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Results for “Electroless plating”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

Freiderich, Melissa Ensor↗
DOE OSTI2023

Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

Freiderich, Melissa Ensor↗
NASA NTRS1975

Developments in convective heat transfer models featuring seamless and selected detail surfaces, employing electroless plating

Several model/instrument concepts employing electroless metallic skin were considered for improvement of surface condition, accuracy, and cost of contoured-geometry convective heat transfer models. A plated semi-infinite slab approach was chosen for development and evaluation in a hypersonic wind tunnel. The plated slab model consists of an epoxy casting containing fine constantan wires accurately placed at specified surface locations. An electroless alloy was deposited on the plastic surface that provides a hard, uniformly thick, seamless skin. The chosen alloy forms a high-output thermocouple junction with each exposed constantan wire, providing means of determining heat transfer during tunnel testing of the model. A selective electroless plating procedure was used to deposit scaled heatshield tiles on the lower surface of a 0.0175-scale shuttle orbiter model. Twenty-five percent of the tiles were randomly selected and plated to a height of 0.001-inch. The purpose was to assess the heating effects of surface roughness simulating misalignment of tiles that may occur during manufacture of the spacecraft.

Stalmach, C. J., Jr.↗
NASA NTRS1984

Electroless-plating technique for fabricating thin-wall convective heat-transfer models

A technique for fabricating uniform thin-wall metallic heat-transfer models and which simulates a Shuttle thermal protection system tile is described. Two 6- by 6- by 2.5-in. tiles were fabricated to obtain local heat transfer rates. The fabrication process is not limited to any particular geometry and results in a seamless thin-wall heat-transfer model which uses a one-wire thermocouple to obtain local cold-wall heat-transfer rates. The tile is relatively fragile because of the brittle nature of the material and the structural weakness of the flat-sided configuration; however, a method was developed and used for repairing a cracked tile.

Avery, D. E.↗
DOE OSTI2021

SURFACE FINISHING AND ELECTROLESS NICKEL PLATING OF ADDITIVELY MANUFACTURED (AM) METAL COMPONENTS

This study investigates the application of electroless nickel deposition on additively manufactured stainless steel samples. Current additive manufacturing (AM) technologies produce metal components with a rough surface. Rough surfaces generally exhibit fatigue characteristics, increasing the probability of initiating a crack or fracture to the printed part. For this reason, the direct use of as-produced parts in a finished product cannot be actualized, which presents a challenge. Post-processing of the AM parts is therefore required to smoothen the surface. This study analyzes chempolish (CP) and electropolish (EP) surface finishing techniques for post-processing AM stainless steel components CP has a great advantage in creating uniform, smooth surfaces regardless of size or part geometry EP creates an extremely smooth surface, which reduces the surface roughness to the sub-micrometer level. In this study, we also investigate nickel deposition on EP, CP, and as-built AM components using electroless nickel solutions. Electroless nickel plating is a method of alloy treatment designed to increase manufactured component's hardness and surface resistance to the unrelenting environment. The electroless nickel plating process is more straightforward than its counterpart electroplating.. We use low-phosphorus (2-5% P), medium-phosphorus (6-9% P), and high-phosphorus (10-13% P). These Ni deposition experiments were optimized using the L9 Taguchi design of experiments (TDOE), which compromises the prosperous content in the solution, surface finish, plane of the geometry, and bath temperature. The pre-and post-processed surface of the AM parts was characterized by KEYENCE Digital MicroscopeVHX-7000 and Phenom XL Desktop SEM. The experimental results show that electroless nickel deposition produces uniform Ni coating on the additively manufactured components up to 20 μm per hour. Mechanical properties of as-built and Ni coated AM samples were analyzed by applying a standard 10 N scratch test. Nickel coated AM samples were up to two times scratch resistant compared to the as-built samples. This study suggests electroless nickel plating is a robust viable option for surface hardening and finishing AM components for various applications and operating conditions.

Keywords: additive manufacturing, fatigue, chempol↗
NASA NTRS1977

Aluminum transfer method for plating plastics

Electroless plating technique produces plate of uniform thickness. Hardness and abrasion resistance can be increased further by heat treatment. Method results in seamless coating over many materials, has low thermal conductivity, and is relatively inexpensive compared to conventional methods.

Goodrich, W. D.↗
NASA NTRS1966

Electroless nickel plating on stainless steels and aluminum

Procedures for applying an adherent electroless nickel plating on 303 SE, 304, and 17-7 PH stainless steels, and 7075 aluminum alloy was developed. When heat treated, the electroless nickel plating provides a hard surface coating on a high strength, corrosion resistant substrate.

