Results for “Electroless plating”

NASA NTRS1975

Developments in convective heat transfer models featuring seamless and selected detail surfaces, employing electroless plating

Several model/instrument concepts employing electroless metallic skin were considered for improvement of surface condition, accuracy, and cost of contoured-geometry convective heat transfer models. A plated semi-infinite slab approach was chosen for development and evaluation in a hypersonic wind tunnel. The plated slab model consists of an epoxy casting containing fine constantan wires accurately placed at specified surface locations. An electroless alloy was deposited on the plastic surface that provides a hard, uniformly thick, seamless skin. The chosen alloy forms a high-output thermocouple junction with each exposed constantan wire, providing means of determining heat transfer during tunnel testing of the model. A selective electroless plating procedure was used to deposit scaled heatshield tiles on the lower surface of a 0.0175-scale shuttle orbiter model. Twenty-five percent of the tiles were randomly selected and plated to a height of 0.001-inch. The purpose was to assess the heating effects of surface roughness simulating misalignment of tiles that may occur during manufacture of the spacecraft.

Stalmach, C. J., Jr.↗

NASA NTRS1984

Electroless-plating technique for fabricating thin-wall convective heat-transfer models

A technique for fabricating uniform thin-wall metallic heat-transfer models and which simulates a Shuttle thermal protection system tile is described. Two 6- by 6- by 2.5-in. tiles were fabricated to obtain local heat transfer rates. The fabrication process is not limited to any particular geometry and results in a seamless thin-wall heat-transfer model which uses a one-wire thermocouple to obtain local cold-wall heat-transfer rates. The tile is relatively fragile because of the brittle nature of the material and the structural weakness of the flat-sided configuration; however, a method was developed and used for repairing a cracked tile.

Avery, D. E.↗

NASA NTRS1977

Aluminum transfer method for plating plastics

Electroless plating technique produces plate of uniform thickness. Hardness and abrasion resistance can be increased further by heat treatment. Method results in seamless coating over many materials, has low thermal conductivity, and is relatively inexpensive compared to conventional methods.

Goodrich, W. D.↗

NASA NTRS1966

Electroless nickel plating on stainless steels and aluminum

Procedures for applying an adherent electroless nickel plating on 303 SE, 304, and 17-7 PH stainless steels, and 7075 aluminum alloy was developed. When heat treated, the electroless nickel plating provides a hard surface coating on a high strength, corrosion resistant substrate.

Source record↗

NASA NTRS1986

Making a Lightweight Battery Plaque

Plaque formed in porous plastic by electroless plating. Lightweight plaque prepared by electroless plating of porous plastic contains embedded wire or expanded metal grid. Plastic may or may not be filled with soluble pore former. If it contains soluble pore former, treated to remove soluble pore former and increase porosity. Porous plastic then clamped into rig that allows plating solutions to flow through plastic. Lightweight nickel plaque used as electrode substrate for alkaline batteries, chiefly Ni and Cd electrodes, and for use as electrolyte-reservoir plates for fuel cells.

Reid, M. A.↗

NASA NTRS1976

Aeroheating model advancements featuring electroless metallic plating

Discussed are advancements in wind tunnel model construction methods and hypersonic test data demonstrating the methods. The general objective was to develop model fabrication methods for improved heat transfer measuring capability at less model cost. A plated slab model approach was evaluated with cast models containing constantan wires that formed single-wire-to-plate surface thermocouple junctions with a seamless skin of electroless nickel alloy. The surface of a space shuttle orbiter model was selectively plated with scaled tiles to simulate, with high fidelity, the probable misalignments of the heatshield tiles on a flight vehicle. Initial, Mach 8 heating results indicated a minor effect of tile misalignment roughness on boundary layer transition, implying a possible relaxation of heatshield manufacturing tolerances. Some loss of the plated tiles was experienced when the model was tested at high heating rates.

Stalmach, C. J., Jr.↗

NASA NTRS1972

Plating methods, a survey

Results are presented of a comprehensive search of the literature available, much of which has been generated by the research centers of NASA and its contractors, on plating and coating methods and techniques. Methods covered included: (1) electroplating from aqueous solutions; (2) electroplating from nonaqueous solutions; (3) electroplating from fused-salt baths; (4) electroforming; (5) electroless plating, immersion plating, and mirroring; (6) electroplating from gaseous plasmas; and (7) anodized films and conversion coatings.

Berkowitz, J. B.↗

NASA NTRS1982

Surface texturing of fluoropolymers

A method is disclosed for improving surface texture for adhesive bonding, metal bonding, substrate plating, decal substrate preparation, and biomedical implant applications. The surface to be bonded is dusted in a controlled fashion to produce a disbursed layer of fine mesh particles which serve as masks. The surface texture is produced by impinging gas ions on the masked surface. The textured surface takes the form of pillars or cones. The bonding material, such as a liquid epoxy, flows between the pillars which results in a bond having increased strength. For bonding metals a thin film of metal is vapor or sputter deposited onto the textured surface. Electroplating or electroless plating is then used to increase the metal thickness in the desired amount.

