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Acoustically Enhanced Electroplating Being Developed
In cooperation with the NASA Glenn Research Center, Alchemitron Corp. is developing the Acoustically Enhanced Electroplating Process (AEEP), a new technique of employing nonlinear ultrasonics to enhance electroplating. The applications range from electroplating full-panel electronic circuit boards to electroplating microelectronics and microelectromechanical systems (MEMS) devices. In a conventional plating process, the surface area to be plated is separated from the nonplated areas by a temporary mask. The mask may take many forms, from a cured liquid coating to a simple tape. Generally, the mask is discarded when the plating is complete, creating a solid waste product that is often an environmental hazard. The labor and materials involved with the layout, fabrication, and tooling of masks is a primary source of recurring and nonrecurring production costs. The objective of this joint effort, therefore, is to reduce or eliminate the need for masks. AEEP improves selective plating processes by using directed beams of high-intensity acoustic waves to create nonlinear effects that alter the fluid dynamic and thermodynamic behavior of the plating process. It relies on two effects: acoustic streaming and acoustic heating. Acoustic streaming is observed when a high-intensity acoustic beam creates a liquid current within the beam. The liquid current can be directed as the beam is directed and, thus, users can move liquid around as desired without using pumps and nozzles. The current of the electroplating electrolyte, therefore, can be directed at distinct target areas where electroplating is desired. The current delivers fresh electrolyte to the target area while flushing away the spent electrolyte. This dramatically increases the plating rate in the target area. In addition, acoustic heating of both the liquid in the beam and the target surface increases the chemical reaction rate, which further increases the plating rate. The combined effects of acoustic streaming and heating accelerate the deposition of plating in that area and, thus, provide an effect similar to a mask but without the costs of masking. AEEP further improves the plating process by clearing debris and bubbles from the surface by acoustic radiation pressure and acoustic streaming.
Water-Based Electroplating Maskant Is Safer
Report proposes use of commercial water-based electroplating maskant Tolber 0-18 as nontoxic alternative to commercial organic-solvent-based electroplating maskant Turco 531-A. Tolber 0-18 found to be equal or superior in key properties, including suitability for application by brushing, effectiveness of sealing, and durability. In addition, exerts no adverse effect on environment or on health of workers, and enables users to comply with local and federal antipollution laws. Use of maskant proves beneficial in most, if not all, electroplating applications involving brush application of maskants to areas not to be electroplated.
Electroplated Au for conformal coating of high aspect ratio silicon structures
A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
Devices for Thermal Conductivity Measurements of Electroplated Bi for X-ray TES Absorbers
Electroplated bismuth (Bi) is commonly used in transition-edge sensors (TESs) for X-rays because of its high stopping power and low heat capacity (Collan in Phys Rev B 1:2888, 1970, Yan in Appl Phys Lett 111:192602, 2017). Electroplated Bi is usually grown on top of another metal that acts as seed layer, typically gold (Au), making it challenging to extrapolate its thermoelectric properties. In this work, we present four-wire resistance measurement structures that allow us to measure resistance as a function of temperature of electroplated Bi independently of Au. The results show that the thermal conductivity of the Bi at 3 K is high enough to ensure the correct thermalization of X-ray photons when used as an absorber for TESs.
Black chrome on commercially electroplated tin as a solar selecting coating
The reflectance properties of black chrome electroplated on commercially electroplated tin were measured for various black chrome plating times for both the solar and infrared spectrum. The values of absorptance and emittance were calculated from the measured reflectance values. The results indicate that the optimum combination of the highest absorptance in the solar region and the lowest emittance in the infrared of the black chrome plated on commercially electroplated tin is obtained for a black chrome plating time of between one and two minutes.
In-plant testing of membranes to treat electroplating wastewater
This is the final report submitted for the work performed under the NASA Cooperative Agreement NCC3-301 for the project entitled 'In-Plant Testing of Membranes To Treat Electroplating Waste water'. The main objective of the research project was to determine if the crosslinked polyacrylic acid salt films developed by NASA scientists could be used for heavy metal removal from the wastewater generated by the metals-finishing or electroplating industry. A variety of tasks identified in the original proposal were completed. These included: (1) analysis of our industrial partner Aetna Plating's zinc electroplating process and its wastewater treatment needs for zinc removal; (2) design and construction of a laboratory-scale unit to continuously supply and remove the ion exchange films from the zinc wastewater; (3) performance of a series of runs on such a unit to determine its operating characteristics; and (4) design of a prototype unit for use at the industrial site. In addition, there were a number of tasks that had not been identified in the original proposal but were later judged to be necessary for the successful completion of the project. These were: (1) batch equilibrium and kinetic experiments with analysis of the experimental results to accurately determine the equilibrium and kinetic parameters for the ion exchange films; (2 ) simulation studies for proper design of the prototype unit; and (3) preliminary runs to exchange the films from H form to Calcium form.
