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Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature
Landslides are a global and frequent natural hazard, affecting many communities and infrastructure networks. Technological solutions are needed for long-term, large-scale condition monitoring of infrastructure earthworks or natural slopes. However, current instruments for slope stability monitoring are often costly, require a complex installation process and/or data processing schemes, or have poor resolution. Wireless sensor networks comprising low-power, low-cost sensors have been shown to be a crucial part of landslide early warning systems. Here, we present the development of a novel sensing approach that uses linear arrays of three-axis accelerometers for monitoring changes in sensor inclination, and thus the surrounding soil’s deformation. By combining these deformation measurements with depth-resolved temperature measurements, we can link our data to subsurface thermal–hydrological regimes where relevant. In this research, we present a configuration of cascaded I2C sensors that (i) have ultra-low power consumption and (ii) enable an adjustable probe length. From an electromechanical perspective, we developed a novel board-to-board connection method that enables narrow, semi-flexible sensor arrays and a streamlined assembly process. The low-cost connection method relies on a specific FR4 printed circuit board design that allows board-to-board press fitting without using electromechanical components or solder connections. The sensor assembly is placed in a thin, semi-flexible tube (inner diameter 6.35 mm) that is filled with an epoxy compound. The resulting sensor probe is connected to an AA-battery-powered data logger with wireless connectivity. We characterize the system’s electromechanical properties and investigate the accuracy of deformation measurements. Our experiments, performed with probes up to 1.8 m long, demonstrate long-term connector stability, as well as probe mechanical flexibility. Furthermore, our accuracy analysis indicates that deformation measurements can be performed with a 0.390 mm resolution and a 95% confidence interval of ±0.73 mm per meter of probe length. This research shows the suitability of low-cost accelerometer arrays for distributed soil stability monitoring. In comparison with emerging low-cost measurements of surface displacement, our approach provides depth-resolved deformation, which can inform about shallow sliding surfaces.
Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature: Supporting Data
This dataset was used to assess the potential of a Soil Deformation and Temperature Monitoring System developed and presented in the article named "Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature" and published in Sensors. There are 21 comma-delimited data files (.csv). 14 files contain current measurements performed in a lab setting, enabling the electrical evaluation of the sensor probe. These files are generated by the Keithley DMM6500 multimeter, and list the measured supply current (first column) as a function of time (3rd column). Another set of 6 files is also acquired in lab experiments, but contain soil temperature an deformation measurements, enabling an assessment of the developed device's accuracy. In these files, the first column contains the time (UTC), followed by the sensor's battery voltage and temperature and acceleration values (X, Y, Z) in subsequent columns. The measurements were acquired every 5 seconds. Another .csv file contains field data in a similar format (time, temperature, acceleration) collected at the Teller road (mile 27) site near Nome, Alaska with one probe. The Next-Generation Ecosystem Experiments: Arctic (NGEE Arctic), was a research effort to reduce uncertainty in Earth System Models by developing a predictive understanding of carbon-rich Arctic ecosystems and feedbacks to climate. NGEE Arctic was supported by the Department of Energy's Office of Biological and Environmental Research. The NGEE Arctic project had two field research sites: 1) located within the Arctic polygonal tundra coastal region on the Barrow Environmental Observatory (BEO) and the North Slope near Utqiagvik (Barrow), Alaska and 2) multiple areas on the discontinuous permafrost region of the Seward Peninsula north of Nome, Alaska. Through observations, experiments, and synthesis with existing datasets, NGEE Arctic provided an enhanced knowledge base for multi-scale modeling and contributed to improved process representation at global pan-Arctic scales within the Department of Energy's Earth system Model (the Energy Exascale Earth System Model, or E3SM), and specifically within the E3SM Land Model component (ELM).