Banks, B. A.↗

NASA NTRS1977

Low-cost solar-cell fabrication

Processing steps are reduced by using technique of electroless plating. Metalization and one doping steps are combined, and only one heat treatment is required. Concept is modification to method of fabricating solar cells by diffusing different dopants into opposite sides of a silicon wafer.

Amick, J. A.↗

NASA NTRS1977

Effects of scaled heatshield tile misalignment on Orbiter boundary-layer transition

The article addresses the problem of assessing the sensitivity of the heat transfer rate of a Space Orbiter windward surface and boundary-layer transition data to surface features, or 'roughness elements', characteristic of randomly misaligned heat shield tiles. Selected heat shield tiles were precision-formed on the surface of a 0.0175-scale Orbiter model. Selective electroless plating and selective electrochemical etching techniques were employed. Effects of roughness on the location of boundary-layer transition were markedly influenced by the wall-to-total temperature ratios, according to wind-tunnel test results.

Goodrich, W. D.↗

NASA NTRS1979

Development of Low Cost Contacts to Silicon Solar Cells

Different electroless plating systems were evaluated in conjunction with copper electroplating. All tests involved simultaneous deposition of front and back contacts using a standard cell materials. Cells with good adhesion and good curve fill factors were obtained using a palladium-chromium-copper metallization system. The final copper contact system was evaluated to determine if the copper would migrate at elevated temperatures. The copper migrated at elevated temperatures causing cell output degradation.

Iles, P. A.↗

NASA NTRS1979

Phase 2 of the Array Automated Assembly Task for the Low Cost Solar Array Project

Two process specifications supplied by contractors were tested. The aluminum silk screening process resulted in cells comparable to those from sputtered Al. The electroless plating of contacts specification could be used only with extensive modification. Several experiments suggest that there is some degradation of the front junction during the Al back surface field (BSF) fabrication. A revised process sequence was defined which incorporates Al BSF formation. A cost analysis of this process yielded a selling price of $0.75/watt peak in 1980.

Campbell, R. B.↗

NASA NTRS1981

Forming electrical interconnections through semiconductor wafers

An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

Anthony, T. R.↗

NASA NTRS1993

Control of interfaces in Al-C fibre composites

The interface of Al-C fiber composite was modified by coating a silver layer on the surface of carbon fibres prior to making composites, in an attempt to improve the wettability between molten aluminum and carbon fibers during infiltration. An electroless plating technique was adopted and perfected to provide a homogeneous silver coating on the carbon fiber surface. Al-C fiber composites were prepared using a liquid infiltration technique in a vacuum. It was found that silver coating promoted the wetting between aluminum and carbon fibers, particularly with polyacrylonitrile-base carbon fibers. However, due to rapid dissolution of silver in molten aluminum, it was believed that the improved infiltration was not due to the wetting behavior between molten aluminum and silver. The cleaning of the fiber surface and the preservation of the cleaned carbon surface with silver coating was considered to be the prime reason for the improved wettability. Interfacial reactions between aluminum and carbon fibers were observed. Amorphous carbon was found to react more with aluminum than graphitic carbon. This is believed to be because of the inertness of the graphitic basal planes.

Warrier, S. G.↗

NASA NTRS2013

Copper-Multiwall Carbon Nanotubes and Copper-Diamond Composites for Advanced Rocket Engines

This paper reports on the research effort to improve the thermal conductivity of the copper-based alloy NARloy-Z (Cu-3 wt.%Ag-0.5 wt.% Zr), the state-of-the-art alloy used to make combustion chamber liners in regeneratively-cooled liquid rocket engines, using nanotechnology. The approach was to embed high thermal conductivity multiwall carbon nanotubes (MWCNTs) and diamond (D) particles in the NARloy-Z matrix using powder metallurgy techniques. The thermal conductivity of MWCNTs and D have been reported to be 5 to 10 times that of NARloy-Z. Hence, 10 to 20 vol. % MWCNT finely dispersed in NARloy-Z matrix could nearly double the thermal conductivity, provided there is a good thermal bond between MWCNTs and copper matrix. Quantum mechanics-based modeling showed that zirconium (Zr) in NARloy-Z should form ZrC at the MWCNT-Cu interface and provide a good thermal bond. In this study, NARloy-Z powder was blended with MWCNTs in a ball mill, and the resulting mixture was consolidated under high pressure and temperature using Field Assisted Sintering Technology (FAST). Microstructural analysis showed that the MWCNTs, which were provided as tangles of MWCNTs by the manufacturer, did not detangle well during blending and formed clumps at the prior particle boundaries. The composites made form these powders showed lower thermal conductivity than the base NARloy-Z. To eliminate the observed physical agglomeration, tangled multiwall MWCNTs were separated by acid treatment and electroless plated with a thin layer of chromium to keep them separated during further processing. Separately, the thermal conductivities of MWCNTs used in this work were measured, and the results showed very low values, a major factor in the low thermal conductivity of the composite. On the other hand, D particles embedded in NARloy-Z matrix showed much improved thermal conductivity. Elemental analysis showed migration of Zr to the NARloy-Z-D interface to form ZrC, which appeared to provide a low contact thermal resistance. These results are consistent with the quantum mechanics-based model predictions. NARloy-Z-D composites have relatively high thermal conductivities and are promising for further development.

