linear solver, and data management.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2022

Advanced Heterogeneous Integration Enabled by 3D Freestanding Membranes—From Material Growths to Applications

For the future of electronics such as bioelectronics, 3D integrated electronics, and bendable electronics, the need for flexibility and stackability of electronic products has substantially grown up. However, conventional wafer-based single-crystalline semiconductors cannot catch up with such trends because they are bound to thick rigid wafers such that they are neither flexible nor stackable. Although polymer-based organic electronic materials are more compatible as they are mechanically compliant and less costly than inorganic counterparts, their electronic/photonic performance is substantially inferior to that of single-crystalline inorganic materials. Such performance-mechanical compliance dilemma could be resolved by developing methods to obtain cheap, flexible, stackable, single-crystalline inorganic systems. Such dream electronic systems could be realized by producing single-crystalline freestanding membranes. For the past few decades, various layer transfer techniques (a.k.a layer liftoff techniques) have been developed to produce single-crystalline freestanding membranes. In today's talk, I will present the survey of the layer liftoff techniques and go over how these strategies unlock new ways of manufacturing advanced electronic systems. In addition, I will introduce unprecedented artificial heterostructure devices enabled by stacking of those freestanding 3D material membranes, e.g., the world's smallest vertically-stacked full-color micro-LEDs, the world's best multiferroic devices, chip-less wireless e-skin, and reconfigurable hetero-integrated chips with AI accelerators.

Kim, Jeehwan↗
DOE OSTI2022

Advanced Heterogeneous Integration Enabled by 3D Freestanding Membranes—From Material Growths to Applications

For the future of electronics such as bioelectronics, 3D integrated electronics, and bendable electronics, the need for flexibility and stackability of electronic products has substantially grown up. However, conventional wafer-based single-crystalline semiconductors cannot catch up with such trends because they are bound to thick rigid wafers such that they are neither flexible nor stackable. Although polymer-based organic electronic materials are more compatible as they are mechanically compliant and less costly than inorganic counterparts, their electronic/photonic performance is substantially inferior to that of single-crystalline inorganic materials. Such performance-mechanical compliance dilemma could be resolved by developing methods to obtain cheap, flexible, stackable, single-crystalline inorganic systems. Such dream electronic systems could be realized by producing single-crystalline freestanding membranes. For the past few decades, various layer transfer techniques (a.k.a layer liftoff techniques) have been developed to produce single-crystalline freestanding membranes. In today's talk, I will present the survey of the layer liftoff techniques and go over how these strategies unlock new ways of manufacturing advanced electronic systems. In addition, I will introduce unprecedented artificial heterostructure devices enabled by stacking of those freestanding 3D material membranes, e.g., the world's smallest vertically-stacked full-color micro-LEDs, the world's best multiferroic devices, chip-less wireless e-skin, and reconfigurable hetero-integrated chips with AI accelerators.

Kim, Jeehwan↗
DOE OSTI2022

How arsenic makes amorphous GeSe a robust chalcogenide glass for advanced memory integration

The 3D integration technology in semiconductor fabrication requires a key component, the ovonic threshold switching (OTS) selector, to suppress the current leakage. The As doped amorphous (a-) GeSe glass is a commercialized OTS material in 3D phase-change memory, but the understanding of such a doping mechanism is still inadequate. Here we systematically explore the effect of As doping on the structural, bonding, and dynamics properties of a-GeAsSe using ab initio molecular dynamics simulations. The results reveal that As atoms form strong bonds with both Ge and Se atoms. The distorted octahedral structures and the 5-fold rings linked by atoms are increased. All of these structural features lead to a more disordered configuration. Moreover, as atoms have notably slowed down the atomic mobility, rendering a-GeAsSe a high stability. Overall, our studies offer insightful understanding of As-doping in OTS materials, paving the way for the design and application of advanced selector devices.

36 MATERIALS SCIENCE↗
NASA NTRS1997

Illustrating Surface Shape in Volume Data via Principal Direction-Driven 3D Line Integral Convolution

The three-dimensional shape and relative depth of a smoothly curving layered transparent surface may be communicated particularly effectively when the surface is artistically enhanced with sparsely distributed opaque detail. This paper describes how the set of principal directions and principal curvatures specified by local geometric operators can be understood to define a natural 'flow' over the surface of an object, and can be used to guide the placement of the lines of a stroke texture that seeks to represent 3D shape information in a perceptually intuitive way. The driving application for this work is the visualization of layered isovalue surfaces in volume data, where the particular identity of an individual surface is not generally known a priori and observers will typically wish to view a variety of different level surfaces from the same distribution, superimposed over underlying opaque structures. By advecting an evenly distributed set of tiny opaque particles, and the empty space between them, via 3D line integral convolution through the vector field defined by the principal directions and principal curvatures of the level surfaces passing through each gridpoint of a 3D volume, it is possible to generate a single scan-converted solid stroke texture that may intuitively represent the essential shape information of any level surface in the volume. To generate longer strokes over more highly curved areas, where the directional information is both most stable and most relevant, and to simultaneously downplay the visual impact of directional information in the flatter regions, one may dynamically redefine the length of the filter kernel according to the magnitude of the maximum principal curvature of the level surface at the point around which it is applied.

Interrante, Victoria↗
DOE OSTI2022

Temperature Mapping of Stacked Silicon Dies from X-Ray-Diffraction Intensities

Increasing power densities in integrated circuits have led to an increased prevalence of thermal hotspots in integrated circuits. Tracking these thermal hotspots is imperative to prevent circuit failures. In three- dimensional (3D) integrated circuits, conventional surface techniques like infrared thermometry are unable to measure the 3D temperature distribution, and optical and magnetic resonance techniques are difficult to apply due to the presence of metals and large current densities. X-rays offer a high penetration depth and can be used to probe 3D structures. We report a method utilizing the temperature dependence of x-ray-diffraction intensity via the Debye-Waller factor to simultaneously map the temperature of individual silicon dies in a stack. Here, utilizing beamline 1-ID-E at the Advanced Photon Source (Argonne), we demonstrate, for each individual silicon die, a temperature resolution of 3 K, a spatial resolution of 100 × 400 μm 2 , and a temporal resolution of 20 s. Utilizing a sufficiently high-intensity laboratory source, e.g., from a liquid-anode source, this method can be scaled down to laboratories for noninvasive temperature mapping of 3D integrated circuits.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