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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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A report that investigates the long-term reliability and aging characteristics of chip-on-board LEDs over the operating lifetime.
Light modules and methods of forming light modules are disclosed. A light module includes a first plurality and a second plurality of light emitting elements configured to emit, respectively, a first light and a second light, and both arranged on a substrate. An encapsulation layer is disposed over the first and second plurality of the light emitting elements, and a wavelength converting element is dispersed in the encapsulation layer. A concentration of the wavelength converting element in the encapsulation layer varies, is larger over the first plurality of light emitting elements and is smaller over the second plurality of light emitting elements.
Ultra-Fast timing detectors, having a time resolution of 10pSec or less, are becoming increasingly important for many scientific disciplines, including High Energy Physics, Nuclear Physics, Medical Imaging and more. When developing ultra-fast detectors such as MCPs, LAPPDs, LGADs, SNSPDs, it is necessary to have access to a readout system that is low power, can support many channels and is cost effective. The PSEC5 chip was an application specific integrated circuit (ASIC) developed by the pioneering group of Prof. Henry Frisch at University of Chicago and micro electronic engineers at Fermi National Accelerator Laboratory. Three boards were designed, two to implement the readout system for an LAPPD and one to only characterize the PSEC1 chip. The main goal of the project shifted to setting up a testing environment to focus on the characterization of the chip. My student and I tested and characterized this ASIC using the third chip-on-board printed circuit board. Results show the successful fabrication and operation of some of the key building blocks and lead to the suggestions on modification for the second iteration of the chip.