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Results for “ELECTRIC CONDUCTOR”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Single-Step Shear-Based Deformation Processing of Electrical Conductor Wires

Commercial electrical conductor wires are currently produced from aluminum alloys by multi-step deformation processing involving rolling and drawing. These processes typically require 10 to 20 steps of deformation, since the plastic strain or reduction that can be imposed in a single step is limited by material workability and process mechanics. Here, we demonstrate a fundamentally different, single-step approach to produce flat wire aluminum products using machining-based deformation that also ensures adequate material workability in the formed product. Two process routes are proposed: (1) chip formation by free-machining (FM), with a post-machining, light drawing reduction (<20%) to achieve desired finish and (2) constrained chip formation by large strain extrusion machining (LSEM). Using commercially pure aluminum conductor alloys (Al 1100 and EC1350) as representative material systems, we demonstrate key features of the machining-based processing, including (a) single-step processing to achieve flat wire geometries, (b) surface finish (Ra = 0.2 to 1.0 μm) comparable to that of commercial wire products made by drawing/rolling, (c) deformation control independent of wire size, and (d) hardness increases of 50–150% over that of annealed wires, while retaining high electrical conductivity (>56% IACS). Here, the wire microstructure, which can also be varied via the large-strain deformation parameters, is correlated with mechanical and electrical properties. Implications for commercial manufacture of flat wire products are discussed.

36 MATERIALS SCIENCE↗

Platinum nanometal interconnection of copper–carbon nanotube hybrid electrical conductors

This study demonstrates the versatility of Joule heating driven chemical vapor deposition to deposit nanometal interconnections into porous CNT roving with application in the production of high electrical conductivity copper-carbon nanotube (Cu-CNT) hybrids. Modifications of vapor deposition parameters allow for deposited nanometal masses from less than 5% w/w to over 85% w/w and distributions that can be controlled towards either hot-spot site-specificity or overall uniformity. Here, depositions of copper, platinum, nickel, palladium, ruthenium, rhodium, and iridium are demonstrated from acetylacetonate precursors. In particular, platinum acetylacetonate [Pt(acac) 2 ] deposits nanometal seeds that adhere tightly to the CNT roving, producing improvements in resistance and specific conductivity. The properties of the platinum deposition compared to the copper deposition motivate an investigation into its use as an interfacial layer for Cu-CNT hybrids. CNT conductors with ~30% w/w platinum are electroplated with copper, densified, and annealed to produce Cu-CNT hybrid conductors with specific conductivities as high as 5772 S m 2 /kg and TCR (from 300 to 600 K) as low as 3.12 × 10 –3 K –1 , indicating good interconnection of the metal and CNT portions. Room temperature conductivities of 29.8 MS/m are achieved, comparable to metallic conductors. Thus, Pt(acac) 2 seeded Cu-CNT hybrids offer abundant promise in high conductivity applications.

42 ENGINEERING↗

Eddy Current Model of a Coil Over An Infinite Perfectly Electrical Conductor (PEC) Half-Plane

Eddy current sensors measure the lift-off or distance between the sensor and a conducting surface. They operate on the principle of an alternating current in a conduction coil inducing a magnetic field within the surface. An eddy current is set up in the surface to counter the incident magnetic field which, in turn, sets up a magnetic field which counters that of the coil. This changes the coil impedance which is a function of the lift-off. As the lift-off increases, the effect of the eddy current magnetic field on the coil magnetic field weakens, resulting in a higher inductance and lower resistance. Thus, the lift-off may be derived from an impedance measurement. Dodd and Deeds developed an analytic model for an eddy current sensor coil impedance with an air core which has been implemented in MATLAB. LLNL assembled an eddy current sensor with a mu-metal core for which there is no analytic model. Rather than derive an analytic model which includes the mu-metal core, analytic empirically based functions are derived to map the Dodd and Deeds model to measured inductance and resistance.

