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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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DOE OSTI2022

Development of Quantum Computing Interconnect Based on Aerosol Jet Printing and Electrochemical Deposition of Rhenium

The electrodeposition of rhenium on to a metal seed layer on flexible substrates is presented as a means to creating superconducting flexible cable connectors in an enabling plug-and-play approach for quantum computing. Cryogenic quantum electronics are currently connected using masses of stainless-steel coaxial cables that are bulky, rigid - both in form and design - and lead to significant joule heating, thermal noise, and cross talk. Here, we present an unprecedented approach to integrate an aerosol jet printed (AJP) metal seed layer with rhenium electrodeposition on a flexible substrate in the advancement of superconducting interconnect technologies. Silver and gold were printed using the ‘Nanojet’ aerosol jet printer on Kapton films. Adhesion of gold was found to be far superior to that of silver and adhesion on roughened Kapton surpassed that of its smooth counterpart. Electrodeposition of rhenium was successful on both silver and gold and an amorphous Re film was confirmed by XRD. Results for both materials are presented however due to the poor adhesion of silver to Kapton it was ruled out as a viable candidate. Composite materials were characterized by profilometry, EDS, XRD and FIBSEM. Electrical measurements of the composite at ambient temperature showed a critical temperature (T c ), where the resistance drops to 0, of 5.8 K, well above 4.2 K, the temperature of liquid helium. Stress-strain tests of the Ag-Re and Au-Re composites on roughened and smooth Kapton were completed. Cyclic flexure testing (200 cycles) to 1.25% strain showed smooth Kapton samples reach a stress of ~16 MPa, while Kapton roughened with sandpaper, reaches ~20MPa of stress for the same 1.25% strain.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on ReAg3 by Materials Project

ReAg3 is Magnesium-derived structured and crystallizes in the hexagonal P6_3/mmc space group. The structure is three-dimensional. Re is bonded to twelve equivalent Ag atoms to form ReAg12 cuboctahedra that share corners with six equivalent ReAg12 cuboctahedra, corners with twelve equivalent AgRe4Ag8 cuboctahedra, edges with eighteen equivalent AgRe4Ag8 cuboctahedra, faces with eight equivalent ReAg12 cuboctahedra, and faces with twelve equivalent AgRe4Ag8 cuboctahedra. There are six shorter (2.84 Å) and six longer (2.92 Å) Re–Ag bond lengths. Ag is bonded to four equivalent Re and eight equivalent Ag atoms to form AgRe4Ag8 cuboctahedra that share corners with four equivalent ReAg12 cuboctahedra, corners with fourteen equivalent AgRe4Ag8 cuboctahedra, edges with six equivalent ReAg12 cuboctahedra, edges with twelve equivalent AgRe4Ag8 cuboctahedra, faces with four equivalent ReAg12 cuboctahedra, and faces with sixteen equivalent AgRe4Ag8 cuboctahedra. There are six shorter (2.87 Å) and two longer (2.96 Å) Ag–Ag bond lengths.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on ReAg3 by Materials Project

ReAg3 is alpha bismuth trifluoride structured and crystallizes in the cubic Fm-3m space group. The structure is three-dimensional. Re is bonded in a distorted body-centered cubic geometry to fourteen Ag atoms. There are eight shorter (2.82 Å) and six longer (3.26 Å) Re–Ag bond lengths. There are two inequivalent Ag sites. In the first Ag site, Ag is bonded in a distorted body-centered cubic geometry to four equivalent Re and four equivalent Ag atoms. All Ag–Ag bond lengths are 2.82 Å. In the second Ag site, Ag is bonded in a distorted body-centered cubic geometry to six equivalent Re and eight equivalent Ag atoms.

36 MATERIALS SCIENCE↗