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At least 19 records

Recovery of Oxpure 612C-50 Coconut Carbon Particles Using Bump Arrays

Cyanide is used to leach gold from crushed ore (solid matrix) into a gold cyanide solution. The gold is extracted from the cyanide solution by adsorption onto activated carbon. The gold extraction process occurs when the activated coconut carbon is placed into tanks that contain the gold cyanide solution either in a batch process or into a continuous flow circuit. The coconut carbon is then removed from the solution for gold recovery. The use of the mesofluidic separation system (a deterministic lateral displacement system) can significantly reduce costs and waste generated from the process of removing the coconut carbon from the solution. In the coconut carbon recovery process used at many gold mines in Nevada, the gold is attached to carbon particles that are still in the cyanide liquor. The mesofluidic system can rapidly remove the gold bearing carbon particles from the cyanide liquor quickly and with no operating costs. The benefits include: • Reduce operational costs related to filtration and hydro-cyclones • Reduced acid usage for the elution gold stripping phase as only 25% of the fluids will follow the carbon particles to the final express lane when two mesofluidic systems are used in series This alternative particle removal techniques would be advantageous. A promising technique for removing larger particles from slurries is mesofluidic separation, similar to deterministic lateral displacement arrays or “bump” arrays [1] but operates at much larger flow rates. As described by Pease, et al. [2], “Bump arrays in deterministic lateral displacement devices separate large particles from small particles using arrays of staggered posts. Large particles, defined as those with radii larger than the distance between the edge of a post and the stagnation streamline from the next downstream post, must bump toward one side of the device, whereas particles smaller than this distance slalom from entrance to exit without net lateral displacement.” Unlike filters or sieves, the posts in the arrays that cause separation do not block or occlude particle flow but work because particles go around the posts. Unlike hydrocyclones separation, separation is not driven by particle density, because gravitational forces are unimportant to mesofluidic separation. Burns, et al., and Pease, et al., have shown that particles may be separated from complex suspensions, under turbulent flow conditions, and at industrially important flow rates [3-5]. They have also recently shown that mesofluidic devices may be arranged in series to increase separation performance [6]. In this paper, we evaluate the mesofluidic system for the separation of commercial OxPure GR 612 Charred Coconut shell particles as a proof of principle test for the rapid separation using the 1500 micron cut mesofluidic separator. We first describe the experimental system and conditions. We then present the experimental results. [1] Huang, L.R., E.C. Cox, R.H. Austin, J.C. Sturm. 2004. Continuous particle separation through deterministic lateral displacement. Science, 304, 987–990. https://doi.org/10.1126/science.1094567. [2] Pease L.F., J.A. Bamberger, C.A. Burns, and M.J. Minette. 2021. Large Particle Separation from Non-Newtonian Slurries using Bump Arrays. In Proceedings of the ASME 2021 Fluids Engineering Division Summer Meeting FEDSM2021-65904, V003T08A023. New York, New York: ASME. doi:10.1115/FEDSM2021-65904 [3] Burns C.A., T.G. Veldman, J. Serkowski, R.C. Daniel, X.-Y. Yu, M.J. Minette, L.F. Pease. 2021. Mesofluidic separation versus dead-end filtration. Separation and Purification Technology, 254, 117256. https://doi.org/10.1016/j.seppur.2020.117256. [4] Pease L.F., J.E. Serkowski, T.G. Veldman, J. Williams, X.-Y. Yu, M.J. Minette, J.A. Bamberger, C.A. Burns. 2021. Can Bump Arrays Separate Particles from Turbulent Flows?. In Proceedings of the ASME 2021 Fluids Engineering Division Summer Meeting FEDSM2021-67696, V003T08A024. New York, New York: ASME. doi:10.11

mesofluidic separation, slurry, bump array↗

Can Bump Arrays Separate Particles from Turbulent Flows?

In this paper, we evaluate the hypothesis that bump arrays can be used to separate particles from turbulent flows entering the array. Microfluidic bump arrays are known for separating particles by size from laminar inlet flows. However, turbulent inlet flows have not been explored but become important as microfluidic bump arrays are scaled up to mesofluidic bump arrays. We find experimentally that particle separation is indeed effective at higher Reynolds numbers. These experimental findings portend industrial scale particle separation due to the higher flow rates they facilitate.

