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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Direct-write printing techniques will enable new detector assemblies that were not previously possible with traditional assembly processes. Detector concepts were manufactured using this technology to validate repeatability. Additional detector applications and printed wires on a 3-dimensional magnetometer bobbin will be designed for print. This effort focuses on evaluating performance for direct-write manufacturing techniques on 3-dimensional surfaces. Direct-write manufacturing has the potential to reduce mass and volume for fabrication and assembly of advanced detector concepts by reducing trace widths down to 10 microns, printing on complex geometries, allowing new electronic concept production, and reduced production times of complex those electronics.

Direct-write printing↗
NASA NTRS2017

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Direct-write printing techniques will enable new detector assemblies that were not previously possible with traditional assembly processes. Detector concepts were manufactured using this technology to validate repeatability. Additional detector applications and printed wires on a 3-dimensional magnetometer bobbin will be designed for print. This effort focuses on evaluating performance for direct-write manufacturing techniques on 3-dimensional surfaces. Direct-write manufacturing has the potential to reduce mass and volume for fabrication and assembly of advanced detector concepts by reducing trace widths down to 10 microns, printing on complex geometries, allowing new electronic concept production, and reduced production times of complex those electronics.

Additive Manufacturing↗
NASA NTRSDate not supplied

Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods

In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.

Process control↗
NASA NTRS2016

Direct Write Printing on Thin and Flexible Substrates for Space Applications

This presentation describes the work done on direct-write printing conductive traces for a flexible detector application. A Repeatability Plan was established to define detector requirements, material and printer selections, printing facilities, and tests to verify requirements are met. Designs were created for the detector, and printed using an aerosol jet printer. Testing for requirement verification is ongoing.

flexible↗
NASA NTRS1993

Diffractive optics fabricated by direct write methods with an electron beam

State-of-the-art diffractive optics are fabricated using e-beam lithography and dry etching techniques to achieve multilevel phase elements with very high diffraction efficiencies. One of the major challenges encountered in fabricating diffractive optics is the small feature size (e.g. for diffractive lenses with small f-number). It is not only the e-beam system which dictates the feature size limitations, but also the alignment systems (mask aligner) and the materials (e-beam and photo resists). In order to allow diffractive optics to be used in new optoelectronic systems, it is necessary not only to fabricate elements with small feature sizes but also to do so in an economical fashion. Since price of a multilevel diffractive optical element is closely related to the e-beam writing time and the number of etching steps, we need to decrease the writing time and etching steps without affecting the quality of the element. To do this one has to utilize the full potentials of the e-beam writing system. In this paper, we will present three diffractive optics fabrication techniques which will reduce the number of process steps, the writing time, and the overall fabrication time for multilevel phase diffractive optics.

Kress, Bernard↗
NASA NTRS2019

Direct-Write Printing on Three-Dimensional Geometries for Miniaturized Detector and Electronic Assemblies

Aerosol Jet Printing (AJP) and other additive electronics technologies will enable new detector assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument and electronics concepts by reducing trace widths down to 10 microns, printing on complex geometries, and allowing new concept production. This poster summarizes development efforts of printed interconnects for space applications.

Printed Hybrid Electronics↗
NASA NTRS2024

Direct Ink Write 3D Printing of Fully Dense and Functionally Graded Liquid Metal Elastomer Foams

Liquid metal (LM) elastomer composites offer promising potential in soft robotics, wearable electronics, and human-machine interfaces. Direct ink write (DIW) 3D printing offers a versatile manufacturing technique capable of precise control over LM microstructures, yet challenges such as interfilament void formation in multilayer structures impact material performance. Here, a DIW strategy is introduced to control both LM microstructure and material architecture. Investigating three key process parameters–nozzle height, extrusion rate, and nondimensionalized nozzle velocity–it is found that nozzle height and velocity predominantly influence filament geometry. The nozzle height primarily dictates the aspect ratio of the filament and the formation of voids. A threshold print height based on filament geometry is identified; below the height, significant surface roughness occurs, and above the ink fractures, which facilitates the creation of porous structures with tunable stiffness and programmable LM microstructure. These porous architectures exhibit reduced density and enhanced thermal conductivity compared to cast samples. When used as a dielectric in a soft capacitive sensor, they display high sensitivity (gauge factor = 9.0), as permittivity increases with compressive strain. These results demonstrate the capability to simultaneously manipulate LM microstructure and geometric architecture in LM elastomer composites through precise control of print parameters, while maintaining geometric fidelity in the printed design.

