NESC Avionics Packaging Assessment: Avionics Mechanical Packaging Processes and Best Practices
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Carmel Conaty↗
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Compact Low Power Avionics for the Europa Lander Concept and Other Missions to Ocean Worlds
This paper presents the results of NASA’s game-changing technology development entitled “Ultra Low Temperature Electronics” which represents a paradigm shift in spacecraft avionics development. The project has developed compact avionics technologies to address the Command & Data Handling (CDH), Power and Motor Control needs for mission concepts to ocean worlds such as a potential Europa Lander. We addressed this need by developing the key technologies necessary to develop a next generation compact avionics package. The key technologies that we developed significantly reduce the size, weight, power, and cost (SWAP-C) of the avionics package. These technologies will also allow extreme-environment missions to last longer in their environment by reducing the power and energy requirement to keep the avionics warm.
Bolotin, Gary↗
Orion MPCV Service Module Avionics Ring Pallet Testing, Correlation, and Analysis
The NASA Orion Multi-Purpose Crew Vehicle (MPCV) is being designed to replace the Space Shuttle as the main manned spacecraft for the agency. Based on the predicted environments in the Service Module avionics ring, an isolation system was deemed necessary to protect the avionics packages carried by the spacecraft. Impact, sinusoidal, and random vibration testing were conducted on a prototype Orion Service Module avionics pallet in March 2010 at the NASA Glenn Research Center Structural Dynamics Laboratory (SDL). The pallet design utilized wire rope isolators to reduce the vibration levels seen by the avionics packages. The current pallet design utilizes the same wire rope isolators (M6-120-10) that were tested in March 2010. In an effort to save cost and schedule, the Finite Element Models of the prototype pallet tested in March 2010 were correlated. Frequency Response Function (FRF) comparisons, mode shape and frequency were all part of the correlation process. The non-linear behavior and the modeling the wire rope isolators proved to be the most difficult part of the correlation process. The correlated models of the wire rope isolators were taken from the prototype design and integrated into the current design for future frequency response analysis and component environment specification.
Staab, Lucas↗
Transfer orbit stage mechanisms thermal vacuum test
A systems level mechanisms test was conducted on the Orbital Sciences Corp.'s Transfer Orbit Stage (TOS). The TOS is a unique partially reusable transfer vehicle which will boost a satellite into its operational orbit from the Space Shuttle's cargo bay. The mechanical cradle and tilt assemblies will return to earth with the Space Shuttle while the Solid Rocket Motor (SRM) and avionics package are expended. A mechanisms test was performed on the forward cradle and aft tilting assemblies of the TOS under thermal vacuum conditions. Actuating these assemblies under a 1 g environment and thermal vacuum conditions proved to be a complex task. Pneumatic test fixturing was used to lift the forward cradle, and tilt the SRM, and avionics package. Clinometers, linear voltage displacement transducers, and load cells were used in the thermal vacuum chamber to measure the performance and characteristics of the TOS mechanism assembly. Incorporation of the instrumentation and pneumatic system into the test setup was not routine since pneumatic actuation of flight hardware had not been previously performed in the facility. The methods used are presented along with the problems experienced during the design, setup and test phases.
Oleary, Scott T.↗
Vector-matrix-quaternion, array and arithmetic packages: All HAL/S functions implemented in Ada
The HAL/S avionics programmers have enjoyed a variety of tools built into a language tailored to their special requirements. Ada is designed for a broader group of applications. Rather than providing built-in tools, Ada provides the elements with which users can build their own. Standard avionic packages remain to be developed. These must enable programmers to code in Ada as they have coded in HAL/S. The packages under development at JPL will provide all of the vector-matrix, array, and arithmetic functions described in the HAL/S manuals. In addition, the linear algebra package will provide all of the quaternion functions used in Shuttle steering and Galileo attitude control. Furthermore, using Ada's extensibility, many quaternion functions are being implemented as infix operations; equivalent capabilities were never implemented in HAL/S because doing so would entail modifying the compiler and expanding the language. With these packages, many HAL/S expressions will compile and execute in Ada, unchanged. Others can be converted simply by replacing the implicit HAL/S multiply operator with the Ada *. Errors will be trapped and identified. Input/output will be convenient and readable.
Klumpp, Allan R.↗
Development of reliable electronic packaging solutions for spacecraft avionics miniaturization using embedded passice devices
Miniaturization of electronic packages will play a key rule in future space avionics systems. Smaller avionics packages will reduce payloads while providing greater functionality for information processing and mission instrumentation. Current surface mount technology discrete passive devices not only take up significant space but also add weight. To that end, the use of embedded passive devices, such as capacitors, inductors and resistors will be instrumental in allowing electronics to be made smaller and lighter. Embedded passive devices fabricated on silicon or like substrates using thin film technology, promise great savings in circuit volume, as well as potentially improving electrical performance by decreasing parasitic losses. These devices exhibit a low physical profile and allow the circuit footprint to be reduced by stacking passive elements within a substrate. Thin film technologies used to deposit embedded passive devices are improving and costs associated with the process are decreasing.