Pease, Leonard F.↗

LARGE PARTICLE SEPARATION FROM NON-NEWTONIAN SLURRIES USING BUMP ARRAYS

Here we evaluate the performance of bump arrays to separate large particles from non-Newtonian slurries with Bingham and Cross rheology. Bump arrays in deterministic lateral displacement devices separate large particles from small particles using arrays of staggered posts. Large particles, defined as those with radii larger than the distance between the edge of a post and the stagnation streamline from the next downstream post, must bump toward one side of the device, whereas particles smaller than this distance slalom from entrance to exit. Although these devices have been used to separate a wide variety of large particles from blood cells to sand, partition of large particles from non-Newtonian fluids remains unexplored. Yet, an important set of modestly concentrated slurries, including Hanford nuclear waste, displays non-Newtonian rheology. Here we evaluate the influence of non-Newtonian rheology on the large-small particle size cutoff in bump arrays using a model that explores the influence of yield stresses, ratios of zero and infinite shear viscosities, and Cross’s exponent under strictly laminar well-developed conditions. Surprisingly, we find that viscosity ratios and Cross’s exponent make no significant difference on the particle cutoffs between large particles that bump and small particles that slalom around the posts from entrance to exit. In contrast, we find that yield stresses do significantly affect the size cutoff. As the yield stress increases, the velocity profiles become more plug like lowering the size cutoff. For nuclear waste separations where removing large particles is a priority, increasing yield stresses is conservative.

slurry, solids removal, deterministic later displa↗

Separating Oil-Water Mixtures Using Bump Arrays

Particle separation is an important process step across many fields. One technique being applied for separating solids such as blood components or sand particles from carrier fluids is the use of arrays of aligned posts called deterministic lateral arrays to bump particles to one side in the flow stream to enhance separation. This technique may be useful for separation of deformable particles. The ability to efficiently separate two-phase industrial (oil/water) mixtures is key for future use of valuable resources. Over 1 trillion gallons of petroleum production water could be reclaimed annually for reuse in the drought-ridden western US states. The ability to reclaim this petroleum production water may be critical for the Central High Plains (Colorado, Kansas, Oklahoma, Texas, and New Mexico). Trends in just the High Plains area already lost 20 to 25% of the irrigated farming area due to insufficient ground water storage to irrigate, and farmland losses are expected to grow to 40%. Proving this technology is key to reuse of petroleum production water for crop irrigation or to replace water from currently failing aquifers in rich agricultural lands of the Central High Plains. We conducted experiments applying mesofluidic separation for flowing two-phase (oil/water) mixtures. Experiments were conducted using oils of differing viscosities with water as the carrier fluid; separation was achieved over a range of oil-water concentrations. We describe the results of these experiments in this paper.

oil-water separation, micelle, droplet separation,↗

Experimental Results for Large Particle Separation from Non-Newtonian Slurries Using Tapered Bump Arrays

Lateral displacement arrays are useful for separating particles such as blood cells and sand from carrier fluids. These arrays consist of staggered posts, which allow smaller particles to follow streamlines and larger particles to flow around the posts and migrate to one side. This migration increases the particle concentration in one direction and depletes the particle concentration in the other direction allowing particle separation to occur. Experiments were conducted to separate large particles in non-Newtonian yield stress slurries using tapered bump arrays. The non-Newtonian slurry used was composed of a bentonite kaolin blend with the inclusion of larger diameter particles. These experiments were conducted to evaluate the performance of particle separation using a tapered array of staggered posts as configured in a bump array for non-Newtonian yield stress slurries, an application that has not been explored experimentally. A theory for large particle separation was developed for slurries that exhibit Bingham or Cross rheology. The results of these experiments are described. This information could be applied in industrial settings such as separation of particles from nuclear waste slurries including those to be processed at the Hanford site, where removing large particles from waste streams is important to processing.

slurry, solids removal, deterministic lateral disp↗

Comparing Experimental Results for Large Particle Separation from Non-Newtonian Slurries Using Full and Tapered Bump Arrays

