Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading
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Lim, Niño Rigo Emil G.↗
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Optimized Viewing Techniques to Minimize Radiation Damage From X-ray Imaging Systems
X-ray inspection of ball grid arrays (BGAs) is typically performed at one or more viewing angles to examine adhesion sites for errors such as voids, joint cracking, or head-in-pillow. During this inspection process, the cir cuit board assembly is subject to ionizing radiation exposure, which can cause trapped charge within oxide layers of semiconductor devices. Some x-ray machines allow for programmable inspection routines, which could be used to optimize radiation exposure to semiconductor components. Using Monte Carlo methods, x-ray inspection of a BGA was simulated to determine a range of acceptable viewing angles. Dose rates to circuit board components were estimated at each inspection angle to determine the view resulting in optimized radiation exposure. Results showed that for each BGA, the maximum unobstructed viewing times without exceeding a 5 Gy dose limit to a single part ranged from 82 to 94 minutes. Using a radiation cost function method, optimized viewing across all components was found. Here, it was observed that for a consistent dose limit applied to silicon-based components, performing inspection with BGAs facing the x-ray source was optimal. A third method was applied, assigning individual dose limits based on empirical data from the NASA Goddard Space Flight Center radiation database. This method showed that optimized viewing maximizes the distance between the radiation source and highly sensitive components. It was also observed that cumulative effects from viewing two BGAs will influence viewing angles, causing the optimal view of one BGA to exist nearly 180° from the other.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
Real-time monitoring and prediction of water quality parameters and algae concentrations using microbial potentiometric sensor signals and machine learning tools
We report the overarching hypothesis of this study was that temporal microbial potentiometric sensor (MPS) signal patterns could be used to predict changes in commonly monitored water quality parameters by using artificial intelligence/machine learning tools. To test this hypothesis, the study first examines a proof of concept by correlating between MPS's signals and high algae concentrations in an algal cultivation pond. Then, the study expanded upon these findings and examined if multiple water quality parameters could be predicted in real surface waters, like irrigation canals. Signals generated between the MPS sensors and other water quality sensors maintained by an Arizona utility company, including algae and chlorophyll, were collected in real time at time intervals of 30 min over a period of 9 months. Data from the MPS system and data collected by the utility company were used to train the ML/AI algorithms and compare the predicted with actual water quality parameters and algae concentrations. Based on the composite signal obtained from the MPS, the ML/AI was used to predict the canal surface water's turbidity, conductivity, chlorophyll, and blue-green algae (BGA), dissolved oxygen (DO), and pH, and predicted values were compared to the measured values. Initial testing in the algal cultivation pond revealed a strong linear correlation (R 2 = 0.87) between mixed liquor suspended solids (MLSS) and the MPSs' composite signals. The Normalized Root Mean Square Error (NRMSE) between the predicted values and measured values were <6.5%, except for the DO, which was 10.45%. The results demonstrate the usefulness of MPSs to predict key surface water quality parameters through a single composite signal, when the ML/AI tools are used conjunctively to disaggregate these signal components. The maintenance-free MPS offers a novel and cost-effective approach to monitor numerous water quality parameters at once with relatively high accuracy.
54 ENVIRONMENTAL SCIENCES↗
A 24-Channel Digitizer With a JESD204B-Compliant Serial Interface for High-Speed Detectors
In this report a 24-channel application-specific integrated circuit (ASIC) for the readout of high-speed CMOS active pixel sensors for charged particle detection is presented. The chip comprises 24 preamplifiers, 24 distinct 12-bit, 25 MSPS Pipelined analog-to-digital converters (ADCs) with self-calibration, an internal phase-locked loop (PLL), and a 3 Gbps serial interface that conforms to the JESD204B standard. To simplify interfacing with a variety of sensors, the ASIC also includes an automatic offset calibration loop. The high level of integration of the ASIC reduces overall system cost and area, and exploiting the signal characteristics of the image sensor allows the ADC to be optimized for reduced power dissipation. The use of an integrated serializer and an industry standard protocol simplifies integration of the ASIC into a complete camera system. The ASIC, called the High-Speed Image Preprocessor Targeted for Electron Readout, or HIPSTER, with a die area of 64.26 mm 2 , is packaged in a 480-ball grid array (BGA) and is fabricated in 180-nm CMOS technology. HIPSTER achieves typical differential nonlinearity (DNL) < 0.55 LSB, input-referred thermal noise of $114.5 μV-rms, and a bit error rate (BER) of better than 10-14. The power dissipation is 98 mW/channel.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
Impacts of Substrate Thinning on FPGA Performance and Reliability [Slides]
Substrate thinning is necessary in devices with flip-chip BGA packages to enable both radiation testing and component qualification and high-spatial resolution beam-based failure analysis methods. We investigated three factors affecting device performance: subsurface damage from the thinning process, reduced heat spreading in thin substrates, and changes in device switching speed. We conclude subsurface damage to crystalline Si caused by the thinning process is removable with sufficient SiO 2 slurry polishing. Local temperature differences increase minimally in devices thinned to 3 μm. Compressive stress in the Si increases globally after device thinning and leads to slowing of ring oscillator frequency by about 0.5% compared to full-thickness devices. Future work will include extending the results to submicron Si thickness values, which also has important benefits for failure analysis, debug, and security assessments. We also plan to extend this type of work to other FPGAs and other devices like memory and processors.
36 MATERIALS SCIENCE↗