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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

The thermal fatigue resistance of H-13 Die Steel for aluminum die casting dies

The effects of welding, five selected surface coatings, and stress relieving on the thermal fatigue resistance of H-13 Die Steel for aluminum die casting dies were studied using eleven thermal fatigue specimens. Stress relieving was conducted after each 5,000 cycle interval at 1050 F for three hours. Four thermal fatigue specimens were welded with H-13 or maraging steel welding rods at ambient and elevated temperatures and subsequently, subjected to different post-weld heat treatments. Crack patterns were examined at 5,000, 10,000, and 15,000 cycles. The thermal fatigue resistance is expressed by two crack parameters which are the average maximum crack and the average cracked area. The results indicate that a significant improvement in thermal fatigue resistance over the control was obtained from the stress-relieving treatment. Small improvements were obtained from the H-13 welded specimens and from a salt bath nitrogen and carbon-surface treatment. The other surface treatments and welded specimens either did not affect or had a detrimental influence on the thermal fatigue properties of the H-13 die steel.

Source record↗
NASA NTRS1981

Sputtered protective coatings for die casting dies

This investigation determined whether selected ion beam sputtered coatings on H-13 die steel would have the potential of improving the thermal fatigue behavior of the steel used as a die in aluminum die casting. The coatings were selected to test candidate insulators and metals capable of providing protection of the die surface. The studies indicate that 1 micrometer thick W and Pt coatings reduced the thermal fatigue more than any other coating tested and are candidates to be used on a die surface to increase die life.

Mirtich, M. J.↗
DOE OSTI2022

A New Recycled Al–Si–Mg Alloy for Sustainable Structural Die Casting Applications

The use of secondary aluminum for structural components in the automotive industry is limited by the high Fe contents in recycled alloys which often result in the formation of brittle β-Al 5 FeSi phase which reduces the ductility of aluminum castings. In this study, a new secondary Al-Si-Mg alloy with high Fe content (about 0.44 wt.%) was developed for die casting applications. Based on thermodynamic modeling, manganese was added to obtain a designed Fe-to-Mn ratio of 2 which successfully suppressed the formation of β-Al 5 FeSi phase, by forming α-Al 15 (Fe,Mn) 3 Si 2 phase with rounded or hexagonal morphology. Additionally, a fine needle-like π-Al 8 FeMg 3 Si 2 phase was also formed within the eutectic regions. The new recycled alloy showed comparable mechanical properties in as-cast and heat treated (T5 and T6) conditions to three major primary die cast alloys (≤ 0.2 wt.% Fe) with similar composition. Ductility up to 7.4% from tensile elongation was achieved in as-cast recycled alloy due to the modification and refinement of α-Al 15 (Fe,Mn) 3 Si 2 by Mn and Sr additions. Tensile elongation was further improved to 9.1% after T6 treatment as a result of dissolution of π-Al 8 FeMg 3 Si 2 phase, defragmentation of α-Al 15 (Fe,Mn) 3 Si 2 and the spheroidization of Si phase. This new alloy provides a promising path for increasing usage of recycled aluminum with high Fe content in structural die castings for automotive and other applications.

36 MATERIALS SCIENCE↗
NASA NTRS1981

Sputtered protective coatings for die casting dies

Three experimental research designs investigating candidate materials and processes involved in protective die surface coating procedures by sputter deposition, using ion beam technologies, are discussed. Various pre-test results show that none of the coatings remained completely intact for 15,000 test cycles. The longest lifetime was observed for coatings such as tungsten, platinum, and molybdenum which reduced thermal fatigue, but exhibited oxidation and suppressed crack initiation only as long as the coating did not fracture. Final test results confirmed earlier findings and coatings with Pt and W proved to be the candidate materials to be used on a die surface to increase die life. In the W-coated specimens, which remained intact on the surface after thermal fatigue testing, no oxidation was found under the coating, although a few cracks formed on the surface where the coating broke down. Further research is planned.