Bhat, Biliyar N.↗

NASA NTRS2013

Copper Multiwall Carbon Nanotubes and Copper-Diamond Composites for Advanced Rocket Engines

This paper reports on the research effort to improve the thermal conductivity of the copper-based alloy NARloy-Z (Cu-3 wt.%Ag-0.5 wt.% Zr), the state-of-the-art alloy used to make combustion chamber liners in regeneratively-cooled liquid rocket engines, using nanotechnology. The approach was to embed high thermal conductivity multiwall carbon nanotubes (MWCNTs) and diamond (D) particles in the NARloy-Z matrix using powder metallurgy techniques. The thermal conductivity of MWCNTs and D have been reported to be 5 to 10 times that of NARloy-Z. Hence, 10 to 20 vol. % MWCNT finely dispersed in NARloy-Z matrix could nearly double the thermal conductivity, provided there is a good thermal bond between MWCNTs and copper matrix. Quantum mechanics-based modeling showed that zirconium (Zr) in NARloy-Z should form ZrC at the MWCNT-Cu interface and provide a good thermal bond. In this study, NARloy-Z powder was blended with MWCNTs in a ball mill, and the resulting mixture was consolidated under high pressure and temperature using Field Assisted Sintering Technology (FAST). Microstructural analysis showed that the MWCNTs, which were provided as tangles of MWCNTs by the manufacturer, did not detangle well during blending and formed clumps at the prior particle boundaries. The composites made form these powders showed lower thermal conductivity than the base NARloy-Z. To eliminate the observed physical agglomeration, tangled multiwall MWCNTs were separated by acid treatment and electroless plated with a thin layer of chromium to keep them separated during further processing. Separately, the thermal conductivities of MWCNTs used in this work were measured, and the results showed very low values, a major factor in the low thermal conductivity of the composite. On the other hand, D particles embedded in NARloy-Z matrix showed much improved thermal conductivity. Elemental analysis showed migration of Zr to the NARloy-Z-D interface to form ZrC, which appeared to provide a low contact thermal resistance. These results are consistent with the quantum mechanics-based model predictions. NARloy-Z-D composites have relatively high thermal conductivities and are promising for further development.

Bhat, Biliyar N.↗

NASA NTRS1980

Phase 2 of the array automated assembly task for the low cost silicon solar array project

Studies were conducted on several fundamental aspects of electroless nickel/solder metallization for silicon solar cells. A process, which precedes the electroless nickel plating with several steps of palladium plating and heat treatment, was compared directly with single step electroless nickel plating. Work was directed toward answering specific questions concerning the effect of silicon surface oxide on nickel plating, effects of thermal stresses on the metallization, sintering of nickel plated on silicon, and effects of exposure to the plating solution on solar cell characteristics. The process was found to be extremely lengthy and cumbersome, and was also found to produce a product virtually identical to that produced by single step electroless nickel plating, as shown by adhesion tests and electrical characteristics of cells under illumination.

Petersen, R. C.↗

NASA NTRS1980

Active heat exchange system development for latent heat thermal energy storage

Alternative mechanizations of active heat exchange concepts were analyzed for use with heat of fusion Phase Change Materials (PCM's) in the temperature range of 250 C to 350 C for solar and conventional power plant applications. Over 24 heat exchange concepts were reviewed, and eight were selected for detailed assessment. Two candidates were chosen for small-scale experimentation: a coated tube and shell that exchanger, and a direct contact reflux boiler. A dilute eutectic mixture of sodium nitrate and sodium hydroxide was selected as the PCM from over fifty inorganic salt mixtures investigated. Preliminary experiments with various tube coatings indicated that a nickel or chrome plating of Teflon or Ryton coating had promise of being successful. An electroless nickel plating was selected for further testing. A series of tests with nickel-plated heat transfer tubes showed that the solidifying sodium nitrate adhered to the tubes and the experiment failed to meet the required discharge heat transfer rate of 10 kW(t). Testing of the reflux boiler is under way.

Lefrois, R. T.↗