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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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4 records
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NASA NTRS2015

Layered Thermal Insulation Systems for Industrial and Commercial Applications

From the high performance arena of cryogenic equipment, several different layered thermal insulation systems have been developed for industrial and commercial applications. In addition to the proven areas in cold-work applications for piping and tanks, the new Layered Composite Insulation for Extreme Environments (LCX) has potential for broader industrial use as well as for commercial applications. The LCX technology provides a unique combination of thermal, mechanical, and weathering performance capability that is both cost-effective and enabling. Industry applications may include, for example, liquid nitrogen (LN2) systems for food processing, liquefied natural gas (LNG) systems for transportation or power, and chilled water cooling facilities. Example commercial applications may include commercial residential building construction, hot water piping, HVAC systems, refrigerated trucks, cold chain shipping containers, and a various consumer products. The LCX system is highly tailorable to the end-use application and can be pre-fabricated or field assembled as needed. Product forms of LCX include rigid sheets, semi-flexible sheets, cylindrical clam-shells, removable covers, or flexible strips for wrapping. With increasing system control and reliability requirements as well as demands for higher energy efficiencies, thermal insulation in harsh environments is a growing challenge. The LCX technology grew out of solving problems in the insulation of mechanically complex cryogenic systems that must operate in outdoor, humid conditions. Insulation for cold work includes equipment for everything from liquid helium to chilled water. And in the middle are systems for LNG, LN2, liquid oxygen (LO2), liquid hydrogen (LH2) that must operate in the ambient environment. Different LCX systems have been demonstrated for sub-ambient conditions but are capable of moderately high temperature applications as well.

thermal conductivity↗
NASA NTRS2009

Assessment of Tropical Cyclone Induced Transgression of the Chandeleur Islands for Restoration and Wildlife Management

The Chandeleur Islands are the first line of defense against tropical storms and hurricanes for coastal Louisiana. They provide habitats for birds species and are a wildlife refuge; however, distressingly, they are eroding and transgressing at an alarming rate. In 1998, Hurricane Georges caused severe damage to the chain, prompting restoration and monitoring efforts by both Federal and State agencies. Since then, storm events have steadily diminished the condition of the islands. Quantification of shoreline erosion, vegetation, and land loss, from 1979 to 2009, was achieved through the analysis of imagery from Landsat 2-4 Multispectral Scanner, Landsat 4 & 5 Thematic Mapper, and Advanced Spaceborne Thermal Emission and Reflection Radiometer sensors. QuickBird imagery was used to validate the accuracy of these results. In addition, this study presents an application of Moderate Resolution Imaging Spectroradiometer data to assist in tracking the transgression of the Chandeleur Islands. The use of near infrared reflectance calculated from MOD09 surface reflectance data from 2000 to 2009 was analyzed using the Time Series Product Tool. The scope of this project includes not only assessments of the tropical cyclonic events during this time period, but also the effects of tides, winds, and cold fronts on the spatial extent of the islands. Partnering organizations, such as the Pontchartrain Institute for Environmental Research, will utilize those results in an effort to better monitor and address the continual change of the island chain.

Mitchell, Brandie↗
NASA NTRS2005

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗
NASA NTRS2013

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Ramesham, Rajeshuni↗