Mirtich, M. J.↗
NASA NTRS1981

Thermal fatigue behavior of H-13 die steel for aluminum die casting with various ion sputtered coatings

Sputtered coatings of Mo, W, Pt, Ag, Au, Co, Cr, Ni, Ag + Cu, Mo + Pt, Si3N4, A1N, Cr3C2, Ta5Si3, and ZrO2 were applied to a 2-inch-square, 7-inch-long thermal fatigue test specimen which was then internally water cooled and alternately immersed in molten aluminum and cooled in air. After 15,000 cycles the thermal fatigue cracks at the specimen corners were measured. Results indicate that a significant improvement in thermal fatigue resistance was obtained with platinum, molybdenum, and tungsten coatings. Metallographic examination indicates that the improvement in thermal fatigue resistance resulted from protection of the surface of the die steel from oxidation. The high yield strength and ductility of molybdenum and tungsten contributed to the better thermal fatigue resistance.

Nieh, C. Y.↗
DOE OSTI2020

Apparatus and method for facilitating planar delayering of integrated circuit die

An apparatus and method for facilitating the removal of layers from a die for an integrated circuit while maintaining the planarity of the surface of the die by avoiding rounding the corners and other edges of the die. A pocket is created in a sacrificial material, such that when the die is inserted into the pocket the edges of the die are contiguous with the walls of the pocket and a top surface of the die is coplanar with a top surface of the pocket. The sacrificial material may be the same material as the die. An adhesive substance is placed in the pocket, and the die is inserted into the pocket and against the adhesive substance which aids in retaining the die in the pocket. The layers may then be removed from the die and the sacrificial material around the die without rounding the edges of the die.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Apparatus and method for facilitating planar delayering of integrated circuit die

An apparatus and method for facilitating the removal of layers from a die for an integrated circuit while maintaining the planarity of the surface of the die by avoiding rounding the corners and other edges of the die. A pocket is created in a sacrificial material, such that when the die is inserted into the pocket the edges of the die are contiguous with the walls of the pocket and a top surface of the die is coplanar with a top surface of the pocket. The sacrificial material may be the same material as the die. An adhesive substance is placed in the pocket, and the die is inserted into the pocket and against the adhesive substance which aids in retaining the die in the pocket. The layers may then be removed from the die and the sacrificial material around the die without rounding the edges of the die.

Trujillo, Joshua Joseph↗
DOE OSTI2021

Integrated circuit authentication from a die material measurement

The various technologies presented herein relate to measuring a signal generated by a die-based test circuit incorporated into an IC and utilizing the measured signal to authenticate the IC. The signal can be based upon a sensor response generated by the test circuit fabricated into the die, wherein the sensor response is based upon a property of the die material. The signal can be compared with a reference value obtained from one or more test circuit(s) respectively located on one or more reference dies, wherein the reference dies are respectively cut from different wafers, and the location at which the reference dies were cut is known. If the measured signal matches the reference value, the die is deemed to be from the same cut location as the dies from which the reference value was obtained. If the measured signal does not match the reference value, the die is not authenticated.

Zortman, William A.↗
DOE OSTI2023

Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

This article presents the antenna-integrated glass interposer for D-band 6G wireless applications using dieembedding technology. Here, we implement the die-embedded package on glass substrates and characterize the electrical performance in the D-band. The electrical characterization employs embedded test dies with the 50-Ω ground–signal–ground (GSG) ports and coplanar waveguides. We achieve low-loss die-to-package transitions by using staggered dielectric vias, which are compared with the transitions of wire-bonding and flip-chip assembly. This article provides detailed information on the design, modeling, fabrication, and characterization of the die-to-package interconnects. This article also demonstrates the integration of microstrip patch antenna array and embedded dies in the D-band. The results show superior electrical performance provided by the die-embedded glass interposer. The die-to-package interconnect exhibits good matching (less than —10-dB S11) and low loss (0.2-dB loss) in the D-band. The integrated 1 × 8 patch antenna array shows 11.6-dB broadside gain and good matching with the embedded die. In addition, by using a temporary carrier, the antenna-integrated glass interposer also has great potential for further heterogeneous integration and thermal management.