Source record↗
NASA NTRS1986

Making a Lightweight Battery Plaque

Plaque formed in porous plastic by electroless plating. Lightweight plaque prepared by electroless plating of porous plastic contains embedded wire or expanded metal grid. Plastic may or may not be filled with soluble pore former. If it contains soluble pore former, treated to remove soluble pore former and increase porosity. Porous plastic then clamped into rig that allows plating solutions to flow through plastic. Lightweight nickel plaque used as electrode substrate for alkaline batteries, chiefly Ni and Cd electrodes, and for use as electrolyte-reservoir plates for fuel cells.

Reid, M. A.↗
DOE OSTI2021

Preparation of Mechanically Robust, Macroscopic Low-Density Gold Foams by Highly Efficient Electroless Gold Plating

Mechanically robust, macroscopic-sized low-density gold foams with unique morphology of hollow gold shells were prepared by the synthesis of gold-coated polystyrene coreshell particles followed by thermal removal of the polymer core. Here, we reported a simple, highly efficient electroless gold plating procedure to form ultrathin, conformal gold coatings on the surface of polystyrene particles. A modified, scalable casting approach to form uniform, large monoliths (up to 1 cm diameter) and a baking condition to minimize undesirable densification of final foams were also developed. To demonstrate the mechanical stability and integrity of the Au foams, a representative monolithic sample (~0.9 g/ cm3 ) was successfully cut and shaped into a gold foam “washer” by a series of precision machining and processing. A depth-sensing indentation test (nanoindentation) as well as characterizations on other useful properties such as surface areas and electrical conductivity of the Au foams were carried out to understand the mechanical behavior and potential applicability.

Electroless Gold Plating↗
NASA NTRS1976

Aeroheating model advancements featuring electroless metallic plating

Discussed are advancements in wind tunnel model construction methods and hypersonic test data demonstrating the methods. The general objective was to develop model fabrication methods for improved heat transfer measuring capability at less model cost. A plated slab model approach was evaluated with cast models containing constantan wires that formed single-wire-to-plate surface thermocouple junctions with a seamless skin of electroless nickel alloy. The surface of a space shuttle orbiter model was selectively plated with scaled tiles to simulate, with high fidelity, the probable misalignments of the heatshield tiles on a flight vehicle. Initial, Mach 8 heating results indicated a minor effect of tile misalignment roughness on boundary layer transition, implying a possible relaxation of heatshield manufacturing tolerances. Some loss of the plated tiles was experienced when the model was tested at high heating rates.

Stalmach, C. J., Jr.↗
DOE OSTI2021

Compact ammonia reforming at low temperature using catalytic membrane reactors

Ammonia is a leading carrier for the storage and transport of renewable hydrogen, but its deployment requires scalable technologies for efficient decomposition and purification. In this work, we report on the efficient delivery of high purity hydrogen from ammonia decomposition using a catalytic membrane reactor (CMR). Improvements to the electroless plating process reduced the Pd membrane thickness by >35%, resulting in commensurate increases in hydrogen permeance without sacrificing selectivity. To increase throughput a commercial Ru/Al 2 O 3 catalyst was added to the lumen, and the CMR could process ammonia flowrates 10–50 times higher than an equivalent packed bed reactor while maintaining the same level of conversion. It is shown that the earth-abundant zeolite clinoptilolite could reduce ammonia impurities in the permeated H 2 to the levels required by PEM fuel cells (<25 ppb). Performance increased significantly across a >500-h durability test due to improvements in membrane permeability. Finally, the results show that CMRs are a viable technology for distributed production of hydrogen from ammonia.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2023

Characterization of electroless nickel-phosphorus plating for ultracold-neutron storage

Electroless nickel plating is an established industrial process that provides a robust and relatively low-cost coating suitable for transporting and storing ultracold neutrons (UCN). Using roughness measurements and UCN-storage experiments we characterized UCN guides made from polished aluminum or stainless-steel tubes plated by several vendors. All electroless nickel platings were similarly suited for UCN storage with an average loss probability per wall bounce of 2.8 • 10 -4 to 4.1 • 10 -4 for energies between 90 neV and 190 neV, or a ratio of imaginary to real Fermi potential η of 1.7 • 10 -4 to 3.3 • 10 -4 . Measurements at different elevations indicate that the energy dependence of UCN losses is well described by the imaginary Fermi potential. Some special considerations are required to avoid an increase in surface roughness during the plating process and hence a reduction in UCN transmission. Increased roughness had only a minor impact on storage properties. In conclusion, based on these findings we chose a vendor to plate the UCN-production vessel that will contain the superfluid-helium converter for the new TRIUMF UltraCold Advanced Neutron (TUCAN) source, achieving acceptable UCN-storage properties with η = 3.5(5)•10 -4 .

