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Results for “CONTACT RESISTANCE”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1978

A two dimensional analysis of sheet resistance and contact resistance effects in solar cells

A computer model is developed to study the two-dimensional nature of the sheet resistance and contact resistance effects in solar cells. A major result is the demonstration that the distributed nature of the semiconductor sheet resistance causes the terminal dark I-V characteristics to exhibit an exp(qV/2kT) type dependence even when the one-dimensional characteristics of the cell exhibit an exp(qV/kT) type voltage dependence. The analytical model which is developed provides an easy method for estimating the sheet resistance of a solar cell from the terminal I-V data.

Fang, C. R.↗
NASA NTRS1991

Low resistivity contacts to YBa2Cu3O(7-x) superconductors

Silver, gold, platinum, and palladium metals were investigated as electroding materials for the YBa2Cu3O(7-x) superconductors. Painting, embedding, and melting techniques were used to apply the electrodes. Contact resistivities were determined by: (1) type of electrode; (2) firing conditions; and (3) application method. Electrodes fired for long times exhibited lower contact resistivities than those fired for short times. Low-resistivity contacts were found for silver and gold electrodes. Silver, which made good ohmic contact to the YBa2Cu3O(7-x) superconductor with low contact resistivities was found to be the best electroding material among the materials evaluated in this investigation.

Hsi, Chi-Shiung↗
NASA NTRS1994

Low resistance contacts for shallow junction semiconductors

A method of enhancing the specific contact resistivity in InP semiconductor devices and improved devices produced thereby are disclosed. Low resistivity values are obtained by using gold ohmic contacts that contain small amounts of gallium or indium and by depositing a thin gold phosphide interlayer between the surface of the InP device and the ohmic contact. When both the thin interlayer and the gold-gallium or gold-indium contact metallizations are used, ultra low specific contact resistivities are achieved. Thermal stability with good contact resistivity is achieved by depositing a layer of refractory metal over the gold phosphide interlayer.

Fatemi, Navid S.↗
NASA NTRS1991

A new method for measuring low resistivity contacts between silver and YBa2Cu3O(7-x) superconductor

Several methods of measuring contact resistivity between silver electrodes and YBa2Cu3O(7-x) superconductors were investigated; including the two-point, the three point, and the lap-joint methods. The lap-joint method was found to yield the most consistent and reliable results and is proposed as a new technique for this measurement. Painting, embedding, and melting methods were used to apply the electrodes to the superconductor. Silver electrodes produced good ohmic contacts to YBa2Cu3O(7-x) superconductors with contact resistivities as low as 1.9 x 10 to the -9th ohm sq cm.

Hsi, Chi-Shiung↗
NASA NTRS1993

Simple, extremely low resistance contact system to n-InP that does not exhibit metal-semiconductor intermixing during sintering

Contact formation to InP is plagued by the violent metal-semiconductor intermixing that takes place during the contact sintering process. We have discovered a truly unique contact system, involving Au and Ge, which is easily fabricated, which exhibits extremely low values of contact resistivity, and in which there is virtually no metal-semiconductor interdiffusion, even after extended sintering. We present a description of this contact system and suggest possible mechanisms to explain the observed behavior.

Weizer, Victor G.↗
NASA NTRS1994

Computing Misalignments From Measured Contact Resistances

Misalignments of contacts in integrated circuits computed, and measured contact resistances corrected for effects of misalignments by use of method based on relatively simple mathematical model of measured contact resistance. Flange resistance of aligned contact multiplied by semiempirical factor. Method particularly useful in estimating effects of misalignments on four- and six-terminal (Kelvin-tap) contact-resistance measurements taken with L-shaped test structures.

Lieneweg, Udo↗
NASA NTRS1991

Improvements in contact resistivity and thermal stability of Au-contacted InP solar cells

Specific contact resistivities for as-fabricated Au contacts on n-p InP solar cells are typically in the 10(exp -3) ohm/sq cm range, but contact resistivities in the 10(exp -6) ohm/sq cm range can be obtained if the cells are heat treated at 400 C for a few minutes. This heat treatment, however, results in a dramatic drop in the open circuit voltage of the cell due to excessive dissolution of the emitter into the metallization. It was found that low values of contact resistivity can be secured without the accompanying drop in the open circuit voltage by adding Ga and In in the Au metallization. It is shown that Au contacts containing as little as 1 percent atomic Ga can suppress the reaction that takes place at the metal-InP interface during heat treatment, while exhibiting contact resistivity values in the low 10(exp -5) ohm/sq cm. Detailed explanations for the observed superior thermal stability of these contacts are presented.