42 ENGINEERING↗
DOE OSTI2024

Modifikation eines Cu‐Pd‐Schaufelrad‐Metall‐Organischen Gerüsts für die selektive CO 2 ‐Elektroreduktion

Abstract Die Optimierung der Bindungsenergie zwischen dem Intermediat und dem aktiven Zentrum ist ein entscheidender Faktor, um die katalytische Produktselektivität und Aktivität bei der elektrochemischen Kohlendioxidreduktion (CO 2 RR) zu steuern. Es ist bekannt, dass Kupferatome als aktive Zentren CO 2 zu Kohlenwasserstoffen und Sauerstoffverbindungen reduzieren, jedoch unter schlechter Produktselektivität leiden, da mehrere Intermediate nur moderate Bindungsenergien aufweisen. Hier berichten wir über eine Ionenaustauschstrategie zur Konstruktion von Cu−Pd‐Schaufelrad‐Dimeren innerhalb von Cu‐basierten metallorganischen Gerüsten (MOFs), [Cu 3‐x Pdx(BTC) 2 ] (BTC=1,3,5‐Benzoltricarbonsäure), ohne die strukturellen Eigenschaften des MOFs zu verändern. Im Vergleich zum reinen Cu‐MOF ([Cu 3 (BTC) 2 ], HKUST‐1) verlagert der Cu−Pd‐MOF die Produkte der CO 2 ‐Elektroreduktion von einer Vielzahl chemischer Spezies hin zu einer selektiven CO‐Erzeugung. Eine in situ‐Röntgenabsorptions‐Feinstrukturanalyse der Oxidationsstufe des Katalysators und der lokalen Geometrie, kombiniert mit theoretischen Berechnungen, zeigt, dass die Einfügung von Pd in die Knotenpunkte der Cu‐Schaufelradstruktur des MOFs die Adsorption des Schlüsselintermediats COOH* am Cu‐Zentrum fördert. Dies ermöglicht CO‐selektive katalytische Mechanismen und verbessert somit unser Verständnis über das Zusammenspiel von Struktur und Aktivität bei der elektrochemischen CO 2 ‐Reduktion unter Verwendung molekularer Katalysatoren.

Zhang, Ruirui↗
DOE OSTI2021

Concentric Ring Gas Atomization Die Design for Optimized Particle Production

In partnership with Linde plc (formerly Praxair, Inc.), Ames Laboratory will further develop and commercialize its concentric-ring high pressure gas atomization (CR-HPGA) gas-die technology with a goal to improve the precision of metal powder production in a desired size range and quality. The successful commercialization of this technology could reduce production cost of metal powders and improve reliability of this industrial process, increasing specialty alloy powder availability for new applications and adoption into additive manufacturing and multiple materials sectors. The project scope is to [1] utilize AMES compressible gas flow and melt break-up models to explore a wide swath of parameter space available for the CR-HPGA technology, identifying the most promising gas-die designs for fabrication, [2] verify and optimize the new gas-die design, fabricate it and select preferred operating parameters by gas-only flow imaging and aspiration pressure measurements, down-selecting gas compositions and atomization parameters for full scale testing, [3] perform pilot-scale atomization trials with Al and/or Cu alloys of a new CR-HPGA gas-die at selected parameters, [4] evaluate gas-die performance by comparing resulting powder size distribution and powder quality attributes with equivalent powders made by conventional close-coupled HPGA technology, and [5] assess (through Praxair partnership) reduction in operational costs of new CR-HPGA gas-die through the use of an inert gas recovery/recycling system. In partnership with Praxair, Inc., the team, led by Ames Laboratory senior metallurgist Iver Anderson, intend to demonstrate the performance of an optimized CR-HPGA gas-die design in a pilot scale atomizer and better understand the design and operational controls to increase overall benefits for precision metal powder production.

42 ENGINEERING↗
NASA NTRS2010

Three-Dimensional Computed Tomography as a Method for Finding Die Attach Voids in Diodes

NASA analyzes electrical, electronic, and electromechanical (EEE) parts used in space vehicles to understand failure modes of these components. The diode is an EEE part critical to NASA missions that can fail due to excessive voiding in the die attach. Metallography, one established method for studying the die attach, is a time-intensive, destructive, and equivocal process whereby mechanical grinding of the diodes is performed to reveal voiding in the die attach. Problems such as die attach pull-out tend to complicate results and can lead to erroneous conclusions. The objective of this study is to determine if three-dimensional computed tomography (3DCT), a nondestructive technique, is a viable alternative to metallography for detecting die attach voiding. The die attach voiding in two- dimensional planes created from 3DCT scans was compared to several physical cross sections of the same diode to determine if the 3DCT scan accurately recreates die attach volumetric variability