Schatzel, Don↗
NASA Affordable Vehicle Avionics (AVA): Common Modular Avionics System for Nano-Launchers Offering Affordable Access to Space
Small satellites are becoming ever more capable of performing valuable missions for both government and commercial customers. However, currently these satellites can only be launched affordably as secondary payloads. This makes it difficult for the small satellite mission to launch when needed, to the desired orbit, and with acceptable risk. NASA Ames Research Center has developed and tested a prototype low-cost avionics package for space launch vehicles that provides complete GNC functionality in a package smaller than a tissue box with a mass less than 0.84 kg. AVA takes advantage of commercially available, low-cost, mass-produced, miniaturized sensors, filtering their more noisy inertial data with realtime GPS data. The goal of the Advanced Vehicle Avionics project is to produce and flight-verify a common suite of avionics and software that deliver affordable, capable GNC and telemetry avionics with application to multiple nano-launch vehicles at 1 the cost of current state-of-the-art avionics.
Guidance Navigation and Control↗
Power ??ctronics Directions for the Future
This paper will discuss the results of the ??ctronics roadmaps developed for the New Millennium Program. The roadmaps will place into perspective the future directions power ??ctronics will need to take in order to be compatible with the 3-D Avionics packages for future spacecraft architectures for the New Millennium Flight Projects.
Electronics roadmaps New Millennium 3-D Avionics f↗
Avionics system design for high energy fields: A guide for the designer and airworthiness specialist
Because of the significant differences in transient susceptibility, the use of digital electronics in flight critical systems, and the reduced shielding effects of composite materials, there is a definite need to define pracitices which will minimize electromagnetic susceptibility, to investigate the operational environment, and to develop appropriate testing methods for flight critical systems. The design practices which will lead to reduced electromagnetic susceptibility of avionics systems in high energy fields is described. The levels of emission that can be anticipated from generic digital devices. It is assumed that as data processing equipment becomes an ever larger part of the avionics package, the construction methods of the data processing industry will increasingly carry over into aircraft. In Appendix 1 tentative revisions to RTCA DO-160B, Environmental Conditions and Test Procedures for Airborne Equipment, are presented. These revisions are intended to safeguard flight critical systems from the effects of high energy electromagnetic fields. A very extensive and useful bibliography on both electromagnetic compatibility and avionics issues is included.
Mcconnell, Roger A.↗
NASA Affordable Vehicle Avionics (AVA)
Small satellites are becoming ever more capable of performing valuable missions for both government and commercial customers. However, currently these satellites can be launched affordably only as secondary payloads. This makes it difficult for the small satellite mission to launch when needed, to the desired orbit, and with acceptable risk. What is needed is a class of low-cost launchers, so that launch costs to low-Earth orbit (LEO) are commensurate with payload costs. Several private and government-sponsored launch vehicle developers are working toward just that-the ability to affordably insert small payloads into LEO. But until now, cost of the complex avionics remained disproportionately high. AVA (Affordable Vehicle Avionics) solves this problem. Significant contributors to the cost of launching nanosatellites to orbit are the avionics and software systems that steer and control the launch vehicles, sequence stage separation, deploy payloads, and telemeter data. The high costs of these guidance, navigation and control (GNC) avionics systems are due in part to the current practice of developing unique, single-use hardware and software for each launch. High-performance, high-reliability inertial sensors components with heritage from legacy launchers also contribute to costs-but can low-cost commercial inertial sensors work just as well? NASA Ames Research Center has developed and tested a prototype low-cost avionics package for space launch vehicles that provides complete GNC functionality in a package smaller than a tissue box (100 millimeters by 120 millimeters by 69 millimeters; 4 inches by 4.7 inches by 2.7 inches), with a mass of less than 0.84 kilogram (2 pounds. AVA takes advantage of commercially available, low-cost, mass-produced, miniaturized sensors, filtering their more noisy inertial data with real-time GPS (Global Positioning Satellite) data. The goal of the AVA project is to produce and light-verify a common suite of avionics and software that deliver affordable, capable GNC and telemetry avionics with application to multiple nanolaunch vehicles at 1 percent of the cost of current state-of-the-art avionics.