Characterization and Testing of Copper-Nickel Electroplated 3D Printed Parts for Space Flight Applications
3D printing enables novel designs which are impossible to replicate with conventional machining. The process involves 3D printing components from a polymer using a standard resin-based printing process, then electroplating the parts with a thin layer of copper-nickel. Initial results have shown these electroplated components have increased structural strength, while being less expensive; less massive; and can be made faster compared to conventional CNC machining. The focus and metric of success was to qualify this process and to answer the question if the 3D printed electroplated parts can be fabricated in a more cost, mass and schedule efficient manor compared to traditional CNC machining. Also, to determine if using this method will cause parts to have contamination issues or if parts can survive space environment testing. This was accomplished by conducting several critical tests such as outgassing, material testing and thermal cycling. In addition, this method is being used to develop a practical structural application for KArLE (Potassium Argon Laser Experiment).
Copper-nickel electroplating of 3D-printed acrylonitrile butadiene styrene for interference and radiation shielding applications
Here, in this study, electromagnetic and radiation shielding structures were fabricated by 3D printing acrylonitrile butadiene styrene (ABS) structures via fused filament fabrication and electroplating with copper (Cu) and nickel (Ni) metals. Prior to electroplating, the printed ABS materials were made conductive by surface electrodeposition of polypyrrole (PPy). ABS adsorbs the pyrrole monomer, which subsequently polymerizes via oxidation forming conductive PPy layer on the printed structures. The successful anchoring of PPy layer can be attributed to its hydrogen bonding and electrostatic interactions with ABS. Thermal analysis, optical, and electron microscopy equipped with energy dispersive X-ray were employed to characterize the printed shielding structures, while the interference and radiation shielding effectiveness were evaluated using a spectrum analyzer and dosimeter, respectively. The interference shielding was found to be effective at 60 ± 5 dB over relatively small frequency range. Shielding was also apparent against gamma and X-ray ionizing rays, but more significantly effective against beta rays. Furthermore, the Cu/Ni coating was able to reduce any heat-induced dimensional changes for the 3D printed ABS substrate without compromising the mechanical integrity.
In-situ synchrotron X-ray study on microstructure and stress evolutions of electroplated copper upon self-annealing
Background: The self-annealing behavior of electroplated copper (Cu) at room temperature is gaining attention in the microelectronics industry due to its significant impact on reliability issues such as substrate warpage and electrical resistivity. Methods: In this study, in-situ analysis of the microstructure transition and stress relaxation of the electroplated copper upon self-annealing was conducted via synchrotron white X-ray nanodiffraction (beamline 21A, Taiwan Photon Source) and grazing-incidence X-ray diffraction (beamline 17B1, Taiwan Light Source). Significant Findings: Remarkable relaxations of deviatoric stress and absolute strain component along the [002] direction were closely related to the Cu grain growth and crystallographic reorientation at the early stage of selfannealing, and a complete stress/strain relaxation can be achieved with the cessation of microstructure transition. In conclusion, the in-situ synchrotron X-ray studies provided an insight into Cu self-annealing mechanism, offering valuable information for improving Cu interconnect reliability.
Iodine Capture with Copper-Electroplated Nickel Foams
This work explores the use of Ni0 foam scaffolds for Cu0 coatings for use as sorbents for iodine. The Cu0 electroplating was performed from aqueous copper(II) sulfate (CuSO4) solutions under different conditions to achieve a range of Cu0-layer thicknesses (4.89 ± 1.05 μm–57.32 ± 3.95 μm) with 900 A·m–2 current densities and coating times of 15–180 min. The thickest coatings resulted in Cu0-plated Ni0 foams with >89 mass % Cu0 in the final product. Iodine capture experiments showed very high Cu0 utilizations of 91.9–97.3 mass % at iodine loadings of 839–1774 mg·g–1 through the formation of CuI (marshite; space group F-43m). No evidence was found of iodine reactions taking place with the Ni0 scaffold, so it remained in iodine-loaded Cu-electroplated Ni foams as structural support to provide mechanical rigidity to the foams during the iodine loading process. Hot pressing of these materials can be used to create a CuI/Ni ceramic-metal composite waste form for disposal as demonstrated with spark plasma sintering.
