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At least 19 records

FIDES-II/P2M Simulation Exercise on AN3 and AN10 bump tests: main results

This paper presents simulations of bump tests conducted as part of the P2M (Power to Melt and Maneuverability) project within the OECD/NEA FIDES-II framework (Framework for Irradiation Experiments). To prepare fuel performance codes for analyzing the P2M experiments, an international Simulation Exercise (SE) was initiated under the P2M project. The objective of this exercise was to model the AN3 and AN10 bump tests carried out in the 1980s at the DR3 reactor (3rd RISØ Fission Gas Project), during which instrumented fuel rodlets (equipped with thermocouples and pressure sensors) were subjected to prolonged power transients and power dips. The ongoing simulation exercise involves seven organizations from industry, research, and regulatory bodies, each using different fuel performance codes. This paper provides detailed descriptions of the test cases and simulation results from six fuel performance codes (ALCYONE, BISON, FAST, FEMAXI, FRAPCON, and TRANSURANUS), with a particular focus on fission gas release kinetics.

11 - NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

The ETROC2 as the Final Version for CMS Endcap Timing Layer (ETL) Upgrade

The ETROC (Endcap Timing Readout Chip) is being developed for the LGAD-based CMS Endcap Timing Layer (ETL) at HL-LHC. The ETL on each side of the interaction region will be instrumented with a two-disk system of MIP-sensitive LGAD (Low Gain Avalanche Diodes) silicon devices, read out by ETROCs for precision timing measurement with down to ~30 ps timing resolution per track. The ETROC is designed to handle a 16 x 16 pixel cell matrix, with each pixel being 1.3 mm x 1.3 mm to match the LGAD sensor pixel size. The front-end design for preamplifier and discriminator has been specifically optimized for the reduced LGAD signals, with enough flexibilities to meet the ETL specific needs for time resolution, power budget and radiation profile. The ETROC chip is implemented in a commercial 65nm CMOS process. Each channel consists of a preamplifier, a discriminator, a TDC used for TOA (Time Of Arrival) and TOT (Time Over Threshold) measurements, and a memory for data storage and readout. An in-pixel auto threshold calibration is included, along with a self-testing pattern generator. The TOT is used for time-walk correction of the TOA measurement. The detailed hit information (TOA and TOT) from each cell will be read out from a local circular buffer after each Level-1 Accept (about 1 MHz). In addition, a charge injection circuit is implemented to allow for testing and calibration. For more detailed monitoring of the signal pulses, waveform sampling circuits are included for one pixel. The clock distribution is based on a 16x16 H-tree design with a shielding structure to alleviate potential interference. The global peripheral circuits include a PLL, a phase shifter, an I2C slave controller, a fast control block, a global readout, and a data driver along with an efuse and temperature sensor. The ETROC builds event data frames for each L1A selected event and is also capable of providing L1 trigger information for user-defined delayed hits. The main design challenge is how to extract precision timing information from the small LGAD signals in the presence of high irradiation fluence, while keeping the power consumption and digital activity low. The ETL design goal for the time resolution of 50 ps per hit is required to achieve a 35 ps arrival time measurement for a MIP particle, which has its track registered in two ETL disk layers. The LGAD contribution is known to be about 30 ps, this means that the jitter from the ETROC has to be kept below 40 ps. The ETROC2 is the first full size full functionality prototype design fully compatible with the final chip specifications for CMS ETL and now becomes the final version. The ETROC2 chips have been extensively tested. We will present here new testing results including the bump bonding yield improvement study, the time walk correction (TWC) generality study with one pixel TWC applying to all pixels, the final SEU testing using both heavy ion and proton beam, more beam test studies including different sensors, and readiness for the ETROC2 production for CMS ETL upgrade.