Fatemi, Navid S.↗
NASA NTRS1988

Rugged low-resistance contacts to YBa2Cu3O(x)

Rugged low-resistance contacts to a high-T(c) superconductor YBa2Cu3O(x) were made by melting gold onto the sample surface, where it diffused into the sample pores making a strong mechanical contact in the form of a bead. Contact resistances lower than 50 microohm were obtained, allowing passage, without heating, of a direct current of about 5 A while the sample remained in the superconducting state at 20 K. Results of SEM and of contact-resistance, critical-current, and shear-strength measurements on these contacts are included.

Caton, R.↗
NASA NTRS1985

Measuring The Contact Resistances Of Photovoltaic Cells

Simple method devised to measure contact resistances of photovoltaic solar cells. Method uses readily available equipment and applicable at any time during life of cell. Enables evaluation of cell contact resistance, contact-end resistance, contact resistivity, sheet resistivity, and sheet resistivity under contact.

Burger, D. R.↗
NASA NTRS1988

Effects of oxidation and roughness on Cu contact resistance from 4 to 290 K

Knowledge of the factors influencing contact resistance is important for optimizing system design in cryogenic applications. In space cryogenics, indirect cooling of infrared components is the primary concern. The presence of bolted joints results in contact resistances which can dominate all other contributions to the overall heat transfer rate. Here, thermal and electrical contact resistances measured between 4 K and 290 K for a series of bolted OFHC Cu contacts are reported. Surface roughness is found to have little effect on the overall contact resistance within the experimental limits, while oxidation can increase the contact resistance by as much as a factor of 100. Thermal and electrical contact resistances measured on the same contact show that the contact resistance temperature dependence does not follow the bulk dependence. For example, the residual resistance ratio (RRR) of the OFHC Cu is 110, but for contacts made from this material, the RRR is about two.

Nilles, M. J.↗
NASA NTRS1988

Extremely low nonalloyed and alloyed contact resistance using an InAs cap layer on InGaAs by molecular-beam epitaxy

Extremely low alloyed and nonalloyed ohmic contact resistances have been formed on n-type InAs/In(0.53)Ga(0.47)As/In(0.52)Al(0.48)As structures grown on InP(Fe) by molecular-beam epitaxy. To insure the accuracy of the small contact resistances measured, an extended transmission line model was used to extrapolate contact resistances from test patterns with multiple gap spacings varying from 1 to 20 microns. For a 150-A-thick InAs layer doped to 2 x 10 to the 18th/cu cm and a 0.1-micron-thick InGaAs layer doped to 1 x 10 to the 18th/cu cm, a specific contact resistance of 2.6 x 10 to the -8th ohm-asterisk sq cm was measured for the nonalloyed contact, while a resistance less than 1.7 x 10 to the -8th ohm-asterisk sq cm is reported for the alloyed contact. Conventional Au-Ge/Ni/Au was used for the ohmic metal contact and alloying was performed at 500 C for 50 s in flowing H2. Using a thermionic field emission model, the barrier height at the InAs/InGaAs interface was calculated to be 20 meV.

Peng, C. K.↗
NASA NTRS1978

An exact derivation of contact resistance to planar devices

A mixed boundary-value problem is formulated for an imperfect rectangular contact to a semiconducting sheet (layer). An exact model for derivation of contact resistance is developed and its solution by conformal mapping and eigenfunction expansion is presented. The expression for contact resistance is similar to that for a perfect (lossless) contact but includes an additional term containing the lowest-order coefficient in the infinite series expansion of the complex potential function. The calculated contact resistances are compared with those obtained from three approximate models: lossless contact, transmission line, and extended transmission line models. The extended transmission line model appears to be a very satisfactory approximation provided the ratio of contact length to sheet thickness is no less than 0.5.

Schuldt, S. B.↗
NASA NTRS1980

Significance of thermal contact resistance in two-layer thermal-barrier-coated turbine vanes

The importance of thermal contact resistance between layers in heat transfer through two layer, plasma sprayed, thermal barrier coatings applied to turbine vanes was investigated. Results obtained with a system of NiCrAlY bond and yttria stabilized zirconia ceramic show that thermal contact resistance between layers is negligible. These results also verified other studies which showed that thermal contact resistance is negligible for a different coating system of NiCr bond calcia stabilized zirconia ceramic. The zirconia stabilized ceramic thermal conductivity data scatter presented in the literature is ?20 to -10 percent about a curve fit of the data. More accurate predictions of heat transfer and metal wall temperatures are obtained when the thermal conductivity values are used at the ?20 percent level.

Liebert, C. H.↗