space technology↗
Flight Results from the HST SM4 Relative Navigation Sensor System
On May 11, 2009, Space Shuttle Atlantis roared off of Launch Pad 39A enroute to the Hubble Space Telescope (HST) to undertake its final servicing of HST, Servicing Mission 4. Onboard Atlantis was a small payload called the Relative Navigation Sensor experiment, which included three cameras of varying focal ranges, avionics to record images and estimate, in real time, the relative position and attitude (aka "pose") of the telescope during rendezvous and deploy. The avionics package, known as SpaceCube and developed at the Goddard Space Flight Center, performed image processing using field programmable gate arrays to accelerate this process, and in addition executed two different pose algorithms in parallel, the Goddard Natural Feature Image Recognition and the ULTOR Passive Pose and Position Engine (P3E) algorithms
Naasz, Bo↗
Overview of the Life Sciences Glovebox (LSG) Facility
The Life Sciences Glovebox (LSG) is a rack-level payload facility designed to house biological investigations in a "workbench" type environment aboard the International Space Station (ISS). The facility is scheduled to be launched in September 2018 and will be installed in the Japanese Experiment Module (JEM) of the ISS. LSG is comprised of an extendable work volume, an airlock, an avionics package, a laptop, and supporting structure. The 450L work volume provides two levels of containment for investigations via the physical barrier of its structure and an internal, filtered airflow that results in a negative pressure relative to ISS cabin pressure. The facility provides many other resources for investigation use including 28 VDC power, 120 VAC power, heat rejection, data connections, and video. Portions of the interior surfaces of the work volume are ferrous, allowing investigations and supporting hardware to be magnetically affixed to these surfaces. A UV decontamination system and a variety of ancillary hardware are available for investigations to use while occupying LSG. An engineering unit on the ground is used for payload development and integrated verification testing. Once the facility is installed and commissioned, it will be managed by the same team that manages the Microgravity Science Glovebox (MSG), another rack-level payload facility that has been operating aboard the ISS since 2002. Experienced Investigation Payload Integration Managers (IPIMs), who also support MSG payloads, will be available to assist payload developers through the integration process. This presentation will provide an overview of the LSG facility and the planned investigation flow for the near future.
Jordan, Lee↗
VTXO: the Virtual Telescope for X-ray Observations
The Virtual Telescope for X-ray Observations (VTXO) will use lightweight Phase Frensel Lenses (PFLs) in a virtual X-ray telescope with 1 km focal length and with nearly 50 milli-arcsecond angular resolution. Laboratory characterization of PFLs have demonstrated near diffraction-limited angular resolution in the X-ray band, but they require long focal lengths to achieve this quality of imaging. VTXO is formed by using precision formation flying of two SmallSats: a smaller, 6U OpticsSat that houses the PFLs and navigation beacons while a larger, ESPA-class DetectorSat contains an X-ray camera, a charged-particle radiation monitor, a precision star tracker, and the propulsion for the formation flying. The baseline flight dynamics uses a highly-elliptical supersynchronous geostationary transfer orbit to allow the inertial formation to form and hold around the 90,000 km apogee for 10 hours of the 32.5-hour orbit with nearly a year mission lifetime. The guidance, navigation, and control (GN&C) for the formation flying uses standard CubeSat avionics packages, a precision star tracker, imaging beacons on the Optics Sat, and a radio ranging system that also serves as an inter-satellite communication link. VTXO’s fine angular resolution enables measuring the environments nearly an order of magnitude closer to the central engines of bright compact X-ray sources compared to the current state of the art. This X-ray imaging capability allows for the study of the effects of dust scattering nearer to the central objects such as Cyg X-3 and GX 5-1, for the search for jet structure nearer to the compact object in X-ray novae such as Cyg X-1and GRS 1915+105, and for the search for structure in the termination shock of in the Crab pulsar wind nebula. The In this paper, the VTXO science performance, SmallSat and instrument designs,and mission description is be described. The VTXO development was supported as one of the selected 2018 NASA Astrophysics SmallSat Study (AS3) missions.
John Krizmanic↗
Spacecraft avionics miniaturization using embedded passive packaging technology
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Avionics packaging↗
Orbital Replacement Units (ORUs) design considerations
The packaging of avionics and mechanisms in containers, called orbital replacement units, which permits in-orbit repair and replacement is the key to man's expanded ventures into space with increasingly costly assets. In designing ORUs, the designer must accommodate the environments of launch and space. The subjects of ORU attachment, thermal, electrical connectors, and size and configuration, are addressed.
Edward Falkenhayn↗
The Deep Space 4/Champollion Comet Rendezvous and Lander Technology Demonstration Mission
The Deep Space 4/Champollion mission is designed to test and validate technologies for landing on and anchoring to small bodies, and sample collection and transfer, in preparation for future sample return missions from comets, asteroids, and satellites. in addition, DS-4 will test technologies for advanced, multi-engine solar electric propulsion (SEP) systems, inflatable-rigidizable solar arrays, autonomous navigation and precision guidance for landing, autonomous hazard detection and avoidance, and advanced integrated avionics and packaging concepts. Deep Space-4/Champollion consists of two spacecraft: an orbiter/carrier vehicle which includes the multi-engine SEP stage, and a lander, called Champollion, which will descend to the surface of the 46P/Tempel 1 cometary nucleus. The spacecraft will launch in April, 2003 and land on the comet in September, 2006 Deep Space 4/Champollion is a joint project between NASA and CNES, the French space agency.
Smythe, William D.↗
An Ada Linear-Algebra Software Package Modeled After HAL/S
New avionics software written more easily. Software package extends Ada programming language to include linear-algebra capabilities similar to those of HAL/S programming language. Designed for such avionics applications as Space Station flight software. In addition to built-in functions of HAL/S, package incorporates quaternion functions used in Space Shuttle and Galileo projects and routines from LINPAK solving systems of equations involving general square matrices. Contains two generic programs: one for floating-point computations and one for integer computations. Written on IBM/AT personal computer running under PC DOS, v.3.1.
Klumpp, Allan R.↗
Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment
This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.
high density CCGA qualifications↗