Liu, Tiehui [Fermilab] (ORCID:0009000765225605)↗

Targeted Particle Fractionation Technologies: Proof of Concept

Most methods of particle-size analysis involve particle fractionation which, is often done by filtration or the use of screens. This paper provides proof of concept testing for new in-pipe particle fractionation technologies that can be used at laboratory to industrial scales. These technologies are extensions of recent advancements in bump arrays as well as testing of new inline angled-to-the-flow slats, and advanced boycott-based Avalanche separation technologies. Experiments were conducted for three targeted particle fractionation technologies to evaluate the in-pipe removal of oversized sands in Newtonian slurries prior to the introduction of bump arrays. The mesofluidic system uses an array of staggered posts as configured in a bump array for Newtonian slurry conditions. The methods and results of these experiments are described in this paper. This information could be applied in most industrial and laboratory systems to rapidly remove oversized particles from a flowing slurry.

slurry, solids removal, particle fractionation, bu↗

Characterization of Fine-Pitch Interconnects for Long-Lifetime HI Applications

This conference talk discusses optimizing gold-gold and gold-ENIG fine-pitch interconnections for Heterogeneous Integration applications, with a focus on longevity. We first look at electrical data from gold-gold bumps subjected to highly accelerated lifetime testing. Then, we discuss using chemical and physical data as a predictor for ENIG bump flip-chip success.

Humphrey, Nicholas James [Sandia National Laborato↗

On-PIC Light Source Integration & Micro-dispensing of Solder Paste for Flip Chip Application

To reach the next level benefits of photonic integrated circuits (PICs), the Integrated Photonic Systems Roadmap-International describes the necessity of either heterogeneous or hybrid integration of light sources [1]. A new approach for hybrid integration is Photonic Wire Bonding where 3D nanolithography is used to pattern a polymer waveguide that connects light sources to PIC waveguides. The waveguides resemble electrical wire bonds and essentially do the same as their electrical counterpart for packaging photonic chips together. In order to reap the full benefits of a photonic wire bonds, the light source must be carefully packaged. In this work I seek to expand RIT’s photonic packaging capability by establishing a packaging process to integrate light sources, specifically an Indium Phosphide distributed feedback lasers and a reflective semiconductor optical amplifiers, directly onto a photonic integrated circuits. Another necessary requirement for PIC packaging is densely integrated electrical connectivity. In this thesis I developed a fine pitch flip chip interconnect technique demonstrated using gold stud bumps in conjunction with micro-dispensed solder paste. This work opens the door to high density photonic flip chip applications. The micro-dispensed solder paste dots having diameters 50-125 µm are currently being tested at a pitch of 150 µm . The gold stud bumps are formed with 1mil gold wire creating bumps with a diameter of 40-60 µm depending on specific parameter values. These capabilities will allow RIT to assemble and test novel photonic integrated devices, cutting down on the time and cost associated with third party assembly and tests facilities. Thereby keeping RIT at the forefront of photonic research.

Wongk, Nicole↗

Performance of a Front End prototype ASIC for picosecond precision time measurements with LGAD sensors

For the High-Luminosity phase of LHC, the ATLAS experiment is proposing the addition of a High Granularity Timing Detector (HGTD) in the forward region, to mitigate the effects of the increased pile-up. The chosen detection technology is Low Gain Avalanche Detector (LGAD) silicon sensors that can provide an excellent timing resolution below 50 ps. The front-end read-out ASIC must exploit the large signal derivative and small noise provided by the sensor, while keeping low power consumption. This paper presents the results on the first prototype of a front-end ASIC, named ALTIROC0, which contains the analog stages (preamplifier and discriminator) of the read-out chip. The ASIC was characterised both alone and as part of a module with a 2×2 LGAD array of 1.1×1.1 mm 2 pads bump-bonded to it. The various contributions of the electronics to the time resolution were investigated in test-bench measurements with a calibration setup. Both when the ASIC is alone or with a bump-bonded sensor, the jitter of the ASIC is better than 20 ps for an injected charge of 10 fC. The time walk effect, which arises from the different preamplifier response for various injected charges, can be corrected up to 10 ps using a Time Over Threshold measurement. The combined performance of the ASIC and the LGAD sensor, which was measured during a beam test campaign in October 2018 with pions of 120 GeV energy at the CERN SPS, is around 40 ps for all measured modules. All tested modules show good efficiency and time resolution uniformity.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Pixel-Strip Module Testing and Performance Analysis for the CMS Phase-2 Outer Tracker Upgrade