Spencer Pak↗
NASA NTRS2025

A Review of Direct Ink Writing of Polymer Derived Ceramics

With the growing demand for materials capable of withstanding extreme temperatures and pressures, ceramic components with exceptional corrosion resistance and reliable mechanical properties have experienced a significant surge in demand. However, traditional ceramic forming methods involve high-temperatures and energy-intensive processes that often struggle to produce complex parts or composites efficiently. Polymer-Derived Ceramics (PDCs) offer a transformative solution by using polymeric precursors that can be converted into a wide variety of silicon-based and non-silicon-based ceramics through heat treatment. The polymeric nature of PDC precursors enables the fabrication of geometrically intricate components using conventional polymer-forming techniques at significantly lower processing temperatures. Furthermore, PDCs are well-suited for additive manufacturing (AM), allowing the production of complex structural and functional components through cost-effective, low-temperature processes. By leveraging the diverse properties of PDC materials – each with unique advantages and limitations – manufacturers can optimise performance for specific applications. This review provides an overview of the types of PDCs developed to date and their broad range of applications. Specifically, it delves into the Direct Ink Writing (DIW) process, exploring its rheological requirements and the critical role of fillers in tailoring the rheological properties of polymeric precursors to meet the specific demands of DIW.

Victoria Bishop↗
NASA NTRS1999

Multi-Body Analysis of the 1/5 Scale Wind Tunnel Model of the V-22 Tiltrotor

The paper presents a multi-body analysis of the 1/5 scale wind tunnel model of the V-22 tiltrotor, the Wing and Rotor Aeroelastic Testing System (WRATS), currently tested at NASA Langley Research Center. An original multi-body formulation has been developed at the Dipartimento di Ingegneria Aerospaziale of the Politecnico di Milano, Italy. It is based on the direct writing of the equilibrium equations of independent rigid bodies, connected by kinematic constraints that result in the addition of algebraic constraint equations, and by dynamic constraints, that directly contribute to the equilibrium equations. The formulation has been extended to the simultaneous solution of interdisciplinary problems by modeling electric and hydraulic networks, for aeroservoelastic problems. The code has been tailored to the modeling of rotorcrafts while preserving a complete generality. A family of aerodynamic elements has been introduced to model high aspect aerodynamic surfaces, based on the strip theory, with quasi-steady aerodynamic coefficients, compressibility, post-stall interpolation of experimental data, dynamic stall modeling, and radial flow drag. Different models for the induced velocity of the rotor can be used, from uniform velocity to dynamic in flow. A complete dynamic and aeroelastic analysis of the model of the V-22 tiltrotor has been performed, to assess the validity of the formulation and to exploit the unique features of multi-body analysis with respect to conventional comprehensive rotorcraft codes; These are the ability to model the exact kinematics of mechanical systems, and the possibility to simulate unusual maneuvers and unusual flight conditions, that are particular to the tiltrotor, e.g. the conversion maneuver. A complete modal validation of the analytical model has been performed, to assess the ability to reproduce the correct dynamics of the system with a relatively coarse beam model of the semispan wing, pylon and rotor. Particular care has been used to model the kinematics of the gimbal joint, that characterizes the rotor hub, and of the control system, consisting in the entire swashplate mechanism. The kinematics of the fixed and the rotating plates have been modeled, with variable length control links used to input the controls, the rotating flexible links, the pitch horns and the pitch bearings. The investigations took advantage of concurring wind tunnel test runs, that were performed in August 1998, and allowed the acquisition of data specific to the multi-body analysis.

Ghiringhelli, G. L.↗
NASA NTRS2017

Application of Temperature-Controlled Thermal Atomization for Printing Electronics in Space

Additive Manufacturing (AM) is a technology that builds three dimensional objects by adding material layer-upon-layer throughout the fabrication process. The Electrical, Electronic and Electromechanical (EEE) parts packaging group at Marshall Space Flight Center (MSFC) is investigating how various AM and 3D printing processes can be adapted to the microgravity environment of space to enable on demand manufacturing of electronics. The current state-of-the art processes for accomplishing the task of printing electronics through non-contact, direct-write means rely heavily on the process of atomization of liquid inks into fine aerosols to be delivered ultimately to a machine's print head and through its nozzle. As a result of cumulative International Space Station (ISS) research into the behaviors of fluids in zero-gravity, our experience leads us to conclude that the direct adaptation of conventional atomization processes will likely fall short and alternative approaches will need to be explored. In this report, we investigate the development of an alternative approach to atomizing electronic materials by way of thermal atomization, to be used in place of conventional aerosol generation and delivery processes for printing electronics in space.

