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Results for “3D direct laser writing”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

3D-printed mirror-less helicity preserving metasurface “mirror” for THz applications

Stimulated by seminal works on generalized reflection and refraction laws, metasurfaces have evolved to a highly promising research direction, as they allow a multitude of different functionalities by optically thin wave-control elements/structures. Among them, structures functioning in the low THz regime are of extensive research interest, due to their high potential in communication and sensing applications. In this paper we propose a simple THz metasurface design that exhibits ideally perfect cross-polarized reflection for linear polarization and perfect helicity-preserving reflection with a geometric (Pancharatnam–Berry) phase for circular polarization, without the presence of any back-reflector. Numerical calculations demonstrating the structure response are justified by analytical models, which provide physical insights on this response. The designed metasurfaces are fabricated using the direct laser writing 3D-printing technology, metallized with electroless silver plating, and are characterized by THz time domain spectroscopy, with the experimental results validating the corresponding theoretical ones. Applications including beam steering and focusing, exploring the Pancharatnam–Berry phase, are also demonstrated numerically. Besides those applications, the helicity preserving mirror response of our metasurfaces can be valuable, among others, also in molecular chirality sensing applications, an issue that is also highlighted here.

3D-printed metasurfaces↗
DOE OSTI2026

All-ceramic channel waveguides fabricated via 3D printing

All-ceramic channel waveguides (CWGs) in Yb:YAG transparent ceramics have been fabricated for the first time, to the best of our knowledge, via direct ink write (DIW) and their laser performance has been demonstrated. Single filaments of Yb:YAG nanoparticle-loaded ink were extruded into undoped YAG; the Yb:YAG filaments formed the CWGs, surrounded by undoped cladding. Elemental mapping confirmed the Yb doping profile and waveguide integrity. Optical characterization showed low cladding scatter losses (<1.3%/cm at 1.3 µm), and laser testing with a 940 nm Ti:sapphire pump demonstrated efficient lasing at 1030 nm. The best-performing waveguide, with an elliptical cross-section (100 µm × 60 µm and a length of 1.4 cm), achieved a slope efficiency of 61% and a roundtrip loss of 12.4%. These results identify DIW as a promising approach for fabricating high-performance channel waveguides in transparent ceramics.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing

Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling losses must be low in deployed systems. Previously, we developed the subsurface controllable refractive index via beam exposure (SCRIBE) technique to write accurate 3D gradient refractive index (GRIN) profiles within a mesoporous silica scaffold. Here, we apply SCRIBE to fabricate low loss, broadband, polarization insensitive, fiber-coupled, single-mode volumetric interconnects that include waveguides traversing arbitrary 3D paths. By seamlessly integrating mode-matching subsurface lenses and GRIN waveguide tapers, calibrating for positional writing errors, implementing multipass exposure, automating alignment, and switching to antireflection coated fibers, we reduced the insertion loss for a fiber-PIC-fiber interconnect from 50 to 2.14 dB, or 1.47 dB, excluding the fiber array’s loss. Further, we establish an upper bound of 0.45 dB loss per coupler. We report quality factors of 27,000 and 77,000 and bending losses of 6 and 3 dB/cm for 15 and 30 µm radii microrings, respectively. We also demonstrate Bézier escalators, polarization-rotating and polarization-splitting interconnects, and a seven-channel 25 µm pitch volumetric interconnect. The SCRIBE platform presents a clear path toward realizing 3D PICs with unique functionality.

Optics↗
DOE OSTI2026

Development of large-scale, 3D Printed high temperature ceramic material

Through this collaborative effort, a new 3D printing platform for ceramics called laser-induced slip casting (LIS) was explored and developed for improving the processing and manufacture of silicon carbide (SiC), a high temperature ceramic material. This method prints layers of ceramic slips/slurries with subsequent selective-laser heating to dry each layer to build a 3D structure. The completed and dried part is then sintered. This manufacturing process is inherently lower cost than alternative ceramic printing methods such as binder jet technology or stereolithography when it comes to the feedstock material but is more expensive than robocasting or direct ink writing. However, it has the potential to make more controlled parts with less defects compared to robocasting. The largest cost is the heating source for the printer. With this technique, there is potential to make large ceramic parts in a near-net shape. Further, there is no known commercial manufacturing of 3D printed ceramics that creates a large range of different high-density ceramics at large scale. The goals and outcomes for the development of the new printing technology were: 1) assessing the technology with alumina by characterizing coupons, 2) printing and sintering of silicon carbide (SiC), and 3) characterization and properties testing of materials printed and a scale-up of SiC part(s). Through this collaborative project, it was sought to provide the best solution to achieving highly dense and near-net shaped ceramic parts at large scale and reduced cost. The goal was to produce high density sintered materials for applications in defense, energy generating systems, armor, and wear parts using 3D printing methods. Variables including powder particle sizes, dispersant molecular weights (MWs), binders, printing parameters, and post processing were explored as well as the characterization of the physical properties (add specifics here).

36 MATERIALS SCIENCE↗