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Results for “Dwell Fatigue”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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8 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

The influence of alloying on slip intermittency and the implications for dwell fatigue in titanium

Dwell fatigue, the reduction in fatigue life experienced by titanium alloys due to holds at stresses as low as 60% of yield, has been implicated in several uncontained jet engine failures. Dislocation slip has long been observed to be an intermittent, scale-bridging phenomenon, similar to that seen in earthquakes but at the nanoscale, leading to the speculation that large stress bursts might promote the initial opening of a crack. Here we observe such stress bursts at the scale of individual grains in situ, using high energy X-ray diffraction microscopy in Ti–7Al–O alloys. This shows that the detrimental effect of precipitation of ordered Ti 3 Al is to increase the magnitude of rare pri $\langle$a$\rangle$ and bas $\langle$a$\rangle$ slip bursts associated with slip localisation. By contrast, the addition of trace O interstitials is beneficial, reducing the magnitude of slip bursts and promoting a higher frequency of smaller events. This is further evidence that the formation of long paths for easy basal plane slip localisation should be avoided when engineering titanium alloys against dwell fatigue.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Determining anisotropic slip system rate sensitivities of Ti-6Al-4V using high-energy X-ray diffraction microscopy

Variation of strain rate sensitivity among different families of slip systems in the hexagonal close-packed (α) phase of titanium (Ti) alloys has the potential to alter microscale load redistribution during both creep and dwell fatigue loading. However, existing literature contains conflicting reports regarding the degree of anisotropy present in the strain rate sensitives between α slip system families across Ti alloys. Here, we quantify the strain rate sensitivity of α slip system families in Ti-6Al-4V using high-energy X-ray diffraction microscopy (HEDM). We present a novel procedure in which we utilize the HEDM-measured grain-scale stress states during stress relaxation to determine the strain rate sensitivities of the basal $\langle a \rangle$ , prismatic $\langle a \rangle$, and first-order pyramidal $\langle c + a \rangle$ slip system families. In addition, we measure the strain rate sensitivity exponent of the macroscopic response and the α phase for comparison. We find rate sensitivities for the different slip system families to range from 0.02 to 0.04, which—while varied—are relatively isotropic in comparison with some values presented in the literature. We also demonstrate the effects of the measured anisotropic rate sensitivities using crystal plasticity finite element simulations.

Peterson, Kenneth M. [Pennsylvania State Univ., Un↗
DOE OSTI2021

Modeling Ti–6Al–4V using crystal plasticity, calibrated with multi-scale experiments, to understand the effect of the orientation and morphology of the α and β phases on time dependent cyclic loading

Classically, crystal plasticity modeling has used a range of constitutive equations, in which the incorporation of additional physics-based relationships typically results in additional model parameters. These additional parameters need to be reliably calibrated, which often necessitates the use of a range of experimental data acquired at multiple length scales. In this work, a crystal plasticity based finite element (CPFE) model for a dual-phase Titanium alloy, Ti–6Al–4V, is developed. The α and β phases of the microstructure are explicitly modeled. The model is calibrated using a systematic optimization routine and experimental data that consist of macroscopic stress-strain curves coupled with lattice strains on different crystallographic planes for the two phases. These experimental data were obtained from in situ high energy X-ray diffraction experiments for multiple material pedigrees, with varying crystallographic orientation distribution and β volume fractions. Depending on the thermomechanical-processing route and the heat treatment used to manufacture the alloy, Ti–6Al–4V can exist in a wide number of microstructural forms, which often results in the α and β phases either having well aligned slip systems (following the Burgers orientation relationship (BOR)) or possessing no alignment of the slip systems across the interphase boundary (not following the BOR). In this study, the fully-calibrated CPFE model is used to gain a comprehensive understanding of the deformation behavior of Ti–6Al–4V, specifically, the effect of microstructures that follow the BOR (or not) on time-dependent cyclic loading (including the effects of dwell hold times).