Wind-Tunnel Tests of the 1/25-Scale Powered Model of the Martin JRM-1 Airplane. IV - Tests with Ground Board and with Modified Wing and Hull - TED No. NACA 232: Tests with Ground Board and with Modified Wing and Hull, TED No. NACA 232 - Part 4
Wind-tunnel tests were made of a 1/25 scale model of the Martin JRM-1 airplane to determine: (1) The longitudinal stability and control characteristics of the JRM-1 model near the water and lateral and directional stability characteristics with power while moving on the surface of the water, the latter being useful for the design of tip floats; (2) The stability and stalling characteristics of the wing with a modified airfoil contour; (3) Stability characteristics of a hull of larger design gross weight; The test results indicated that the elevator was powerful enough to trim the original model in a landing configuration at any lift coefficient within the specified range of centers of gravity. The ground-board tests for evaluating the aerodynamic forces and moments on an airplane in a simulated cross wind indicate a high dihedral effect in the presence of the ground board and, consequently, during low-speed taxying and take-off, large overturning moments would result which would have to be overcome by the tip floats.
Real-Time On-Board Airborne Demonstration of High-Speed On-Board Data Processing for Science Instruments (HOPS)
The project called High-Speed On-Board Data Processing for Science Instruments (HOPS) has been funded by NASA Earth Science Technology Office (ESTO) Advanced Information Systems Technology (AIST) program since April, 2012. The HOPS team recently completed two flight campaigns during the summer of 2014 on two different aircrafts with two different science instruments. The first flight campaign was in July, 2014 based at NASA Langley Research Center (LaRC) in Hampton, VA on the NASA's HU-25 aircraft. The science instrument that flew with HOPS was Active Sensing of CO2 Emissions over Nights, Days, and Seasons (ASCENDS) CarbonHawk Experiment Simulator (ACES) funded by NASA's Instrument Incubator Program (IIP). The second campaign was in August, 2014 based at NASA Armstrong Flight Research Center (AFRC) in Palmdale, CA on the NASA's DC-8 aircraft. HOPS flew with the Multifunctional Fiber Laser Lidar (MFLL) instrument developed by Excelis Inc. The goal of the campaigns was to perform an end-to-end demonstration of the capabilities of the HOPS prototype system (HOPS COTS) while running the most computationally intensive part of the ASCENDS algorithm real-time on-board. The comparison of the two flight campaigns and the results of the functionality tests of the HOPS COTS are presented in this paper.
A robust soc-MOF platform exhibiting high gravimetric uptake and volumetric deliverable capacity for on-board methane storage
Abstract not provided
Concepts for on board satellite image registration. Volume 4: Impact of data set selection on satellite on board signal processing
The NASA NEEDS program goals present a requirement for on-board signal processing to achieve user-compatible, information-adaptive data acquisition. This volume addresses the impact of data set selection on data formatting required for efficient telemetering of the acquired satellite sensor data. More specifically, the FILE algorithm developed by Martin-Marietta provides a means for the determination of those pixels from the data stream effects an improvement in the achievable system throughput. It will be seen that based on the lack of statistical stationarity in cloud cover, spatial distribution periods exist where data acquisition rates exceed the throughput capability. The study therefore addresses various approaches to data compression and truncation as applicable to this sensor mission.
Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly
A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.
Concepts for on-board satellite image registration. Volume 3: Impact of VLSI/VHSIC on satellite on-board signal processing
Anticipated major advances in integrated circuit technology in the near future are described as well as their impact on satellite onboard signal processing systems. Dramatic improvements in chip density, speed, power consumption, and system reliability are expected from very large scale integration. Improvements are expected from very large scale integration enable more intelligence to be placed on remote sensing platforms in space, meeting the goals of NASA's information adaptive system concept, a major component of the NASA End-to-End Data System program. A forecast of VLSI technological advances is presented, including a description of the Defense Department's very high speed integrated circuit program, a seven-year research and development effort.
Report of Apollo 204 Review Board to the Administrator. Appendix A: Board Minutes
No abstract available
An On-Board Off-Board Framework for Online Replanning: Applied to UAVs in Urban Environments
Autonomous systems are being used in a multitude of areas at an increasing rate and require a high level of adaptivity and intelligence to operate safely, especially under faulty conditions. This paper introduces a novel genetic algorithm tailored for UAV trajectory replanning, with an improved execution time via search space reduction based on the operating conditions of the UAV and its remaining mission. A unique characteristic of the replanning agent is its fast-start and adaptive properties, pre-seeding candidates with partial solutions and dynamically tuning elitism, crossover, and mutation rates in correspondence to the average fitness and diversity of the population. A population restart mechanism and early stopping mechanism are evaluated as well to assess their effect on solution quality and runtime. Previous work on genetic algorithms for UAV replanning were conducted with short trajectories in a small state space. Our UAV operates in a 56,000 square meter simulated urban environment, with static obstacles and a total of 53 possible waypoints. The agent increases the safety and reliability of UAV autonomy when operating under faulty conditions and when replanning is required.