In response to the demanding environment of the High-Luminosity Large Hadron Collider (HL-LHC), the Compact Muon Solenoid (CMS) Experiment's Outer Tracker is being replaced with a lighter, higher-granularity, radiation-tolerant silicon detector capable of providing tracking information directly to the Level-1 trigger system. The new Outer Tracker consists of Pixel-Strip (PS) and Strip-Strip (2S) transverse momentum (pT) modules, which are assembled and tested at, among other centers, Fermilab's Silicon Detector Facility. PS modules consist of a pixel sensor, a strip sensor, and multiple application-specific integrated circuits (ASICs). This poster studies the performance of MaPSAs, silicon macro-pixel sensors bump-bonded to 16 macro-pixel ASICS. It presents the testing procedures for MaPSAs and MaPSA-strip sensor sub-assemblies, as well as the results of calibration and performance studies of two PS modules before and after irradiation. These results assess the impact of irradiation on module performance, providing insight into the modules' expected performance in the HL-LHC environment.

Kimrey, Emerson [Scripps College]↗

Beam-induced backgrounds measured in the ATLAS detector during local gas injection into the LHC beam vacuum

Inelastic beam-gas collisions at the Large Hadron Collider (LHC), within a few hundred metres of the ATLAS experiment, are known to give the dominant contribution to beam backgrounds. These are monitored by ATLAS with a dedicated Beam Conditions Monitor (BCM) and with the rate of fake jets in the calorimeters. These two methods are complementary since the BCM probes backgrounds just around the beam pipe while fake jets are observed at radii of up to several metres. In order to quantify the correlation between the residual gas density in the LHC beam vacuum and the experimental backgrounds recorded by ATLAS, several dedicated tests were performed during LHC Run 2. Local pressure bumps, with a gas density several orders of magnitude higher than during normal operation, were introduced at different locations. The changes of beam-related backgrounds, seen in ATLAS, are correlated with the local pressure variation. In addition the rates of beam-gas events are estimated from the pressure measurements and pressure bump profiles obtained from calculations. Using these rates, the efficiency of the ATLAS beam background monitors to detect beam-gas events is derived as a function of distance from the interaction point. These efficiencies and characteristic distributions of fake jets from the beam backgrounds are found to be in good agreement with results of beam-gas simulations performed with theFluka Monte Carlo programme.

43 PARTICLE ACCELERATORS↗

Direct Estimation of Parameters in ODE Models Using WENDy: Weak-Form Estimation of Nonlinear Dynamics

Abstract We introduce the Weak-form Estimation of Nonlinear Dynamics (WENDy) method for estimating model parameters for non-linear systems of ODEs. Without relying on any numerical differential equation solvers, WENDy computes accurate estimates and is robust to large (biologically relevant) levels of measurement noise. For low dimensional systems with modest amounts of data, WENDy is competitive with conventional forward solver-based nonlinear least squares methods in terms of speed and accuracy. For both higher dimensional systems and stiff systems, WENDy is typically both faster (often by orders of magnitude) and more accurate than forward solver-based approaches. The core mathematical idea involves an efficient conversion of the strong form representation of a model to its weak form, and then solving a regression problem to perform parameter inference. The core statistical idea rests on the Errors-In-Variables framework, which necessitates the use of the iteratively reweighted least squares algorithm. Further improvements are obtained by using orthonormal test functions, created from a set of $$C^{\infty }$$ C ∞ bump functions of varying support sizes.We demonstrate the high robustness and computational efficiency by applying WENDy to estimate parameters in some common models from population biology, neuroscience, and biochemistry, including logistic growth, Lotka-Volterra, FitzHugh-Nagumo, Hindmarsh-Rose, and a Protein Transduction Benchmark model. Software and code for reproducing the examples is available at https://github.com/MathBioCU/WENDy .