Brahm, E. N.↗
DOE OSTI2020

Facettierte verzweigte Nickel‐Nanopartikel mit variierbarer Verzweigungslänge für die hochaktive elektrokatalytische Oxidation von Biomasse

Abstract Die Kontrolle der Bildung von verzweigten Nanopartikeln mit hoher Homogenität ist eine der größten Herausforderungen bei der Herstellung von Nanokatalysatoren mit verbesserter Aktivität und Stabilität. Mithilfe eines Mechanismus unter Nutzung eines kubischen Kerns und hexagonaler Verzweigung zur Bildung hochgradig monodisperser verzweigter Nanopartikel wurde die Länge der Nickelverzweigungen variiert. Es hat sich gezeigt, dass die Verlängerung der Nickelzweige mit ihrer hohen Bedeckung der aktiven Facetten die Aktivität für die elektrokatalytische Oxidation von 5‐Hydroxymethylfurfural (HMF) als Beispiel für die Umwandlung von Biomasse verbessert.

Poerwoprajitno, Agus R.↗
DOE OSTI2023

Virtual sensing of wind turbine hub loads and drivetrain fatigue damage, Virtuelle Sensoren für die Messung von Hauptwellenlasten und Ermüdungsschäden im Antriebstrang von Windenergieanlagen

Abstract: This paper presents a Digital Twin for virtual sensing of wind turbine aerodynamic hub loads, as well as monitoring the accumulated fatigue damage and remaining useful life in drivetrain bearings based on measurements of the Supervisory Control and Data Acquisition (SCADA) and the drivetrain condition monitoring system (CMS). The aerodynamic load estimation is realized with data-driven regression models, while the estimation of local bearing loads and damage is conducted with physics-based, analytical models. Field measurements of the DOE 1.5 research turbine are used for model training and validation. The results show low errors of 6.4% and 1.1% in the predicted damage at the main and the generator side high-speed bearing respectively. Zusammenfassung: In diesem Aufsatz wird ein digitaler Zwilling für Windenergieanlagen vorgestellt, welcher die virtuelle Erfassung der Hauptwellenlasten und die Zustandsüberwachung von Ermüdungschäden und der verbleibende Nutzungsdauer der Antriebsstranglager ermöglicht. Der digital Zwilling nutzt Messdaten des Supervisory Control and Data Acquisition (SCADA) Systems und des Zustandsüberwachungssystems des Antriebsstranges (CMS). Die Berechnung der Hauptwellenlasten ist mit datenbasierten Regressionsmodellen umgesetzt, während die Berechnung der Lagerkräfte und der Ermüdungsschaden mit physikbasierten Modelle durchgeführt wird. Für die Modellentwicklung und -validierung werden Feldmessdaten der DOE 1.5MW Turbine eingesetzt. Die Abweichungen in den Ermüdungsschäden am Hauptwellenlager und am Generatorwellenlager betragen lediglich 6,4% beziehungsweise 1,1%.

17 WIND ENERGY↗
NASA NTRS1978

Development and evaluation of die materials for use in the growth of silicon ribbons by the inverted ribbon growth process, task 2. LSSA project

The results of emission spectroscopic analysis indicate that molten silicon can remain in contact with hot-pressed Si3N4 (99.2 percent theoretical density) for prolonged periods without attaining the impurity content level of the nitride. Although MgO was used as binder, Mg was not found present in the silicon sessile drop in quantities much above the level initially present in the silicon source material. Preliminary experiments with EFG-type dies coated with CVD Si3N4 or CVD SiOxNy indicate that capillary rise does not occur readily in these dies. The same was found to be true of hot-pressed and reaction-sintered Si3N4 obtained commercially. However, when dies were formed by depositing CVD layers on shaped silicon slabs, a column of molten silicon was maintained in each CVD die while being heated in contact with a crucible of molten silicon. Preliminary wetting of dies appears necessary for EFG growth. Several ribbon growth experiments were performed from V-shaped dies.

Duffy, M. T.↗