SEARCH · Search NASA

Results for “Ag-Cu”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

SourceResearch connectionFrom yearThrough year

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

9 records

All sources NASA NTRS DOE OSTI

DOE OSTI2021

Hall–Petch strengthening limit through partially active segregation in nanocrystalline Ag-Cu alloys

The breakdown from grain-size strengthening to softening mechanisms is generally well understood for high-purity nanocrystalline materials when the mean grain size decreases to the nanometer range. In nanocrystalline alloys, however, the stabilization of nanosized grains by grain-boundary solute segregation complicates the above mechanisms. Moreover, current segregation models have little predictive power for determining the optimal solute content that maximizes Hall-Petch strengthening effects. In this article, using large-scale hybrid Monte-Carlo/molecular dynamic simulations, we present a systematic study of the Hall–Petch breakdown in Cu-segregated Ag alloys with grain sizes ranging from 8 nm to 59 nm, where three concentration-dependent regimes of plasticity are described: (1) Classical segregation strengthening behavior at low solute contents, (2) shear band-induced softening at high solute contents, and (3) a previously unknown, but extended plateau of maximum strengths for intermediate solute contents from 4 to 15 at.%, which we term as nanocrystalline Sterling silver. We find that flow strengths in nanocrystalline Sterling alloys naturally exhibit a zero-slope limit at the smallest grain sizes that is well below the ideal Hall–Petch strengthening trend. This phenomenon results from partially active grain-boundary segregation that acts to influence interfacial plasticity in some, but not all, grain boundary regions. Our findings amplify the atomic nature of solute segregation and interaction at grain boundaries and its complex roles on grain boundary-mediated plasticity mechanisms in nanocrystalline alloys.

36 MATERIALS SCIENCE↗

DOE OSTI2026

Shapeshifting Nanocatalyst for CO2 Conversion

The conversion of CO2 into high-value chemicals through a photoreduction reaction in water is a promising route to reduce the dependence on fossil fuels. Enhancing selectivity toward hydrocarbons or alcohols can be achieved by Ag-Cu alloys. However, the stabilized surface state created by Ag-Cu interactions is still poorly understood. In this work, multi-modal in situ X-ray experiments reveals underlying mechanisms and the evolution of Ag-Cu nanoparticles under CO2 reduction reaction (CO2RR) conditions. Both morphological and chemical changes of Ag and Cu species induced by diffusion mechanics are tracked during nanocatalyst operation. The initial spheroid Ag-Cu nanoparticles are composed of a Cu-rich shell and Ag-rich core. The reduction treatment promotes Ag migration toward the surface. During photocatalytic CO2 reduction reaction, Cu atoms migrate back to the surface, forming Ag-Cu-O species. The study observes the surface oxidation of Cu(0) to Cu+ and the presence of Ag at the sub-surface region. Furthermore, nanoparticles change their shape, decreasing their specific surface area, driven by Cu diffusion during the CO2 photoreduction reaction. The results provide invaluable insights into the dynamic restructuring of the catalyst under reaction conditions and into the active species responsible for CO2 conversion.

CO2 reduction reaction↗

DOE OSTI2022

A bi-layer barrier design for 122-type iron-based superconducting wires and tapes