97 MATHEMATICS AND COMPUTING↗

ETROC2 as the Final Version for CMS MTD Endcap Timing Layer (ETL) Upgrade

The ETROC2 is the first full-size full-functionality prototype design fully compatible with the final chip specifications for CMS ETL. The ETROC2 chips have been extensively tested and the results have been presented at IEEE NSS MIC RTSD 2024. We will present here new results including the bump bonding yield improvement study, the time walk correction (TWC) generality study with single pixel TWC applied to all pixels, the final SEU testing results using both heavy ion and proton beam, more beam test studies including different sensors and irradiated sensors, and readiness for the ETROC2 production for CMS ETL upgrade.

Liu, Tie Hui [Fermilab] (ORCID:0009000765225605)↗

Beam test results for the Endcap Timing ReadOut Chip (ETROC2) for the CMS ETL upgrade

The Endcap Timing ReadOut Chip (ETROC) for the Compact Muon Solenoid (CMS) Minimum ionizing particle Timing Detector (MTD) is designed to process Low Gain Avalanche Diode (LGAD) signals with a time resolution of 40-50ps per hit, with 30-35 ps per charged particle using two layer detector. The ETROC2, is the first full size (16x16 pixels) and full functionally design that has been tested in hadron and electron beams at CERN and DESY (Sep 2023 - June 2024). Precision timing studies at these test beams are done using a self-referential beam telescope composed of up to 4 layers/chips. This talk describes the ETROC2 beam telescope and summarizes the performance of the ETROC2 chips bump-bonded to (16x16) Fondazione Bruno Kessler (FBK) and Hamamatsu Photonics K.K. (HPK) LGAD sensors using results from recent test beams. The experiences and lessons learned during the course of these test beams are also detailed in this talk.

Safdari, Murtaza↗

Thin-Entrance Window Process for Soft X-Ray Sensors

New free electron lasers, such as SLAC’s LCLS-II, will provide unique scientific imaging opportunities. In order to fully utilize these facilities, we need to develop detectors with shallow entrance windows that will enable detection of soft x-rays from 250 eV to 1.5 KeV. Achieving adequately shallow entrance windows is challenging because the high temperature anneal needed to activate the dopant also drives the dopant profile deeper, growing the region that is insensitive to soft x-rays. A new microwave annealing technology provides an efficient way to achieve shallow entrance windows in fully depleted high-resistivity silicon sensors. The microwave anneal technique can activate dopants at low substrate temperature, with minimal dopant diffusion, and can be used to fabricate both n-type and p-type entrance windows. SRP and SIMS measurements were used to verify dopant activation with negligible dopant diffusion. We then applied the microwave anneal process to a planar sensor wafer, using the new process to create the backside diode contact. Electrical test of the resulting sensors shows good reverse bias characteristics. The sensors have been bump-bonded to a read-out ASIC and used successfully to measure an Fe-55 x-ray spectrum. Process and device simulations were performed to characterize the quantum efficiency of the entrance window for soft x-rays. This technique is useful for other sensor applications requiring a shallow entrance window, including detectors for UV photons, low energy ions and low energy electrons.

47 OTHER INSTRUMENTATION↗

Measurement of the Spectral Shape of the $β$-Decay of 137 Xe to the Ground State of 137 Cs in EXO-200 and Comparison with Theory

Herein we report on a comparison between the theoretically predicted and experimentally measured spectra of the first-forbidden nonunique $β$-decay transition 137 Xe ( 7/2 - ) → 137 Cs ( 7/2 + ) . The experimental data were acquired by the EXO-200 experiment during a deployment of an AmBe neutron source. The ultralow background environment of EXO-200, together with dedicated source deployment and analysis procedures, allowed for collection of a pure sample of the decays, with an estimated signal to background ratio of more than 99 to 1 in the energy range from 1075 to 4175 keV. In addition to providing a rare and accurate measurement of the first-forbidden nonunique $β$-decay shape, this work constitutes a novel test of the calculated electron spectral shapes in the context of the reactor antineutrino anomaly and spectral bump.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies

