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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Parametric Design Study of a Power Electronics Package

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2021

Thermal and Mechanical Design of a High-Voltage Power Electronics Package: Preprint

Thermal and mechanical design aspects of a power electronic package with 5-kV GaN devices are presented. Through finite element analyses, the impact of different cooling configurations and device location on the thermal performance and reliability of the package was investigated. It was found that placing the devices closer to the direct-bond-copper substrate as opposed to a centered approach in the proposed double-sided-cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

27 ARPA - Advanced Research Projects Agency-Energy↗
DOE OSTI2022

Experiments and modelling of adhesive failure initiation of an epoxy underfill: a study of electronic packaging survivability

Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. For this study, data from epoxy bond failure in mock electronic part assemblies were correlated to finite element analyses to predict adhesive failure initiation. Experiments were performed to determine failure loads for various loading locations and nonlinear viscoelastic analyses were performed for the same loading locations to determine a maximum principal strain failure parameter. Predictions showed that a maximum principal strain failure parameter defined from one test could be used as an indicator of adhesive failure of an epoxy bond undergoing other modes of loading. Failure initiation predictions matched experimental data using a maximum principal strain failure parameter for an epoxy bond undergoing mixed modes of loading for both unfilled and alumina oxide filled 828DEA epoxy. Such experimental setup is deemed appropriate for future epoxy testing.

42 ENGINEERING↗
DOE OSTI2024

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level: Part 2

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. Here, to increase power density, performance, efficiency, and reliability-as well as to reduce cost-innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental R&D related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics, packaging materials, thermal materials and interfaces, fluid-based thermal management technologies, reliability, condition monitoring, and prognostics. Latest developments in this area are published as a Special Section on Multiphysics Aspects of Power Electronics Packaging. The first part was published in the May 2024 issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology (Volume 14, Issue 5). The second part of that Special Section is being published in this issue. A brief summary of the papers included in the second part are given below.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2021

Thermal and Mechanical Design of a High-Voltage Power Electronics Package

This paper presents the thermal and mechanical design aspects of a power electronics package with 5-kV GaN devices. Through finite element analyses, we investigated the impact of different cooling configurations and device locations on the thermal performance and reliability of the package. We found that placing the devices closer to the direct bond copper substrate as opposed to a centered approach in the proposed double-sided cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

electronic packaging↗
DOE OSTI2024

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging - Power Die, Power Module, and Converter Level - Part 1

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. To increase power density, performance, efficiency, and reliability and reduce cost, innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental research and development related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics; packaging materials; thermal materials and interfaces; fluid-based thermal management technologies; reliability; condition monitoring; and prognostics. To address these important aspects, this Special Section on Multiphysics Aspects of Power Electronics Packaging includes several articles to be published in two parts. More details are given below on the articles included in the first part.

condition monitoring↗
DOE OSTI2026

Enhancing 300 Degree Celsius Electronic Packaging with Ceramic PCBs and Advanced Interconnection Techniques

Geothermal energy development requires downhole tools that operate reliably at temperatures up to 320 °C. While MWD tools work without thermal protection and logging tools use vacuum flasks for limited high-temperature use, Sandia National Laboratories is developing durable electronics on ceramic PCBs with protective coatings to enable long-term operation of geothermal instruments at sustained temperatures up to 300 °C.

Wright, Andrew Alexander [Sandia National Laborato↗
DOE OSTI2023

Silicon Carbide Inverter for Off-Road Heavy-Duty Applications: The Importance of Thermal and Thermomechanical Design in Power Electronics Packaging