Iron-based superconducting wires and tapes hold great promise for high-field magnet applications. A promising design for 122-type wires and tapes based on the powder-in-tube method is using silver and copper double-layer sheaths. For this design a heat treatment temperature below ~ 779 °C is required to prevent Ag-Cu liquid formation. However, this may be below the optimal heat treatment temperature for the critical current density, and still cannot prevent Ag-Cu interdiffusion occurring in the solid state. In this work we propose adding a niobium or tantalum or vanadium (or their alloys) barrier layer between the Ag and Cu to solve the Ag-Cu interdiffusion issue, given that the group-VB metals (vanadium, niobium, tantalum) are relatively inert to both Ag and Cu. To investigate the effectiveness of this design, BaFe 1.84 Co 0.16 As 2 wires and tapes with Ag/Cu and Ag/Ta/Cu sheaths, as well as Ba 0.6 K 0.4 Fe 2 As 2 wires and tapes with Ag/Cu and Ag/Nb/Cu sheaths, were fabricated. It was found that both the Ta and Nb layers kept integral after wire drawing, but after a large flat-rolling reduction the Ta layer broke while the Nb layer kept integral. In the tapes with Ag/Cu sheaths (without the Ta or Nb layer) Cu diffused through the Ag layer and into the powder cores during 740 °C heat treatment, while in the tapes with Ag/Nb/Cu sheaths the Nb layer effectively blocked Ag-Cu interdiffusion even at 900 °C. Further, this work demonstrates that Ta is a suitable barrier material for 122-type wires, while Nb is suitable for both wires and tapes. In this design using Ag/Nb (or Ta)/Cu sheaths, we can regard the outer Cu as the conductor matrix while the Ag and Nb (or Ta) serve as two layers of barriers that suppress reactions between the components. Thus, we call this design a “bi-layer barrier” design for 122-type wires and tapes.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

DOE OSTI2025

Solid solutions limited by grain-boundary solute clustering in ultrafine-grained alloys

Immiscible Ag-Cu alloys exhibit complex behavior due to varying Cu solid solubilities reported under equilibrium and metastable conditions. In ultrafine-grained alloys, these limits are further complicated by a high fraction of grain boundaries, where solute atoms tend to segregate and, in some cases, form clusters. Here, this study investigates the influence of Cu solute segregation and clustering on solid-solution limits in ultrafine-grained Ag-Cu alloys synthesized by magnetron sputtering with varying Cu content. X-ray diffraction peak shifts reveal a solid-solution concentration plateau for Cu contents from 4.9 to 11.7 at %, in contrast to the peak shifts predicted by density-functional theory for Ag-Cu alloys. Scanning transmission electron microscopy further reveals limited solid solubility and the formation of numerous Cu-rich clusters at grain boundaries. Atomistic simulations demonstrate that such limited solubility does not arise from grain boundary segregation alone, but only when strong solute-solute interactions promote the formation of grain-boundary Cu solute clusters.

Density-functional theory↗

DOE OSTI2025

The physical origin of heterogeneous solute clustering and nanoprecipitation at grain boundaries in ultrafine-grained immiscible alloys

Here, grain-boundary segregation effects on heterogeneous solute clustering and nanoprecipitation at low solute concentrations were investigated in sputter-deposited ultrafine-grained Ag-Cu alloy films. X-ray diffraction and scanning transmission electron microscopy revealed extended solubility of Cu in Ag matrix, accompanied by the formation of Cu-rich nanoprecipitates and solute clusters at grain boundaries and their junctions. Atomistic simulations further demonstrated that Cu solutes heterogeneously segregate to Ag GBs and form small clusters that grow into nuclei for Cu nanoprecipitates. These findings provide critical insights into the role of heterogeneous grain-boundary segregation in governing the phase separation pathways of immiscible nanocrystalline and ultrafine-grained alloys.

Heterogeneous segregation↗

DOE OSTI2025

Size-dependent attraction of Cu solutes to clusters formed at Ag grain boundaries

We report a size-dependent solute clustering mechanism at grain boundaries in a sputtered ultrafine-grained Ag-Cu alloy, where large Cu clusters form despite weak individual solute-solute interactions. X-ray diffraction confirms limited Cu solubility in the Ag matrix, while scanning transmission electron microscopy reveals Cu clustering at both ordinary GBs and GB junctions. Density functional theory calculations show that 12-atom Cu clusters are energetically preferred, while smaller three-atom clusters are significantly less stable. Additional calculations demonstrate a marked increase in solute-cluster attraction energy with cluster size. As a result, these findings point to a previously unrecognized pathway for grain-boundary solute clustering in immiscible systems, driven by collective solute-cluster interactions, with implications for segregation behavior and stability in nanocrystalline and ultrafine-grained alloys.