To separate particles from carrier fluids arrays of staggered posts inserted into the flow stream can be employed. The smaller particles follow the flow stream while the larger particles move laterally to one side. During flow, the concentration of particulate increases in one direction and decreases in the other crosswise direction. This technique separates the particles from the carrier fluid. Experiments using a slurry with non-Newtonian rheology were conducted to evaluate large particle separation from the non-Newtonian carrier fluid using bump arrays. The bentonite kaolin clay slurry with non-Newtonian rheology was spiked with large diameter inert glass particles. Experiments with flow through lateral displacement arrays evaluated the performance of particle separation using two array configurations: a full array with all posts and a tapered array with posts removed in a triangular portion of the array past the rows of anticipated particle of separation. The posts are staggered posts to promote particle segregation to one side of the flow channel. Using this type of array for removing particles from non-Newtonian yield stress slurries is novel and we present unique results. In this paper, the performance of full and tapered arrays are compared. These results have many industrial applications including removing particles from slurries of nuclear waste. Large particle removal is an important step in waste processing.

slurry, solids removal, deterministic lateral disp↗

Targeted Particle Fractionation Technologies: Proof of Concept

Most methods of particle-size analysis involve particle fractionation which, is often done by filtration or the use of screens. This paper provides proof of concept testing for new in-pipe particle fractionation technologies that can be used at laboratory to industrial scales. These technologies are extensions of recent advancements in bump arrays as well as testing of new inline angled-to-the-flow slats, and advanced boycott-based Avalanche separation technologies. Experiments were conducted for three targeted particle fractionation technologies to evaluate the in-pipe removal of oversized sands in Newtonian slurries prior to the introduction of bump arrays. The mesofluidic system uses an array of staggered posts as configured in a bump array for Newtonian slurry conditions. The methods and results of these experiments are described in this paper. This information could be applied in most industrial and laboratory systems to rapidly remove oversized particles from a flowing slurry.

slurry, solids removal, particle fractionation, bu↗

Gravitational vortex disruption in mesofluidic separators

Typically, bump array devices separate submicrometer particles where gravitational effects remain small. However, as particle size increases from a few micrometers to hundreds of micrometers, gravitational effects become important and settling may induce vortex formation. Here, this article shows under laminar flow that these vortices suffice to disrupt flow fields, frustrating particle separation. The limiting diameter, above which vortices do form, is determined, and the dependence of the limiting diameter on viscosity, particle properties, and separator orientation is quantified.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Bump Bonding Using Metal-Coated Carbon Nanotubes

Bump bonding hybridization techniques use arrays of indium bumps to electrically and mechanically join two chips together. Surface-tension issues limit bump sizes to roughly as wide as they are high. Pitches are limited to 50 microns with bumps only 8-14 microns high on each wafer. A new process uses oriented carbon nanotubes (CNTs) with a metal (indium) in a wicking process using capillary actions to increase the aspect ratio and pitch density of the connections for bump bonding hybridizations. It merges the properties of the CNTs and the metal bumps, providing enhanced material performance parameters. By merging the bumps with narrow and long CNTs oriented in the vertical direction, higher aspect ratios can be obtained if the metal can be made to wick. Possible aspect ratios increase from 1:1 to 20:1 for most applications, and to 100:1 for some applications. Possible pitch density increases of a factor of 10 are possible. Standard capillary theory would not normally allow indium or most other metals to be drawn into the oriented CNTs, because they are non-wetting. However, capillary action can be induced through the ability to fabricate oriented CNT bundles to desired spacings, and the use of deposition techniques and temperature to control the size and mobility of the liquid metal streams and associated reservoirs. This hybridization of two technologies (indium bumps and CNTs) may also provide for some additional benefits such as improved thermal management and possible current density increases.

