DOE OSTI2020
The first batches of ion traps patterned and coated were processed per the standard 3-step clean, air fire, and metallization processes. The third or fourth lot using this process resulted in poorly adhering metallization. Up until this point, the standard process was used to metallize and pattern ceramic ion traps without fail. At about the 4th batch of parts something changed. After the 5th batch, the ceramic ion traps received generally came with some unknown contamination that does not come off in a standard 3-step clean (Lenium Vapor Degreaser, Acetone, IPA) and air fire (860C for 1 hour) for which this process removes the vast majority of all contamination for most ceramic metallization. This is highly unusual. Using HF + Boiling H 2 O 2 is extreme for cleaning the ceramic ion traps. The contamination was never identified and is stubborn to effectively clean. Standard as-fired ceramic should be very easy to clean as if s fired at temperatures greater than 1400°C and not much in terms of contamination should exist at these temperatures, so there must be an intermediate step/process which is imparting this contamination. It is likely a polishing compound or previous polishing contaminant, but also not easily visually distinguishable until after metallization. The halo marks observed on parts might be fingerprints (less likely) or potential polishing marks (more likely) as metallization typically doesn't cover/hide any damage or contamination, but rather quite clearly the opposite, it accentuates it. Blotchy appearances in the metallization usually indicated an adhesion issue. As a result of the fragility of the parts (yield loss due to handling) and difficulty in identifying the contamination during cleaning, we have taken a conservative approach of HF + H 2 O 2 cleaning for all batches after the contamination and adhesion issues were identified.