Wu, Chih-Hao↗
NASA NTRS1991

In-situ integrated processing and characterization of thin films of high temperature superconductors, dielectrics and semiconductors by MOCVD

In this strategy of depositing the basic building blocks of superconductors, semiconductors, and dielectrics having common elements, researchers deposited superconducting films of Y-Ba-Cu-O, semiconductor films of Cu2O, and dielectric films of BaF2 and Y2O3 by metal oxide chemical vapor deposition (MOCVD). By switching source materials entering the chamber, and by using direct writing capability, complex device structures like three terminal hybrid semiconductor/superconductor transistors can be fabricated. The Y-Ba-Cu-O superconducting thin films on BaF2/YSZ substrates show a T(sub c) of 80 K and are textured with most of the grains having their c-axis or a-axis perpendicular to the substrate. Electrical characteristics as well as structural characteristics of superconductors and related materials obtained by x-ray deffraction, electron microscopy, and energy dispersive x-ray analysis are discussed.

Singh, R.↗
NASA NTRS1994

A combined electron beam/optical lithography process step for the fabrication of sub-half-micron-gate-length MMIC chips

Advanced radar and communication systems rely heavily on state-of-the-art microelectronics. Systems such as the phased-array radar require many transmit/receive (T/R) modules which are made up of many millimeter wave - microwave integrated circuits (MMIC's). The heart of a MMIC chip is the Gallium Arsenide (GaAs) field-effect transistor (FET). The transistor gate length is the critical feature that determines the operating frequency of the radar system. A smaller gate length will typically result in a higher frequency. In order to make a phased array radar system economically feasible, manufacturers must be capable of producing very large quantities of small-gate-length MMIC chips at a relatively low cost per chip. This requires the processing of a large number of wafers with a large number of chips per wafer, minimum processing time, and a very high chip yield. One of the bottlenecks in the fabrication of MIMIC chips is the transistor gate definition. The definition of sub-half-micron gates for GaAs-based field-effect transistors is generally performed by direct-write electron beam lithography (EBL). Because of the throughput limitations of EBL, the gate-layer fabrication is conventionally divided into two lithographic processes where EBL is used to generate the gate fingers and optical lithography is used to generate the large-area gate pads and interconnects. As a result, two complete sequences of resist application, exposure, development, metallization and lift-off are required for the entire gate structure. We have baselined a hybrid process, referred to as EBOL (electron beam/optical lithography), in which a single application of a multi-level resist is used for both exposures. The entire gate structure, (gate fingers, interconnects and pads), is then formed with a single metallization and lift-off process. The EBOL process thus retains the advantages of the high-resolution E-beam lithography and the high throughput of optical lithography while essentially eliminating an entire lithography/metallization/lift-off process sequence. This technique has been proven to be reliable for both trapezoidal and mushroom gates and has been successfully applied to metal-semiconductor and high-electron-mobility field-effect transistor (MESFET and HEMT) wafers containing devices with gate lengths down to 0.10 micron and 75 x 75 micron gate pads. The yields and throughput of these wafers have been very high with no loss in device performance. We will discuss the entire EBOL process technology including the multilayer resist structure, exposure conditions, process sensitivities, metal edge definition, device results, comparison to the standard gate-layer process, and its suitability for manufacturing.

Sewell, James S.↗
NASA NTRS2005

Electron-beam lithography for micro and nano-optical applications

Direct-write electron-beam lithography has proven to be a powerful technique for fabricating a variety of micro- and nano-optical devices. Binary E-beam lithography is the workhorse technique for fabricating optical devices that require complicated precision nano-scale features. We describe a bi-layer resist system and virtual-mark height measurement for improving the reliability of fabricating binary patterns. Analog E-beam lithography is a newer technique that has found significant application in the fabrication of diffractive optical elements. We describe our techniques for fabricating analog surface-relief profiles in E-beam resist, including some discussion regarding overcoming the problems of resist heating and charging. We also describe a multiple-field-size exposure scheme for suppression of field-stitch induced ghost diffraction orders produced by blazed diffraction gratings on non-flat substrates.

electron-beam lithography↗