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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

FIDES-II/P2M Simulation Exercise on AN3 and AN10 bump tests: main results

This paper presents simulations of bump tests conducted as part of the P2M (Power to Melt and Maneuverability) project within the OECD/NEA FIDES-II framework (Framework for Irradiation Experiments). To prepare fuel performance codes for analyzing the P2M experiments, an international Simulation Exercise (SE) was initiated under the P2M project. The objective of this exercise was to model the AN3 and AN10 bump tests carried out in the 1980s at the DR3 reactor (3rd RISØ Fission Gas Project), during which instrumented fuel rodlets (equipped with thermocouples and pressure sensors) were subjected to prolonged power transients and power dips. The ongoing simulation exercise involves seven organizations from industry, research, and regulatory bodies, each using different fuel performance codes. This paper provides detailed descriptions of the test cases and simulation results from six fuel performance codes (ALCYONE, BISON, FAST, FEMAXI, FRAPCON, and TRANSURANUS), with a particular focus on fission gas release kinetics.

11 - NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
NASA NTRS1976

A comparison of the aerodynamic characteristics at transonic speeds of four wing-fuselage configurations as determined from different test techniques, 4 October 1960

The high speed aerodynamic characteristics of a family of four wing-fuselage configurations of 0, 35, 45, and 60 deg sweepback were determined from transonic bump model tests that were conducted in the Langley high speed 7 by 10 foot tunnel; sting supported model tests were conducted in the Langley 8 foot high speed tunnel and in the Langley high speed 7 by 10 foot tunnel, and rocket model tests were conducted by the Langley Pilotless Aircraft Research Division. A complementary study of the effect of Mach number gradients and streamline curvature on bump results is also included. The qualitative data obtained from the various test facilities for the wing-fuselage configurations were in essential agreement as regards the relative effects of sweepback and Mach number except for drag at zero lift. Quantitatively, important differences were present.

Donlan, C. J.↗
NASA NTRS1973

The effects on cruise drag of installing long-duct refan-engine nacelles on the McDonnell Douglas DC-8-50 and -61

A high-speed wind tunnel test was conducted to determine the effect on cruise performance of installing long-duct refan-engine nacelles on the DC-8-50 and -61 models. Drag data and wing/pylon/nacelle channel pressure data are presented. At a typical cruise condition there exists a very small interference drag penalty of less than one-percent of total cruise data for the Refan installation. Pressure data indicate that some supersonic flow is present in the inboard channel of the inboard refan nacelle installation, but it is not sufficient to cause any wave drag on boundary layer separation. One pylon modification, which takes the form of pylon bumps, was tested. It resulted in a drag penalty, because its design goal of eliminating shock-related interference drag was not required and the bump thus became a source of additional parasite drag.

Callaghan, J. T.↗
NASA NTRS1992

Using color-color diagrams to test models for the 'blue bump'

Color-color diagrams are used to study the set of accretion disk plus power-law models and to determine whether they can adequately fit the optical/UV continua of a sample of 34 quasars, and the soft X-ray excesses measured for seven of the sample objects by Masnou et al. (1991). The loci of pure disk models for cos theta is greater than 0 are virtually superimposed on each other regardless of cos theta, demonstrating that a given observed spectrum cannot be described by a unique combination of S and cos theta. The distributions of model and data colors are found to overlap, showing that the disk plus power-law models do fit the distribution of data colors. For six of the seven objects, the soft X-ray excesses may be fit with an accretion disk plus power-law model without requiring the assumption of super-Eddington accretion; this shows the utility of employing Kerr disks.

Kuhn, O.↗
NASA NTRS1982

Sonic wind tunnel of the Institute of Fluid Mechanics of Lille

A 65 hp wind tunnel with a 40 mm by 240 mm airstream is described. This wind tunnel can achieve speeds in the neighborhood of the speed of sound, both subsonic and supersonic. It is useful in studying the transonic bump technique. The test section is 600 mm long. The side walls are made of transparent glass, and both the upper and lower walls are deformable, each through the use of nine jacks with elastic sleeves. So as to avoid condensation, the airstream's temperature is stabilized by an air exchanger at the temperature of the outside air. The first results for supersonic operation, the distribution of Mach numbers within the airstream between the parallel walls, the value of the use factor, and the diffuser's efficiency are all given.

Gontier, G.↗
NASA NTRS1952

The aerodynamic characteristics of a supersonic aircraft configuration with a 40 degree sweptback wing through a Mach number range from 0 to 2.4 obtained from various sources

A summary and analysis have been made of the results of various investigations to determine the aerodynamic characteristics of a supersonic aircraft configuration. The configuration has a wing with 40 degree sweepback at the quarter-chord line, aspect ratio 4, taper ratio 0.5, and 10-percent-thick circular-arc sections normal to the quarter-chord line. Experimental data were available for a Mach number range from 0.16 to 2.32. Results obtained from wing-flow, rocket-model, transonic-bump, and tunnel tests are presented and, where possible, are supplemented by empirical and theoretical calculations.