Thermal Conductivity of Electroplated Copper Onto Bulk Niobium at Cryogenic Temperatures
Superconducting radio-frequency (SRF) cavities made of high-purity bulk niobium are widely used in modern particle accelerators. The development of metallic outer coatings with high thermal conductivity would have a beneficial impact in terms of improved thermal stability, reduced material cost and for the development of conduction-cooled, cryogen-free SRF cavities. Several high-purity, fine-grain Nb samples have been coated with 2-4 mm thick copper by electroplating. Measurements of the thermal conductivity of the bimetallic Nb/Cu samples in the range 2 ? 7 K showed values of the order of 1 kW/(m K) at 4.3 K. Very good adhesion between copper and niobium was achieved by depositing a thin Cu layer by cold spray on the niobium, prior to electroplating the bulk Cu layer.
Thermal Conductivity of Electroplated Copper Onto Bulk Niobium at Cryogenic Temperatures
Superconducting radio-frequency (SRF) cavities made of high-purity bulk niobium are widely used in modern particle accelerators. The development of metallic outer coatings with high thermal conductivity would have a beneficial impact in terms of improved thermal stability, reduced material cost and for the development of conduction-cooled, cryogen-free SRF cavities. Several high-purity, fine-grain Nb samples have been coated with 2-4 mm thick copper by electroplating. Measurements of the thermal conductivity of the bimetallic Nb/Cu samples in the range 2 ? 7 K showed values of the order of 1 kW/(m K) at 4.3 K. Very good adhesion between copper and niobium was achieved by depositing a thin Cu layer by cold spray on the niobium, prior to electroplating the bulk Cu layer.
Low-temperature electroplating of zirconium: Ionic mixture methods
Non-aqueous ionic mixture electroplating allows for room-temperature or near-room-temperature applications of thin metal films, typically metals for which aqueous solvents cannot be used. While there are many methods of plating zirconium, each has disadvantages that ionic liquid plating could correct. However, ionic liquid plating requires further research and development, as a new class of solvents were only developed a few years ago. Current ionic liquids cost several thousand dollars per liter, yet produce films with less than 90% surface coverage as well as deposition of salt species that enable interdiffusion through the Zr. Film coverage needs to be increased while maintaining approximate room temperatures and lower solvent costs. Current ionic liquid technology has suffered from poor surface wetting and limited Zr diffusivity leading to dendrite formation which inhibits total surface coverage. Zr electroplating can be improved by application of room-temperature ionic mixtures as the plating medium. We have successfully demonstrated the capability to plate high-quality metallic zirconium layers using deep eutectic solvents (DES) and DES-ionic liquid (IL) mixtures. Plating thicknesses of up to 6 microns have been achieved, and the coatings are conformal to the substrate and not dendritic, with low contamination from the plating solution. Our current method uses the DES ethaline (a 1:2 ratio of choline chloride and ethylene glycol) to complex zirconium (IV) ions (present via the addition of ZrF4). We pulse plate the Zr from a bath with an overabundance of LiF, in accordance with prior literature. We have also had success in mixing the DES with ILs, such as Triethylsulfonium bis(trifluoromethylsulfonyl)imide, 1-Butyl-3-methylpyridinium bis(trifluormethylsulfonyl)imide, Methyl-trioctylammonium bis(trifluoromethylsulfonyl)imide, and Diethylmethyl(2-methoxyethyl)ammonium bis(trifluoromethylsulfonyl)imide.
Electroplating eliminates gas leakage in brazed areas
Electroplating method seals brazed or welded joints against gas leakage under high pressure. Any conventional electroplating process with many different metal anodes can be used, as well as the build up of layers of different metals to any required thickness.
Copper and nickel adherently electroplated on titanium alloy
Anodic treatment of titanium alloy enables electroplating of tightly adherent coatings of copper and nickel on the alloy. The alloy is treated in a solution of hydrofluoric and acetic acids, followed by the electroplating process.
Investigation of electroplating procedures for magnesium lithium alloys
Electroplating methods for magnesium lithium alloys and corrosion resistance of electroplates
Spectral reflectance properties of electroplated and converted zinc for use as a solar selective coating
The spectral reflectance properties of electroplated and chemically converted zinc were measured for both chromate and chloride conversion coatings. The reflectance properties were measured for various times of conversion and for conversion at various chromate concentrations. The values of absorptance, integrated over the solar spectrum, and of infrared emittance, integrated over black body radiation at 250 F were then calculated from the measured reflectance values. The interdependent variations of absorptance and infrared emittance were plotted. The results indicate that the optimum combination of the highest absorptance in the solar spectrum and the lowest emittance in the infrared of the converted electroplated zinc is produced by chromate conversion at 1/2 concentration of the standard NEOSTAR chromate black solution for 0.50 minute or by chloride conversion for 0.50 minute.