CSP Reliability for Single-and Double-Sided Assemblies
This paper reviews the package trend towards further miniaturization of emerging chip scale package (CSP).
CSP chip scale package thermal cycle solder joint ↗
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Effect of thermal cycling ramp rate on CSP assembly reliability
A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.
accelerated thermal cycle chip scale package solde↗