Electrification of drivetrain systems is now seen as a major opportunity by the transportation industry across the globe to reduce the greenhouse gas emissions and revolutionize the travel patterns of millions of people. The cumulative number of plug-in hybrid and battery electric vehicles (EVs) sold in the United States has now surpassed 2 million in 2021, according to the International Energy Agency. The introduction of EVs in different classes of passenger vehicles and the continued drop in prices spurred by government incentives have attracted the attention of consumers despite certain barriers, such as higher initial cost and range anxiety. In the United States, the EV market share is now growing at an exponential pace, with the domestic automakers allocating a lion's share of new and future car sales to EVs. Additionally, different market studies project decreasing cost and rising sales of medium- and heavy-duty electric trucks. Although electrification initiatives are strongly pursued in the on-road passenger vehicle market, off-highway sectors, such as construction, mining, and agriculture, are also gradually implementing electric drivetrain technologies in their machineries. As EVs grow in popularity on a global scale, innovative drivetrain technologies must meet the increasing energy demand by significantly increasing system efficiency.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2024

High-throughput electronic structure package

We introduce HTESP (High-Throughput Electronic Structure Package), an automated tool designed for high-throughput ab initio calculations. HTESP simplifies the entire workflow, including data extraction, input files generation, calculation submission, result collection, and plotting. The package is implemented in Python and Bash languages. In this paper, we provide detailed information about the package, its installation process and some illustrative examples to demonstrate its usage. Additionally, the package includes comprehensive online documentation on input parameters and tutorials to assist users.

Nepal, NirajK↗
DOE OSTI2024

GPAW: An open Python package for electronic structure calculations

We review the GPAW open-source Python package for electronic structure calculations. GPAW is based on the projector-augmented wave method and can solve the self-consistent density functional theory (DFT) equations using three different wave-function representations, namely real-space grids, plane waves, and numerical atomic orbitals. The three representations are complementary and mutually independent and can be connected by transformations via the real-space grid. This multi-basis feature renders GPAW highly versatile and unique among similar codes. By virtue of its modular structure, the GPAW code constitutes an ideal platform for the implementation of new features and methodologies. Moreover, it is well integrated with the Atomic Simulation Environment (ASE), providing a flexible and dynamic user interface. In addition to ground-state DFT calculations, GPAW supports many-body GW band structures, optical excitations from the Bethe–Salpeter Equation, variational calculations of excited states in molecules and solids via direct optimization, and real-time propagation of the Kohn–Sham equations within time-dependent DFT. A range of more advanced methods to describe magnetic excitations and non-collinear magnetism in solids are also now available. In addition, GPAW can calculate non-linear optical tensors of solids, charged crystal point defects, and much more. Recently, support for graphics processing unit (GPU) acceleration has been achieved with minor modifications to the GPAW code thanks to the CuPy library. We end the review with an outlook, describing some future plans for GPAW.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2026

Spatiotemporal Learning in Power Modules: Wavelet-Enhanced Forecasting of Thermomechanical Degradation

Detecting internal defects in power electronics packages is critical for their performance and reliability, especially under extreme operating conditions, as these defects can lead to catastrophic failure if not properly addressed. Confocal scanning acoustic microscopy (C-SAM) plays a key role in the nondestructive evaluation of bond layer degradation within a power electronics package by detecting defects such as delamination, voids, and cracks. However, accurately quantifying and predicting these defects from C-SAM images remains a significant challenge due to the low noise-to-signal ratio, which typically arises from both imaging process and bond patterns itself. In this paper, we explore machine learning strategies for processing C-SAM images and providing predictive models of defect growth. We use C-SAM images of sintered copper and sintered silver samples, which are obtained under accelerated thermal experiments, as the representative dataset for our study. We investigate the effect of Fourier transforms and wavelet transforms on these datasets to remove high-frequency noise and address noise across multiple scales with histogram equalization to enhance the contrast and improve the visibility of defects. As a result, defect boundaries can be clearly distinguished, enabling more accurate tracking of their growth over time. We then employ different time-series forecasting algorithms on the denoised images to formulate an image-based lifetime prediction model. Statistical models and deep-learning techniques are trained on images obtained in the early stages of thermal shock, and defect growth in the later stages is predicted. Our work serves as a preliminary attempt to improve the accuracy of lifetime prediction models of power electronics packages, which is critical under extreme operating environments.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2024

HTESP (High-throughput electronic structure package): A package for high-throughput ab initio calculations