42 ENGINEERING↗

Electrical conductor insulation system and method of fabrication

An insulation system includes a number of mica hard-boards joinable to form a free-standing slot-liner for insulating a conductor when placed therein and accommodating an expansion of the conductor. In another embodiment, an electromagnetic pump includes a stator of the electromagnetic pump including a number of laminations, a slot-liner positioned within a gap formed by the laminations, an annular wound copper conductor coil positioned within the slot-liner. The slot-liner includes a number of mica hard-boards joined to form an annular volume for insulating the conductor coil and accommodating an expansion of the conductor coil.

42 ENGINEERING↗

Partial discharge sensor

An approach to detecting partial discharge events involves retrofitting an electrical system to include a capacitive sensor configured to capacitively sense partial discharge events of a component of the electrical system. The capacitive sensor has a first electrical conductor that forms a first terminal of the capacitive sensor, a second electrical conductor that forms a second terminal of the capacitive sensor, and a dielectric that separates the first electrical conductor and the second electrical conductor. The capacitive sensor generates an electrical sensor signal at an output of the capacitive sensor in response to the partial discharge event. The electrical sensor signal is converted to an optical signal and the optical signal is processed to detect an occurrence of the partial discharge event.

Karin, Todd↗

Numerical electromagnetic frequency domain analysis with discrete exterior calculus

In this paper, we perform a numerical analysis in frequency domain for various electromagnetic problems based on discrete exterior calculus (DEC) with an arbitrary 2-D triangular or 3-D tetrahedral mesh. We formulate the governing equations in terms of DEC for 3-D and 2-D inhomogeneous structures, and also show that the charge continuity relation is naturally satisfied. Then we introduce a general construction for signed dual volume to incorporate material information and take into account the case when circumcenters fall outside triangles or tetrahedrons, which may lead to negative dual volume without Delaunay triangulation. Then we examine the boundary terms induced by the dual mesh and provide a systematical treatment of various boundary conditions, including perfect magnetic conductor (PMC), perfect electric conductor (PEC), Dirichlet, periodic, and absorbing boundary conditions (ABC) within this method. An excellent agreement is achieved through the numerical calculation of several problems, including homogeneous waveguides, microstructured fibers, photonic crystals, scattering by a 2-D PEC, and resonant cavities. - Highlights: • The formulation of 2D and 3D electromagnetic equations with DEC are presented. • Characteristic Hodge stars are constructed without well-centered triangulation or Delaunay triangulation. • Systematical treatment of various boundary conditions, including PMC, PEC, periodic, and absorbing boundary conditions. • Switching between E to H field can change PEC from essential boundary condition to natural boundary condition. • Quality factor of an open dielectric sphere is considered.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Final Report: Superconducting Joints Between (RE)Ba 2 Cu 3 O 7-x Coated Conductors via Electric Field Assisted Processing

Here we report the results from a project aimed at developing a fully superconducting joint between two REBCO coated conductors using electric field processing (EFP). Due to a reduction in the budget and time period of this contract, we reduced the project scope and focused first on the key scientific issues for forming a strong bond between conductors, and subsequently focused on improving through-the-joint transport. A modified timeline and task list is shown in Table 1, summarizing accomplishments to date. In the first period, we accomplished initial surface characterization as well as rounds of EFP experiments to begin to understand processing parameters which produce well-bonded tapes. In the second phase, we explored the effects of two fundamental EFP parameters, voltage and pressure, and the limitations they place on the process. In the third phase, we achieved superconducting joints and established base characteristics of both the bonding process and the types of tapes best suited to this process. Finally, we investigated some of the parameters related to kinetics which appeared inhibit joint quality and performance.

36 MATERIALS SCIENCE↗

Hermetic edge-connect headers and corresponding connectors

A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of electrical conductors removed in the machining process, resulting in a header with a high pin density. During the process of mating the first connector design to the edge-connect header, a plurality of wipers in the connector deflect, thereby causing the wipers to extend from the connector and contact the corresponding electrical conductors in the header. During the process of mating the second connector design to the edge-connect header, each of a plurality of wipers formed of low-mass, compliant metal wool, forms multiple contact points with a corresponding electrical conductor in the header.