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
NASA NTRS1972

Plating methods, a survey

Results are presented of a comprehensive search of the literature available, much of which has been generated by the research centers of NASA and its contractors, on plating and coating methods and techniques. Methods covered included: (1) electroplating from aqueous solutions; (2) electroplating from nonaqueous solutions; (3) electroplating from fused-salt baths; (4) electroforming; (5) electroless plating, immersion plating, and mirroring; (6) electroplating from gaseous plasmas; and (7) anodized films and conversion coatings.

Berkowitz, J. B.↗
NASA NTRS1982

Surface texturing of fluoropolymers

A method is disclosed for improving surface texture for adhesive bonding, metal bonding, substrate plating, decal substrate preparation, and biomedical implant applications. The surface to be bonded is dusted in a controlled fashion to produce a disbursed layer of fine mesh particles which serve as masks. The surface texture is produced by impinging gas ions on the masked surface. The textured surface takes the form of pillars or cones. The bonding material, such as a liquid epoxy, flows between the pillars which results in a bond having increased strength. For bonding metals a thin film of metal is vapor or sputter deposited onto the textured surface. Electroplating or electroless plating is then used to increase the metal thickness in the desired amount.

Banks, B. A.↗
DOE OSTI2025

Self‐Assembled Monolayer Templating for Engineered Nanopinholes in Passivated Contact Solar Cells

We present a novel self-assembled monolayer (SAM)-based technique to make nanopinhole-enabled passivated contacts on silicon solar cells by tuning the SAM coverage area and etch selectivity. We deposit trimethyl-silyl Si(CH 3 ) 3 groups using hexamethyldisilazane (HMDS) as the precursor over passivating dielectric layers and their stacks (SiO 2 , SiN x , SiO 2 /SiN x ) and interrupt the HMDS attachment chemistry shortly before a full monolayer is formed on its surface. Subsequent etching in dilute HF produces pinholes through the dielectric layers due to the higher etch resistance of the SAM to HF etching. The pinhole areal density (10 4 –10 8 /cm 2 ) and size (10–1000 nm) can be tuned both by duration of HMDS attachment and HF etch time. Pinholes were characterized by atomic force microscopy, tetramethylammonium hydroxide (TMAH) selective etch, and Ag decoration by electroless plating. Polysilicon (poly-Si) passivated contacts enabled by pinholes were formed by subsequent deposition of doped amorphous silicon (a-Si:H) followed by thermal crystallization and dopant drive-in. At optimal areal pinhole density ≈10 7 /cm 2 , contacts exhibit both passivation and carrier transport via pinholes as evidenced by electron beam induced current, transmission line measurements, and carrier lifetime measurements. Solar cells based with these pinhole contacts show V oc = 723 mV and FF = 80.3%. The remaining SAM layer does not affect device performance.

14 SOLAR ENERGY↗
DOE OSTI2024

Pool Boiling Reliability Tests and Degradation Mechanisms of Microporous Copper Inverse Opal (CuIOs) Structures

The rising power density in electronic systems requires thermal management solutions that are both high-performing and reliable. Porous materials such as Copper Inverse Opal (CuIOs) have unique structural features, including high permeability and high thermal conductivity, to enhance pool boiling performance. However, there is little understanding of the degradation mechanism of such porous materials under pool boiling conditions. In this study, samples of 10 ..mu..m thick CuIOs with 4.8 ..mu..m diameter, covering silicon substrate of area 11 mm x 11 mm, with various heated areas ranging from 2.5 mm x 2.5 mm to 10 mm x 10 mm, were tested in 100 degrees C deionized water at a constant heat flux of 110 Wcm -2 for 3-to-7 days. The combined effect of erosion and corrosion caused structural degradation of the CuIOs. The directly heated area had the most severe degradation while the edge of the heater and the unheated area showed progressively less degradation, maintaining some CuIOs structure even after the 7-day reliability test. Among all the tested samples with various heater sizes, the 2.5 mm x 2.5 mm heater sample - in which the heater size was designed to be comparable to the water bubble characteristic length - had the largest critical heat flux (CHF) up to 300 Wcm -2 with a superheat ~ 13 degrees C. Additionally, CuIOs with a smaller heated area performed better in terms of reliability. This study offers preliminary insights into CuIOs degradation mechanisms, contributing to the development of more robust thermal management solutions. We expect that electroless plating of CuIOs with gold (Au), nickel (Ni), and atomic layer deposition (ALD) aluminum oxide (Al 2 O 3 ) in combination with appropriate application-specific coolants will further improve the reliability and lifetime of the CuIOs.

boiling-induced degradation↗