Spearman, M Leroy↗
DOE OSTI2025

The ETROC2 as the Final Version for CMS Endcap Timing Layer (ETL) Upgrade

The ETROC (Endcap Timing Readout Chip) is being developed for the LGAD-based CMS Endcap Timing Layer (ETL) at HL-LHC. The ETL on each side of the interaction region will be instrumented with a two-disk system of MIP-sensitive LGAD (Low Gain Avalanche Diodes) silicon devices, read out by ETROCs for precision timing measurement with down to ~30 ps timing resolution per track. The ETROC is designed to handle a 16 x 16 pixel cell matrix, with each pixel being 1.3 mm x 1.3 mm to match the LGAD sensor pixel size. The front-end design for preamplifier and discriminator has been specifically optimized for the reduced LGAD signals, with enough flexibilities to meet the ETL specific needs for time resolution, power budget and radiation profile. The ETROC chip is implemented in a commercial 65nm CMOS process. Each channel consists of a preamplifier, a discriminator, a TDC used for TOA (Time Of Arrival) and TOT (Time Over Threshold) measurements, and a memory for data storage and readout. An in-pixel auto threshold calibration is included, along with a self-testing pattern generator. The TOT is used for time-walk correction of the TOA measurement. The detailed hit information (TOA and TOT) from each cell will be read out from a local circular buffer after each Level-1 Accept (about 1 MHz). In addition, a charge injection circuit is implemented to allow for testing and calibration. For more detailed monitoring of the signal pulses, waveform sampling circuits are included for one pixel. The clock distribution is based on a 16x16 H-tree design with a shielding structure to alleviate potential interference. The global peripheral circuits include a PLL, a phase shifter, an I2C slave controller, a fast control block, a global readout, and a data driver along with an efuse and temperature sensor. The ETROC builds event data frames for each L1A selected event and is also capable of providing L1 trigger information for user-defined delayed hits. The main design challenge is how to extract precision timing information from the small LGAD signals in the presence of high irradiation fluence, while keeping the power consumption and digital activity low. The ETL design goal for the time resolution of 50 ps per hit is required to achieve a 35 ps arrival time measurement for a MIP particle, which has its track registered in two ETL disk layers. The LGAD contribution is known to be about 30 ps, this means that the jitter from the ETROC has to be kept below 40 ps. The ETROC2 is the first full size full functionality prototype design fully compatible with the final chip specifications for CMS ETL and now becomes the final version. The ETROC2 chips have been extensively tested. We will present here new testing results including the bump bonding yield improvement study, the time walk correction (TWC) generality study with one pixel TWC applying to all pixels, the final SEU testing using both heavy ion and proton beam, more beam test studies including different sensors, and readiness for the ETROC2 production for CMS ETL upgrade.

Liu, Tiehui [Fermilab] (ORCID:0009000765225605)↗
NASA NTRS1979

Design, processing and testing of LSI arrays: Hybrid microelectronics task

Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

Himmel, R. P.↗
NASA NTRS1984

PAN AIR prediction of NASA Ames 12-foot pressure wind-tunnel interference on a fighter configuration

Models tested in the NASA Ames 12-Foot Pressure Wind Tunnel over an angle of attack range from 0 deg to 90 deg are mounted on a floor strut that protrudes from a fairly large support bump. In high-angle-of-attack tests (angle of attack = 40 deg to 90 deg), for which the floor support was originally designed, the effects of the flow angularities produced by the bump are often negligible. This is not so for low-angle-of-attack tests (0 deg to 40 deg). Since there are no standard means for correcting test data for this bump effect, low-angle-of-attack testing with the bump is not recommended by the Ames wind-tunnel staff. This paper presents an exploratory study of a technique for correcting balance forces and experimental pressures for combined wall and bump effects. This is done by modeling the aircraft, wind-tunngl walls, and bump, with PAN AIR. The wall-and-bump-induced increments in the lift coefficient and pitching-moment coefficient predicted by PAN AIR are compared with increments obtained from the Ames 12-foot tunnel with the bump and an 8 x 12 low speed wind tunnel which has no bump.