Kellogg, Rick A.↗

Hermetic edge-connect headers and corresponding connectors

A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of electrical conductors removed in the machining process, resulting in a header with a high pin density. During the process of mating the first connector design to the edge-connect header, a plurality of wipers in the connector deflect, thereby causing the wipers to extend from the connector and contact the corresponding electrical conductors in the header. During the process of mating the second connector design to the edge-connect header, each of a plurality of wipers formed of low-mass, compliant metal wool, forms multiple contact points with a corresponding electrical conductor in the header.

Kellogg, Rick A.↗

Hermetic edge-connect headers and corresponding connectors

A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of electrical conductors removed in the machining process, resulting in a header with a high pin density. During the process of mating the first connector design to the edge-connect header, a plurality of wipers in the connector deflect, thereby causing the wipers to extend from the connector and contact the corresponding electrical conductors in the header. During the process of mating the second connector design to the edge-connect header, each of a plurality of wipers formed of low-mass, compliant metal wool, forms multiple contact points with a corresponding electrical conductor in the header.

Kellogg, Rick A.↗

Preparation and structure of Na2Ag5Fe3(P2O7)4 -Ag metal composite: Insights on electrochemistry

ABSTRACT Ag 7 Fe 3 (P 2 O 7 ) 4 is a 3D structured material which has been recently studied as a possible cathode material for lithium batteries. Notably, Na 7 Fe 3 (P 2 O 7 ) 4 is reported to be a fast-ion conductor, yet poor electrical conductor. Here, partial replacement of Na + for Ag + yielded Na 2 Ag 5 Fe 3 (P 2 O 7 ) 4 pyrophosphate framework where the formation of Ag metal is proposed to increase the intrinsic low electrical conductivity of this polyanion electrode. Specifically, the Ag 5 Na 2 Fe 3 (P 2 O 7 ) 4 -Ag composite is synthesized via chemical reduction of Ag 7 Fe 3 (P 2 O 7 ) 4 using NaBH 4 . The occupancy of Ag + and Na + in each site was determined via Rietveld analysis of the diffraction pattern. Electrochemistry of the Ag 5 Na 2 Fe 3 (P 2 O 7 ) 4 -Ag metal composite was explored with voltammetry and galvanostatic charge/discharge cycling. The Ag 5 Na 2 Fe 3 (P 2 O 7 ) 4 -Ag metal composite electrodes displayed good rate capability assisted by the presence of Ag metal from the chemical reduction and in-situ electrochemical formation of a Ag conductive network.

energy storage (including batteries and capacitors↗

Electrostatic charge buildup and electrostatic discharge monitoring system and method

A system for monitoring electrostatic charge buildup and electrostatic discharge (ESD) remotely comprises a plurality of electrostatic charge measurement units and a data acquisition device. Each electrostatic charge measurement unit includes a primary charge plate, a static sensor device, a secondary charge plate, and a shielded cable. The primary charge plate is positioned proximal to an object. The static sensor device includes an input sensor at which an electric voltage is measured and outputs an electronic signal whose level varies according to the measured electric voltage. The secondary charge plate is positioned in proximity to the input sensor of the static sensor device. The shielded cable includes an inner conductor electrically connected to the primary charge plate and the secondary charge plate and an outer conductor electrically connected to electrical ground. The data acquisition device receives the electronic signal from the static sensor device of each electrostatic charge measurement unit.

Schantz, Eric T.↗

Semiconductor power device including wire or ribbon bonds over device active region

A semiconductor power device including a base plate; an input lead; an output lead; a field effect transistor (FET) power die disposed over the base plate, wherein the FET power die includes a set of source fingers, a set of drain fingers, and a set of gate fingers disposed directly over an active region, wherein the gate fingers are configured to receive an input signal from the input lead, and wherein the FET power die is configured to process the input signal to generate an output signal at the drain fingers for routing to the output lead; and electrical conductors (wirebonds or ribbons) bonded to the source and/or drain directly over the active region of the FET power die. The electrical conductors produce additional thermal paths between the active region and the base plate for thermal management of the FET power die.

42 ENGINEERING↗