36 MATERIALS SCIENCE↗
DOE OSTI2022

Single-Bar SMT Creep-Fatigue Testing on Alloy 617 with Software Controls on elastic Follow-Up Feedback in Support of New Creep-Fatigue Design Methodology

The Simplified Model Test (SMT) is one of the alternative ways to calculate the creep-fatigue damage of elevated temperature components. The SMT approach unifies the creep and fatigue damage, simplifying the damage calculation process with improved accuracy. Traditionally, SMT tests has have been conducted through the two bars: first is the driver bar and second is the test bar. The driver bar stays elastic and imposes the confinement to the second bar. This experimental procedure requires two test frames and a large test specimen, which limits the test parameter range and accessibility of this testing procedures. Hence, a single-bar SMT (SB-SMT) tests has been developed to simplify complexity in SMT experiment setup. The software-controlled SB-SMT test process has been introduced which completely replaces the driver bar. This paper discusses the single-bar SMT (SB-SMT) test procedure with software controls. The challenges and critical parameters in the software-controlled SB-SMT procedure are addresses addressed and recommendations are provided. A scoping test with a set of wider strain range, elastic follow-ups and dwell time validated the proposed test procedure.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
DOE OSTI2020

Activation Energy for Solder Bond Degradation: Thermal Cycling of Field-aged Modules at Multiple Upper Temperatures

The reliability of solder joints in the solar cell metallization-interconnect system influences the lifetime of photovoltaic modules. Two field-aged modules-one with Sn 62 Pb 36 Ag 2 solder at the solder joints (Solarex MSX 60), and the other with the standard Sn 60 Pb 40 solder (Siemens M55)-were subjected to a modified thermal cycling (TC) test of IEC 61215. Three sections in each module were maintained at 85 degrees C, 95 degrees C, and 105 degrees C during the 15-minute high temperature dwell time. Current equivalent to the module short-circuit current was injected through the module when the chamber temperature was above 25 degrees C to simulate regular field operation. This novel approach aims to induce thermomechanical fatigue (TMF) at the solder joints and intermetallic compound (IMC) formation at the metal/solder interfaces. The activation energy (E a ) for solder bond degradation was calculated based on the series resistance (R s ) increase in TC testing rather than power drop to avoid the effect of confounding variables. Module-level R s increase in MSX 60 module after TC800 cycles and in M55 module after TC400 cycles was 1.22% and 183.7%, respectively. The E a determined for the module with 2wt% Ag is 0.24 eV and for that with the standard solder is 0.27 eV. The solder bond degradation seems to have been driven by TMF rather than IMC formation for both modules.

14 SOLAR ENERGY↗
DOE OSTI2020

Activation Energy for End-of-Life Solder Bond Degradation: Thermal Cycling of Field-Aged PV Modules

The longevity of solar photovoltaic modules depends on the durability and reliability of their components, one of which is the solder bonds in interconnect ribbons. The solder joints experience stresses from thermal cycling and constant elevated temperatures (40 °C-70 °C) in regular field operation leading to thermo-mechanical fatigue and intermetallic compound formation. To study the end-of-life wear-out mechanisms and to obtain activation energy of solder bond degradation, here two field-aged modules from Arizona-a 21-year-old Solarex MSX60 module (with Sn62Pb36Ag2 at the solder joints) and an 18-year-old Siemens M55 module (with Sn60Pb40 at the solder joints)-underwent 800 and 400 modified thermal cycles, respectively. Using three heating blankets, each module had three temperature zones maintained at 85, 95, and 105 °C during the 15-min hot dwell time of the thermal cycle. Cell-level series resistance data obtained from three temperature zones enabled the calculation of activation energy for solder bond degradation for the MSX60 and the M55 modules to be 0.12 eV and 0.35 eV, respectively. From each temperature zone in both modules, busbar-solder samples were obtained, imaged through SEM, and analyzed with energy-dispersive X-ray spectroscopy. In the MSX60 module with traces of Ag in the solder material, phase segregation and growth were primarily observed at high temperatures. For M55 modules without Ag in the solder material, major phase segregation was observed in all temperature zones. The IMC thickness for both modules increased with increasing module temperature. The beneficial effect of Ag in solder material on mitigating solder bond degradation is presented.

14 SOLAR ENERGY↗