Copper is a commonly used interconnect metal in microelectronic interconnects due to its exceptional electrical and thermal properties. Particularly in applications of the 2.5 and 3D integration, Cu is utilized in through-silicon-vias (TSVs) and flip chip interconnects between microelectronic chips for providing miniaturization, lower power and higher performance than current 2D packaging approaches. Furthermore, SnAg capped Cu pillars are a common high-density interconnect technology for flip chip bonding. For these interconnects, specific properties of the Cu surface, such as roughness and cleanliness, are an important factor in the process to ensure quality solder bumps. During electroplating, tight processing parameters must be met so that defects are avoided, and high bump uniformity is achieved. An understanding of the interactions at the solder and Cu pillar interface is needed, based on the electroplating parameters, to determine the best method for populating solder on the wafer surface. In this study, surface treatment techniques such as oxygen plasma cleaning were performed on the Cu surfaces and the SnAg plating chemistry for depositing the solder were evaluated through hull cell testing to qualitatively determine the range of current densities to investigate. It was observed that current density while plating played a large role in solder bump deposition morphology. At the higher current densities greater than 60 mA/cm 2 , bump height non-uniformity and dendritic growth are observed and at lower current densities, less than or equal to 60 mA/cm 2 , uniform, continuous bump height occurred.

36 MATERIALS SCIENCE↗

MaPSA Quality Control and AI-Enhanced Grading For the CMS Phase-II Tracker Upgrade

The Compact Muon Solenoid (CMS) experiment will undergo changes as part of the Large Hadron Collider upgrade. The CMS tracker will be upgraded to cope with the new radiation environment and to provide tracking at the first level trigger. This upgrade features a new type of silicon module called PS Module, which combines a Pixel sensor and a Strip sensor in the same module. The pixel portion of the PS module has a sensor bump bonded to 16 Macro Pixel ASICs (MPA) to form a Macro Pixel Sub Assembly (MaPSA). At Fermilab, MaPSAs are tested for quality control before being assembled with the strip sensors, readout and service electronics to form a PS Module. All of this test data is stored in a centralized database, and is used to grade the final module to determine if it will be installed in the detector. The Phase II Outer Tracker Analyzer of Test Outputs (POTATO) is the software that processes this data and determines the module grades. Using recent technologies, an AI agent is being im plemented into POTATO in order to allow users to more efficiently sort through the large amounts of analysis data and ensure that only the user specified data is being considered. This poster will display the process of testing a MaPSA, how that test data is relevant to module assembly and grading, and how the POTATO grading tool is being improved with the use of an embedded AI agent.