Alloys↗

DOE OSTI2022

Electrochemical Separation of Ag 2 S and Cu 2 S from Molten Sulfide Electrolyte

The production of precious metals from Cu-rich sources such as ore products or secondary sources is slow and complex largely due to limited solubility in aqueous electrolytes. This results in sequential processing with various electrolytes and chemistries, where first Cu is electrorefined, followed by Ag, followed by Au and the platinum group metals. These are separate processes, often conducted in separate electrorefining and electrowinning facilities. The chemical properties of molten sulfides, and their ability to operate at a temperature where liquid metal cathodes are used, suggest the possibility of an alternative, streamlined processing route for Cu and precious metals. Unfortunately, little thermodynamic or electrochemical information is available regarding the behavior of Cu and precious metal sulfides in molten sulfide electrolytes. Herein, the relative activity of the Cu 2 S-Ag 2 S pseudobinary dissolved in a BaS-La 2 S 3 supporting electrolyte is measured at 1523 K. It was found that the supporting electrolyte favors mixing with Ag 2 S over Cu 2 S. Molten sulfide electrolysis of Cu and Ag was conducted, with results in good agreement with the thermodynamic model. It is found that the Ag-Cu cathode chemistry will influence the electrochemical selectivity in the Ag-Cu-Ba-La-S system.

25 ENERGY STORAGE↗

DOE OSTI2020

Materials Data on CuAg3 by Materials Project

Ag3Cu is Magnesium-derived structured and crystallizes in the hexagonal P6_3/mmc space group. The structure is three-dimensional. Ag is bonded to eight equivalent Ag and four equivalent Cu atoms to form AgCu4Ag8 cuboctahedra that share corners with four equivalent CuAg12 cuboctahedra, corners with fourteen equivalent AgCu4Ag8 cuboctahedra, edges with six equivalent CuAg12 cuboctahedra, edges with twelve equivalent AgCu4Ag8 cuboctahedra, faces with four equivalent CuAg12 cuboctahedra, and faces with sixteen equivalent AgCu4Ag8 cuboctahedra. There are a spread of Ag–Ag bond distances ranging from 2.83–2.92 Å. There are two shorter (2.84 Å) and two longer (2.87 Å) Ag–Cu bond lengths. Cu is bonded to twelve equivalent Ag atoms to form CuAg12 cuboctahedra that share corners with six equivalent CuAg12 cuboctahedra, corners with twelve equivalent AgCu4Ag8 cuboctahedra, edges with eighteen equivalent AgCu4Ag8 cuboctahedra, faces with eight equivalent CuAg12 cuboctahedra, and faces with twelve equivalent AgCu4Ag8 cuboctahedra.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Materials Data on Cu3Ag by Materials Project

AgCu3 is alpha La-derived structured and crystallizes in the tetragonal I4/mmm space group. The structure is three-dimensional. Ag is bonded to twelve Cu atoms to form AgCu12 cuboctahedra that share corners with four equivalent AgCu12 cuboctahedra, corners with eight equivalent CuCu8Ag4 cuboctahedra, edges with eight equivalent AgCu12 cuboctahedra, edges with sixteen equivalent CuCu8Ag4 cuboctahedra, faces with four equivalent AgCu12 cuboctahedra, and faces with fourteen CuCu8Ag4 cuboctahedra. All Ag–Cu bond lengths are 2.67 Å. There are two inequivalent Cu sites. In the first Cu site, Cu is bonded to four equivalent Ag and eight Cu atoms to form CuCu8Ag4 cuboctahedra that share corners with twelve equivalent CuCu8Ag4 cuboctahedra, edges with eight equivalent AgCu12 cuboctahedra, edges with sixteen CuCu8Ag4 cuboctahedra, faces with four equivalent AgCu12 cuboctahedra, and faces with fourteen CuCu8Ag4 cuboctahedra. All Cu–Cu bond lengths are 2.67 Å. In the second Cu site, Cu is bonded to four equivalent Ag and eight equivalent Cu atoms to form CuCu8Ag4 cuboctahedra that share corners with four equivalent CuCu8Ag4 cuboctahedra, corners with eight equivalent AgCu12 cuboctahedra, edges with twenty-four CuCu8Ag4 cuboctahedra, faces with six equivalent AgCu12 cuboctahedra, and faces with twelve CuCu8Ag4 cuboctahedra.

36 MATERIALS SCIENCE↗