Board Saver for Use with Developmental FPGAs
A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design has been determined, the board saver can be unsoldered from the contact pads on the first-mentioned printed-circuit board and replaced by the final FPGA.
Space flight printed wiring board measling investigation
A flight printed wiring board (PWB) for a satellite project was observed to have a high incidence of measling. Other PWB's produced for the program by the same manufacturer did not exhibit the degree of measling as did the 'measle-prone' board. Measling susceptibility during hand soldering and measling effects on PWB insulation resistance were investigated for three production PWB's. Measling resistance was significantly different between the three boards: the 'worst' exhibited five times the number of measles as the 'best' board. 'Severe' measling (that which is likely to affect board reliability) did not exist on the 'best' board, even under extreme soldering conditions (399 degrees C for 12-15 sec.), whereas the 'worst' board showed an average of one 'severe' measle for every two pads under more normal soldering conditions (288-343 degrees C for 2-5 sec.). Both soldering time and temperature affected measling, with time having a slightly greater influence (2 percent versus 12 percent). Measling effects on PWB insulation resistance were inconclusive. These were evaluated by in situ resistance measurements on the same three boards at elevated temperature and humidity. The measured resistance for all three boards decreased for exposures greater than 50 degrees C and 50 percent relative humidity. The 'measle-prone' board showed a resistance decrease at only 25 degrees C and 50 percent relative humidity. However, no definitive difference was detected between measled and not-measled (control) samples. The boards evaluated were production boards, so the effect of interlayer traces connecting the plated-through holes was not controlled. It is likely the resistance measurements were over different volumes of PWB laminate, which would account for the widely varying resistances measured. Thermomechanical measurements on board laminate materials did not reveal any differences attributed to measling. Differences in glass transition temperature were significantly different when measured by DTA, but not by SDT. Laminate thermal expansion differences were significant for the 35 degrees C evaluations, but not for any higher temperatures.
Board Level Proton Testing Book of Knowledge for NASA Electronic Parts and Packaging Program
This book of knowledge (BoK) provides a critical review of the benefits and difficulties associated with using proton irradiation as a means of exploring the radiation hardness of commercial-off-the-shelf (COTS) systems. This work was developed for the NASA Electronic Parts and Packaging (NEPP) Board Level Testing for the COTS task. The fundamental findings of this BoK are the following. The board-level test method can reduce the worst case estimate for a board's single-event effect (SEE) sensitivity compared to the case of no test data, but only by a factor of ten. The estimated worst case rate of failure for untested boards is about 0.1 SEE/board-day. By employing the use of protons with energies near or above 200 MeV, this rate can be safely reduced to 0.01 SEE/board-day, with only those SEEs with deep charge collection mechanisms rising this high. For general SEEs, such as static random-access memory (SRAM) upsets, single-event transients (SETs), single-event gate ruptures (SEGRs), and similar cases where the relevant charge collection depth is less than 10 μm, the worst case rate for SEE is below 0.001 SEE/board-day. Note that these bounds assume that no SEEs are observed during testing. When SEEs are observed during testing, the board-level test method can establish a reliable event rate in some orbits, though all established rates will be at or above 0.001 SEE/board-day. The board-level test approach we explore has picked up support as a radiation hardness assurance technique over the last twenty years. The approach originally was used to provide a very limited verification of the suitability of low cost assemblies to be used in the very benign environment of the International Space Station (ISS), in limited reliability applications. Recently the method has been gaining popularity as a way to establish a minimum level of SEE performance of systems that require somewhat higher reliability performance than previous applications. This sort of application of the method suggests a critical analysis of the method is in order. This is also of current consideration because the primary facility used for this type of work, the Indiana University Cyclotron Facility (IUCF) (also known as the Integrated Science and Technology (ISAT) hall), has closed permanently, and the future selection of alternate test facilities is critically important. This document reviews the main theoretical work on proton testing of assemblies over the last twenty years. It augments this with review of reported data generated from the method and other data that applies to the limitations of the proton board-level test approach. When protons are incident on a system for test they can produce spallation reactions. From these