Gzamouranis, Olivia [Purdue U.]↗

IDAES-PSE 2.6.0 Release

The Institute for the Design of Advanced Energy Systems (IDAES) Integrated Platform is a versatile computational environment offering extensive process systems engineering (PSE) capabilities for optimizing the design and operation of complex, interacting technologies and systems. IDAES enables users to efficiently search vast, complex design spaces to discover the lowest cost solutions while supporting the full process modeling lifecycle, from conceptual design to dynamic optimization and control. The extensible, open platform empowers users to create models of novel processes and rapidly develop custom analyses, workflows, and end-user applications. IDAES-PSE 2.6.0 Release Highlights Upcoming Changes IDAES will be switching to the new Pyomo solver interface in the next release. Whilst this will hopefully be a smooth transition for most users, there are a few important changes to be aware of. The new solver interface uses a different version of the IPOPT writer (“ipopt_v2”) and thus any custom configuration options you might have set for IPOPT will not carry over and will need to be reset. By default, the new Pyomo linear presolver will be activated with ipopt_v2. Whilst are working to identify any bugs in the presolver, it is possible that some edge cases will remain. IDAES will begin deploying a new set of scaling tools and APIs over the next few releases that make use of the new solver writers. The old scaling tools and APIs will remain for backward compatibility but will begin to be deprecated. New Models, Tools and Features New Intersphinx extension automatically linking Jupyter notebook examples to project documentation New end-to-end diagnostics example demonstrated on a real problem New complementarity formulation for VLE with cubic equations of state, backward compatibility for old formulation New solver interface with presolve (ipopt_v2) in support of upcoming changes to the initialization and APIs methods, with default set to ipopt to maintain backwards compatibility; this will deprecate once all examples have been updated New forecaster and parameterized bidder methods within grid integration library Updated surrogates API and examples to support Keras 3, with backwards compatibility for older formats such as TensorFlow SavedModel (TFSM) Updated costing base dictionary to include the 2023 cost year index value Updated ProcessBlock to include information on the constructing block class Updated Flowsheet Visualizer to allow visualize() method to return value and functions Bug Fixes Fixed bug in the Modular Property Framework that would cause errors when trying to use phase-based material balances with phase equilibria. Fixed bug in Modular Properties Framework that caused errors when initializing models with non-vapor-liquid phase equilibria. Fixed typos flagged by June update to crate-ci/typos and removed DMF-related exceptions Minor corrections of units of measurement handling in power plant waste/transport costing expressions, control volume material holdup expressions, and BTX property package parameters Fixed throwing >7500 numpy deprecation warnings by replacing scalar value assignment with element extraction and item iteration calls Testing and Robustness Migrated slow tests (>10s) to integration, impacting test coverage but also yielding a nearly 30% decrease in local test runtime Pinned pint to avoid issues with older supported Python versions Pinned codecov versions to avoid tokenless upload behavior with latest version Bumped extensions to version 3.4.2 to allow pointing to non-standard install location Deprecations and Removals Python 3.8 is no longer supported. The supported Python versions are 3.9 through 3.12 The Data Management Framework (DMF) is no longer supported. Importing idaes.core.dmf will cause a deprecation warning to be displayed until the next release The SOFC Keras surrogates have been removed. The current version of the SOFC surrogate model in the examples repository is a PySMO Kriging model.

AS↗

Lycoris - A large-area, high resolution beam telescope

We note that a high-resolution beam telescope is one of the most important and demanding infrastructure components at any test beam facility. Its main purpose is to provide reference particle tracks from the incoming test beam particles to the test beam users, which allows measurement of the performance of the device-under-test (DUT). LYCORIS, a six-plane compact beam telescope with an active area of ~ 10 x 10 cm 2 (extensible to 10 x 20 cm 2 ) was installed at the DESY II Test Beam Facility in 2019, to provide a precise momentum measurement in a 1 T solenoid magnet or to provide tracking over a large area. The overall design of Lycoris will be described as well as the performance of the chosen silicon sensor. The 25 μm pitch micro-strip sensor used for Lycoris was originally designed for the SiD detector concept for the International Linear Collider. It adopts a second metallization layer to route signals from strips to the bump-bonded KPiX ASIC and uses a wire-bonded flex cable for the connection to the DAQ and the power supply system. This arrangement eliminates the need for a dedicated hybrid PCB. Its performance was tested for the first time in this project. The system has been evaluated at the DESY II Test Beam Facility in several test-beam campaigns and has demonstrated an average single-point resolution of 7.07 μm.

47 OTHER INSTRUMENTATION↗

Valley filtering in strain-induced α-$\mathcal{T}_3$ quantum dots

We test the valley filtering capabilities of a quantum dot inscribed by locally straining an α-$\mathcal{T}_3$ lattice. Specifically, we consider an out-of-plane Gaussian bump in the center of a four-terminal configuration and calculate the generated pseudo-magnetic field having opposite direction for electrons originating from different valleys, the resulting valley-polarized currents, and the conductance between the injector and collector situated opposite one another. Depending on the quantum dot’s width and width-to-height ratio, we detect different transport regimes with and without valley filtering for both the α-$\mathcal{T}_3$ and Dice lattice structures. In addition, we analyze the essence of the conductance resonances with high valley polarization in terms of related (pseudo) Landau levels, the spatial distribution of the local density of states and the local current densities. The observed local charge and current density patterns reflect the local inversion symmetry-breaking by the strain, besides the global inversion symmetry breaking due to the scaling parameter α. By this way we can also filter out different sublattices

36 MATERIALS SCIENCE↗