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Results for “Compressive stress”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1942

Effect of Normal Pressure on the Critical Compressive Stress of Curved Sheet

Results are presented of tests of two specimens tested to study the effect of normal pressure on the critical compressive stress for thin curved sheets. These specimens are designated by their respective rib spacings of 10 inches and 30 inches. The relationship between compressive stress and normal pressure at which buckles disappeared is independent of whether the buckles were made to disappear by increase of normal pressure or decrease of compressive stress. (author)

Rafel, Norman↗
NASA NTRS1942

Critical Compressive Stress for Outstanding Flanges

A chart is presented for the values of the coefficient in the formula for the critical compressive stress at which buckling may be expected to occur in outstanding flanges. These flanges are flat rectangular plates supported along the loaded edges, supported and elastically restrained along one unloaded edge, and free along the other unloaded edge. The mathematical derivations of the formulas required for construction of the chart are given.

Lundquist, Eugene E↗
NASA NTRS1941

Critical Compressive Stress for Outstanding Flanges

A chart is presented for the values of the coefficient in the formula for the critical compressive stress at which buckling may be expected to occur in outstanding flanges. These flanges are flat rectangular plates supported along the Loaded edges, supported and elastically restrained along one unloaded edge, and free along the other unloaded edge. The mathematical derivations of the formulas required for the construction of the chart are given.

Lundquist, Eugene E.↗
NASA NTRS2012

Effect of Compressive Stresses on Leakage Currents in Microchip Tantalum Capacitors

Microchip tantalum capacitors are manufactured using new technologies that allow for production of small size capacitors (down to EIA case size 0402) with volumetric efficiency much greater than for regular chip capacitors. Due to a small size of the parts and leadless design they might be more sensitive to mechanical stresses that develop after soldering onto printed wiring boards (PWB) compared to standard chip capacitors. In this work, the effect of compressive stresses on leakage currents in capacitors has been investigated in the range of stresses up to 200 MPa. Significant, up to three orders of magnitude, variations of currents were observed after the stress exceeds a certain critical level that varied from 10 MPa to 180 MPa for capacitors used in this study. A stress-induced generation of electron traps in tantalum pentoxide dielectric is suggested to explain reversible variations of leakage currents in tantalum capacitors. Thermo-mechanical characteristics of microchip capacitors have been studied to estimate the level of stresses caused by assembly onto PWB and assess the risk of stress-related degradation and failures. Keywords: tantalum capacitors, leakage current, soldering, reliability, mechanical stress.

Teverovsky, Alexander↗
NASA NTRS1942

Critical Compressive Stress for Flat Rectangular Plates Supported Along All Edges and Elastically Restrained Against Rotation along the Unloaded Edges

A chart is presented for the values of the coefficient in the formula for the critical compressive stress at which buckling may be expected to occur in flat rectangular plates supported along all edges and, in addition, elastically restrained against rotation along the unloaded edges. The mathematical derivations of the formulas required in the construction of the chart are given.

Lundquist, Eugene E↗
NASA NTRS1941

Critical Compressive Stress for Flat Rectangular Plates Supported Along all Edges and Elastically Restrained Against Rotation Along the Unloaded Edges, Special Report 189

A chart is presented for the values of the coefficient in the formula for the critical compressive stress at which buckling may be expected to occur in flat rectangular plates supported along all edges and, in addition, elastically restrained against rotation along the unloaded edges. The mathematical derivations of the formulas required in the construction of the chart are given.

Lundquist, Eugene E.↗
NASA NTRS1982

Wrinkling of Stretched Films: Compressive Stress

Recent report presents derivation of equations of motion for wrinkles forming in planar films under compressive in-plane stress. Study was prompted by wrinkling of thin film solar-cell arrays with consequent reduction in collection efficiency. Lack of adequate theoretical understanding made it difficult to design large film structures and specify oscillation tests for large solar array systems.

Zak, M. A.↗
NASA NTRS1987

A loading system for creep testing under constant compressive stress

A critical analysis is made of layouts assuring constant stress under creep, pointing out the difficulties of using these layouts for compressive testing. A new mechanical system to maintain stress during creep testing is proposed. Constant stress is achieved by a definite motion of the load. The proposed system can be used in tensile or compressive testing. Practical measurements reveal that the stress constancy error is not greater than plus or minus 1.5 percent up to relative deformation of 30 percent.

Dobes, F.↗
NASA NTRS1938

Behavior of a plate strip under shear and compressive stresses beyond the buckling limit

The present report is an extension of previous theoretical investigations on the elastic behavior of a plate under compression and shear in the region above the critical. The main object is the clarification of the behavior immediately above the buckling limit since no theoretical expressions for this range have thus far been found and since experimentally, too, any degree of regularity in the behavior of the plate in the range between the critical load and about three to four times the critical, is discernible only with difficulty.

Kromm, A↗
NASA NTRS1983

Correlation of compressive stress with spalling of plasma sprayed ceramic materials

Ceramics on metal substrates for potential use as high temperature seals or other applications are exposed to forces originating from differences in thermal expansion between the ceramic and the metal substrate. This report develops a relationship between the difference in expansion of the ceramic and the substrate, defines conditions under which shear between the ceramic and the substrate occurs, and those under which bending forces are produced in the ceramic. The off-axis effect of compression forces resulting from high temperature plastic flow of the ceramic producing buckling of the ceramic is developed. Shear is associated with the edge or boundary stresses on the component while bending is associated with the distortion of an interior region. Both modes are significant in predicting life of the ceramic.

Mullen, R. L.↗