Lamb, James L.↗

Neuro-Prosthetic Implants With Adjustable Electrode Arrays

Brushlike arrays of electrodes packaged with application-specific integrated circuits (ASICs) are undergoing development for use as electronic implants especially as neuro-prosthetic devices that might be implanted in brains to detect weak electrical signals generated by neurons. These implants partly resemble the ones reported in Integrated Electrode Arrays for Neuro-Prosthetic Implants (NPO-21198), NASA Tech Briefs, Vol. 27, No. 2 (February 2003), page 48. The basic idea underlying both the present and previously reported implants is that the electrodes would pick up signals from neurons and the ASICs would amplify and otherwise preprocess the signals for monitoring by external equipment. The figure presents a simplified and partly schematic view of an implant according to the present concept. Whereas the electrodes in an implant according to the previously reported concept would be microscopic wires, the electrodes according to the present concept are in the form of microscopic needles. An even more important difference would be that, unlike the previously reported concept, the present concept calls for the inclusion of microelectromechanical actuators for adjusting the depth of penetration of the electrodes into brain tissue. The prototype implant now under construction includes an array of 100 electrodes and corresponding array of electrode contact pads formed on opposite faces of a plate fabricated by techniques that are established in the art of microelectromechanical systems (MEMS). A mixed-signal ASIC under construction at the time of reporting the information for this article will include 100 analog amplifier channels (one amplifier per electrode). On one face of the mixed-signal ASIC there will be a solder-bump/micro-pad array that will have the same pitch as that of the electrode array, and that will be used to make the electrical and mechanical connections between the electrode array and the ASIC. Once the electrode array and the ASIC are soldered together, the remaining empty space between them will be filled with a biocompatible epoxy, the remaining exposed portions of the ASIC will be covered with micromachined plates for protection against corrosive bodily fluids, and then the ASIC and its covering micromachined plates will be coated with parylene

Whitacre, Jay↗

Industrial scale mesofluidic particle separation

Here we explore the potential of a mesofluidic separator that fits within industrial piping and is designed to remove large aspherical particles out of an abrasive slurry at fast flow rates. Mesofluidic separators have recently demonstrated separation of spherical particles at flow rates of ~1 gallon/min (gpm) (6.3.10 -5 m 3 /s). Yet, the performance of these separators at flow rates achievable within industrial piping have not been explored. Here we evaluate the permeate flowrate fraction, large particle mass fraction, and pressure drop from approximately 35-100 gpm (2.2.10-3-6.3.10-3 m 3 /s) in a three inch tube using an abrasive and modestly non-spherical slurry. Faster flow rates may be achieved with larger pumps and larger diameters. We find the permeate fraction and pressure drop both increase with flow rate, though the pressure drop remains modest. Only two feet of inserts removed 97.6±2.1% of large particles for conditions tested. Separation was demonstrated in both vertical and horizontal orientations with the horizontal orientation benefiting marginally from gravitational settling.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Modeling Charge Collection in Detector Arrays

A detector array charge collection model has been developed for use as an engineering tool to aid in the design of optical sensor missions for operation in the space radiation environment. This model is an enhancement of the prototype array charge collection model that was developed for the Next Generation Space Telescope (NGST) program. The primary enhancements were accounting for drift-assisted diffusion by Monte Carlo modeling techniques and implementing the modeling approaches in a windows-based code. The modeling is concerned with integrated charge collection within discrete pixels in the focal plane array (FPA), with high fidelity spatial resolution. It is applicable to all detector geometries including monolithc charge coupled devices (CCDs), Active Pixel Sensors (APS) and hybrid FPA geometries based on a detector array bump-bonded to a readout integrated circuit (ROIC).

Hardage, Donna↗

CdZnTe Image Detectors for Hard-X-Ray Telescopes

Arrays of CdZnTe photodetectors and associated electronic circuitry have been built and tested in a continuing effort to develop focal-plane image sensor systems for hard-x-ray telescopes. Each array contains 24 by 44 pixels at a pitch of 498 m. The detector designs are optimized to obtain low power demand with high spectral resolution in the photon- energy range of 5 to 100 keV. More precisely, each detector array is a hybrid of a CdZnTe photodetector array and an application-specific integrated circuit (ASIC) containing an array of amplifiers in the same pixel pattern as that of the detectors. The array is fabricated on a single crystal of CdZnTe having dimensions of 23.6 by 12.9 by 2 mm. The detector-array cathode is a monolithic platinum contact. On the anode plane, the contact metal is patterned into the aforementioned pixel array, surrounded by a guard ring that is 1 mm wide on three sides and is 0.1 mm wide on the fourth side so that two such detector arrays can be placed side-by-side to form a roughly square sensor area with minimal dead area between them. Figure 1 shows two anode patterns. One pattern features larger pixel anode contacts, with a 30-m gap between them. The other pattern features smaller pixel anode contacts plus a contact for a shaping electrode in the form of a grid that separates all the pixels. In operation, the grid is held at a potential intermediate between the cathode and anode potentials to steer electric charges toward the anode in order to reduce the loss of charges in the inter-anode gaps. The CdZnTe photodetector array is mechanically and electrically connected to the ASIC (see Figure 2), either by use of indium bump bonds or by use of conductive epoxy bumps on the CdZnTe array joined to gold bumps on the ASIC. Hence, the output of each pixel detector is fed to its own amplifier chain.