Snyder, L. D.↗
NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗
NASA NTRS2012

High Enthalpy Studies of Capsule Heating in an Expansion Tunnel Facility

Measurements were made on an Orion heat shield model to demonstrate the capability of the new LENS-XX expansion tunnel facility to make high quality measurements of heat transfer distributions at flow velocities from 3 km/s (h(sub 0) = 5 MJ/kg) to 8.4 km/s (h(sub 0) = 36 MJ/kg). Thirty-nine heat transfer gauges, including both thin-film and thermocouple instruments, as well as four pressure gauges, and high-speed Schlieren were used to assess the aerothermal environment on the capsule heat shield. Only results from laminar boundary layer runs are reported. A major finding of this test series is that the high enthalpy, low-density flows displayed surface heating behavior that is observed to be consistent with some finite-rate recombination process occurring on the surface of the model. It is too early to speculate on the nature of the mechanism, but the response of the gages on the surface seems generally repeatable and consistent for a range of conditions. This result is an important milestone in developing and proving a capability to make measurements in a ground test environment and extrapolate them to flight for conditions with extreme non-equilibrium effects. Additionally, no significant, isolated stagnation point augmentation ("bump") was observed in the tests in this facility. Cases at higher Reynolds number seemed to show the greatest amount of overall increase in heating on the windward side of the model, which may in part be due to small-scale particulate.

Dufrene, Aaron↗
DOE OSTI2023

Targeted Particle Fractionation Technologies: Proof of Concept

Most methods of particle-size analysis involve particle fractionation which, is often done by filtration or the use of screens. This paper provides proof of concept testing for new in-pipe particle fractionation technologies that can be used at laboratory to industrial scales. These technologies are extensions of recent advancements in bump arrays as well as testing of new inline angled-to-the-flow slats, and advanced boycott-based Avalanche separation technologies. Experiments were conducted for three targeted particle fractionation technologies to evaluate the in-pipe removal of oversized sands in Newtonian slurries prior to the introduction of bump arrays. The mesofluidic system uses an array of staggered posts as configured in a bump array for Newtonian slurry conditions. The methods and results of these experiments are described in this paper. This information could be applied in most industrial and laboratory systems to rapidly remove oversized particles from a flowing slurry.

slurry, solids removal, particle fractionation, bu↗
DOE OSTI2025

Characterization of Fine-Pitch Interconnects for Long-Lifetime HI Applications

This conference talk discusses optimizing gold-gold and gold-ENIG fine-pitch interconnections for Heterogeneous Integration applications, with a focus on longevity. We first look at electrical data from gold-gold bumps subjected to highly accelerated lifetime testing. Then, we discuss using chemical and physical data as a predictor for ENIG bump flip-chip success.

Humphrey, Nicholas James [Sandia National Laborato↗
NASA NTRS1998

A 90 GHz Amplifier Assembled Using a Bump-Bonded InP-Based HEMT

We report on the performance of a novel W-band amplifier fabricated utilizing very compact bump bonds. We bump-bonded a high-speed, low-noise InP high electron mobility transistor (HEMT) onto a separately fabricated passive circuit having a GaAs substrate. The compact bumps and small chip size were used for efficient coupling and maximum circuit design flexibility. This new quasi-monolithic millimeter-wave integrated circuit (Q-MMIC) amplifier exhibits a peak gain of 5.8 dB at approx. 90 GHz and a 3 dB bandwidth of greater than 25%. To our knowledge, this is the highest frequency amplifier assembled using bump-bonded technology. Our bump-bonding technique is a useful alternative to the high cost of monolithic millimeter-wave integrated circuits (MMIC's). Effects of the bumps on the circuit appear to be minimal. We used the simple matching circuit for demonstrating the technology - future circuits would have all of the elements (resistors, via holes, bias lines, etc.) included 'in conventional MMIC's. Our design in different from other investigators' efforts in that the bumps are only 8 microns thick by 15 microns wide. The bump sizes were sufficiently small that the devices, originally designed for W-band hybrid circuits, could be bonded without alteration. Figure 3 shows the measured and simulated magnitude of S-parameters from 85-120 GHz, of the InP HEMT bump-bonded to the low noise amplifier (LNA) passive. The maximum gain is 5.8 dB at approx. 90 GHz, and gain extends to 117 GHz. Measurement of a single device (without matching networks) shows approx. 1 dB of gain at 90 GHz. The measured gain of the amplifier agrees well with the design in the center of the measurement band, and the agreement falls off at the band edges. Since no accommodation for the bump-bonding parasitics was made in the design, the result implies that the parasitic elements associated with the bonding itself do not dominate the performance of the LNA circuit. It should be noted that this amplifier was designed for good noise performance, which is why the input and output return losses are poorer than one would expect for an amplifier simply matched for gain. However, noise performance has not been measured at this time. While the agreement between modeled vs. experimental data is not exact, the data prove that bump-bonded technology can be used for amplifiers at frequencies at least as high as 100 GHz. JPL is pursuing this technology as a way to economically and quickly incorporate the best available HEMTs into a circuit with all of the reliability and circuit design flexibility offered by MMIC technology. We are currently using the technology to fabricate 4-stage, wide-band, W-band LNA's. We have also performed pull and shear tests which show that the bump bonds are sufficiently robust for any anticipated application.

Pinsukanjana, Paul R.↗