High-throughput ab initio calculations are the indispensable parts of data-driven discovery of new materials with desirable properties, as reflected in the establishment of several online material databases. The accumulation of extensive theoretical data through computations enables data-driven discovery by constructing machine learning and artificial intelligence models to predict novel compounds and forecast their properties. Efficient usage and extraction of data from these existing online material databases can accelerate the next stage materials discovery that targets different and more advanced properties, such as electron–phonon coupling for phonon-mediated superconductivity. However, extracting data from these databases, generating tailored input files for different ab initio calculations, performing such calculations, and analyzing new results can be demanding tasks. Here, in this work, we introduce a software package named “HTESP” (High-Throughput Electronic Structure Package) written in Python and Bash languages, which automates the entire workflow including data extraction, input file generation, calculation submission, result collection and plotting. Our HTESP will help speed up future computational materials discovery processes.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Integrated package of electron cyclotron emission imaging data processing and forward modeling in OMFIT

An Electron Cyclotron Emission Imaging (ECEI) data analysis module has been developed for the OMFIT platform to accommodate the needs of users at the DIII-D tokamak for physics applications. The user can easily access the ECEI spatial observation windows in the plasma that are calculated based on the automatically retrieved hardware setup and available DIII-D equilibria, perform spectral analysis, and make 2D electron temperature fluctuation images. The module provides a powerful data post processing package for extracting important physics parameters from the 2D measurements, including the radial structure and poloidal mode number of Alfven Eigenmodes, as well as the frequency-vs-wavenumber dispersion relationship of broadband MHD. Lastly, the module propagates characterized synthetic fluctuations for the user, so one can perform forward modeling tasks with simple analytical fluctuations.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2020

TeraChem: A graphical processing unit-accelerated electronic structure package for large-scale ab initio molecular dynamics

TeraChem was born in 2008 with the goal of providing fast on-the-fly electronic structure calculations to facilitate ab initio molecular dynamics studies of large biochemical systems such as photoswitchable proteins and multichromophoric antenna complexes. Originally developed for videogaming applications, graphics processing units (GPUs) offered a low-cost parallel computer architecture that became more accessible for general-purpose GPU computing with the release of CUDA in 2007. The evaluation of the electron repulsion integrals (ERIs) is a major bottleneck in electronic structure codes and provides an attractive target for acceleration on GPUs. Thus, highly efficient routines for evaluation of and contractions between the ERIs and density matrices were implemented in TeraChem. Here, electronic structure methods were developed and implemented to leverage these integral contraction routines, resulting in the first quantum chemistry package designed from the ground up for GPUs. This GPU acceleration makes TeraChem capable of performing large-scale ground and excited state calculations in the gas and condensed phase. Today, TeraChem's speed forms the basis for a suite of quantum chemistry applications, including optimization and dynamics of proteins, automated and interactive chemical discovery tools, and large-scale nonadiabatic dynamics simulations.

74 ATOMIC AND MOLECULAR PHYSICS↗
DOE OSTI2025

Thermal Management for Planar Package Power Electronics (CRADA Final Report)

The National Renewable Energy Laboratory (NREL) and John Deere Electronic Solutions (JDES) collaborated to develop and evaluate computer models and simulations related to the thermal performance of semiconductor device packaging for an inverter of an off-road vehicle ("Semiconductor Packaging"). The objective of the research was for NREL and JDES to develop a two or three-dimensional computer-aided design model of the Semiconductor Packaging ("Computer Model") for thermal performance evaluation in a simulation. The project developed computer models of a Semiconductor Package of silicon-carbide semiconductor devices with appropriate thermal dissipation via one or more of the following thermal features: a double-sided planar cooling configuration, an air-cooled configuration, a liquid-cooled configuration for off-road inverter applications in a relevant simulated operating environment. It is noted that surface area and prototype product embodiment consisting of air-cooled and liquid-cooled configurations may and may not be in direct contact with power semiconductor chips. The idea was to explore and develop packaging and thermal management technology for power semiconductors that was most effective in the performance yet had least burden in overall product cost for a given application.

33 ADVANCED PROPULSION SYSTEMS↗