Chen, C. M. Hubert↗

InSb arrays: Astronomy with a 32x32 CCD/development of a 58x62 DRO

Experience gained in operating infrared detector arrays for high sensitivity astronomical applications at the University of Rochester are summarized. Progress made in operating the 32 x 32 InSb array with bump-bonded Silicon CCD readout is described. Astronomical work done with the 32 x 32 camera is also described. Plans for the future, including improvements for the 32 x 32 camera system as well as implementing a new generation of 58 x 62 InSb array using switched-MOSFET direct readout multiplexing system in the place of the older CCD technology is discussed.

Forrest, W. J.↗

Fast Imaging Detector Readout Circuits with In-Pixel ADCs for Fourier Transform Imaging Spectrometers

Focal plane arrays (FPAs) with high frame rates and many pixels benefit several upcoming Earth science missions including GEO-CAPE, GACM, and ACE by enabling broader spatial coverage and higher spectral resolution. FPAs for the PanFTS, a high spatial resolution Fourier transform spectrometer and a candidate instrument for the GEO-CAPE mission are the focus of the developments reported here, but this FPA technology has the potential to enable a variety of future measurements and instruments. The ESTO ACT Program funded the developed of a fast readout integrated circuit (ROIC) based on an innovative in-pixel analog-to-digital converter (ADC). The 128 X 128 pixel ROIC features 60 ?m pixels, a 14-bit ADC in each pixel and operates at a continuous frame rate of 14 kHz consuming only 1.1 W of power. The ROIC outputs digitized data completely eliminating the bulky, power consuming signal chains needed by conventional FPAs. The 128 X 128 pixel ROIC has been fabricated in CMOS and tested at the Jet Propulsion Laboratory. The current version is designed to be hybridized with PIN photodiode arrays via indium bump bonding for light detection in the visible and ultraviolet spectral regions. However, the ROIC design incorporates a small photodiode in each cell to permit detailed characterization of the ROICperformance without the need for hybridization. We will describe the essential features of the ROIC design and present results of ROIC performance measurements.

focal plane arrays (FPAs)↗

Toward Large Field-of-view X-ray Spectrometers with Magnetic Microcalorimeters

A future X-ray telescope mission like Lynx, a X-ray flagship mission concept, requires a large field of view, high energy resolution, and high spatial resolution. The Magnetic Microcalorimeter (MMC) detectors we are developing for such a mission feature a 5-arcminute field of view, approximately 100,000 pixels, each spanning 0.5–1 arcsecond. These detectors require the readout of 8,000 sensors. Three different array types have been designed to meet scientific goals, two of which utilize thermal multiplexing to reduce the number of readout channels in a scheme called “Hydra.” We are currently fabricating detectors on a recently completed buried wiring wafer with connections to every sensor. The sensors are read out using a microwave multiplexer (μMUX) with flux ramp modulation. A single μMUX can read out approximately 1,000 sensors with only two feed lines. We will report on the test of the first two-dimensional μMUX chip, consisting of 78 resonators. μMUX chips that pass screening will be directly bonded to MMC array chips using indium bump bonding. In parallel, we have tested a kinetic inductance traveling wave parametric amplifier (KI-TWPA) to amplify signals at low temperatures. The KI-TWPA exhibits extremely low internal noise, approaching the standard quantum limit. Since the energy resolution of an MMC is primarily limited by the readout system, the KI-TWPA is an ideal amplifier for MMCs with μMUX readout. We recently measured the readout noise of a μMUX with a KI-TWPA, demonstrating its capability for reading out MMC arrays. We present the design and fabrication of the latest MMC detectors, along with its readout performance.

Magntic Microcalorimeters↗

A study of Si:In hybrid surface channel IRCCD devices

Hybrid silicon Infrared Charge Coupled Devices (IRCCDs) are evaluated for use as viable astronomical detectors. A Si:In photoconductor array which is bump-bonded to a silicon multiplexer is described. A summary of the device parameters is given.

Tollestrup, E.↗

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