reactions, secondary particles with linear energy transfers (LETs) significantly higher than the incident protons can be produced. These secondary particles, together with the protons, can simulate a subset of the space environment for particles capable of inducing single event effects (SEEs). The proton board-level test approach has been used to bound SEE rates, establishing a maximum possible SEE rate that a test article may exhibit in space. This bound is not particularly useful in many cases because the bound is quite loose. We discuss the established limit that the proton board-level test approach leaves us with. The remaining possible SEE rates may be as high as one per ten years for most devices. The situation is actually more problematic for many SEE types with deep charge collection. In cases with these SEEs, the limits set by the proton board-level test can be on the order of one per 100 days. Because of the limited nature of the bounds established by proton testing alone, it is possible that tested devices will have actual SEE sensitivity that is very low (e.g., fewer than one event in 1 × 10(exp 4) years), but the test method will only be able to establish the limits indicated above. This BoK further examines other benefits of proton board-level testing besides hardness assurance. The primary alternate use is the injection of errors. Error injection, or fault injection, is something that is often done in a simulation environment. But the proton beam has the benefit of injecting the majority of actual SEEs without risk of something being missed, and without the risk of simulation artifacts misleading the SEE investigation.
Space Studies Board Annual Report, 2003
The Space Studies Board is a unit of the NRC's Division on Engineering and Physical Sciences (DEPS), and it reports to the Division for oversight. DEPS is one of six major program units of the NRC through which the institution conducts its operations on behalf of the National Academy of Sciences, the National Academy of Engineering, and the Institute of Medicine. Within DEPS there are a total of 14 boards that cover a broad range of physical science and engineering disciplines and mission areas. Members of the DEPS Committee on Engineering and Physical Sciences provide advice on Board membership and advise on proposed new projects to be undertaken by the Board or its committees. Every 3 years the DEPS Committee also reviews the overall operations of each of its boards. The last review of the SSB was in 2001. The Board meets three times per year to review the activities of its committees and task groups and to be briefed on and discuss major space policy issues. An internal executive committee composed of seven at-large members of the Board meets at least once a year and may convene via conference call at other times to plan for SSB activities and to advise the chair between meetings. All projects proposed to be conducted by standing committees or ad hoctask groups must first be reviewed and approved by the Board or its executive committee, and the Board monitors the progress of the projects throughout the course of the studies.
Boards having solderless interconnects
This disclosure provides systems, methods, and apparatus related to printed circuit boards. In one aspect, a device includes a first board and a second board. The first board includes at least two pins defined at an end of the first board. The first pin and the second pin are positioned along a first line and parallel to the first line. The second board includes at least two slots defined at an end of the second board. The first slot and the second slot are positioned along a second line and are angled from the second line by about ±10° to 15°. Each of the pins in the first board is engaged with each of the slots in the second board and forms an electrical connection between the first pin and the first slot and the second pin and the second slot.
Printed wiring board system programmer's manual
The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.
Evaluation of telerobotic systems using an instrumented task board
An instrumented task board was developed at NASA Marshall Space Flight Center (MSFC). An overview of the task board design, and current development status is presented. The task board was originally developed to evaluate operator performance using the Protoflight Manipulator Arm (PFMA) at MSFC. The task board evaluates tasks for Orbital Replacement Unit (ORU), fluid connect and transfers, electrical connect/disconnect, bolt running, and other basic tasks. The instrumented task board measures the 3-D forces and torques placed on the board, determines the robot arm's 3-D position relative to the task board using IR optics, and provides the information in real-time. The PFMA joint input signals can also be measured from a breakout box to evaluate the sensitivity or response of the arm operation to control commands. The data processing system provides the capability for post processing of time-history graphics and plots of the PFMA positions, the operator's actions, and the PFMA servo reactions in addition to real-time force/torque data presentation. The instrumented task board's most promising use is developing benchmarks for NASA centers for comparison and evaluation of telerobotic performance.