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Acoustically Enhanced Electroplating Being Developed
In cooperation with the NASA Glenn Research Center, Alchemitron Corp. is developing the Acoustically Enhanced Electroplating Process (AEEP), a new technique of employing nonlinear ultrasonics to enhance electroplating. The applications range from electroplating full-panel electronic circuit boards to electroplating microelectronics and microelectromechanical systems (MEMS) devices. In a conventional plating process, the surface area to be plated is separated from the nonplated areas by a temporary mask. The mask may take many forms, from a cured liquid coating to a simple tape. Generally, the mask is discarded when the plating is complete, creating a solid waste product that is often an environmental hazard. The labor and materials involved with the layout, fabrication, and tooling of masks is a primary source of recurring and nonrecurring production costs. The objective of this joint effort, therefore, is to reduce or eliminate the need for masks. AEEP improves selective plating processes by using directed beams of high-intensity acoustic waves to create nonlinear effects that alter the fluid dynamic and thermodynamic behavior of the plating process. It relies on two effects: acoustic streaming and acoustic heating. Acoustic streaming is observed when a high-intensity acoustic beam creates a liquid current within the beam. The liquid current can be directed as the beam is directed and, thus, users can move liquid around as desired without using pumps and nozzles. The current of the electroplating electrolyte, therefore, can be directed at distinct target areas where electroplating is desired. The current delivers fresh electrolyte to the target area while flushing away the spent electrolyte. This dramatically increases the plating rate in the target area. In addition, acoustic heating of both the liquid in the beam and the target surface increases the chemical reaction rate, which further increases the plating rate. The combined effects of acoustic streaming and heating accelerate the deposition of plating in that area and, thus, provide an effect similar to a mask but without the costs of masking. AEEP further improves the plating process by clearing debris and bubbles from the surface by acoustic radiation pressure and acoustic streaming.
Electroplating Zr on U-Mo Foils: Process Qualification Report
Fuel Fabrication identified electroplating of zirconium onto the U-Mo fuel low enriched fuel for high performance reactors as an alternative technology. The Process Qualification was performed under the Process Qualification Plan for Fabrication of MP-1 Zirconium Electroplated Foils, Pacific Northwest National Laboratory (PNNL), 67075-PQP-0001. On December 14, 2016 PNNL was authorized to begin qualification plating runs effective January 2017 by the Fuel Fabrication Pillar. PNNL began electroplating of the BWX Technologies Nuclear Operation Group provided qualification bare foils. Receipt inspection of foils identified numerous issues with the surface quality of the foils. Zirconium Electroplating of the 12 thick and 12 thin foils was completed in March 2017. This report summarizes the results of qualification plating runs and provides the documentation necessary to qualify the electroplating process and authorize PNNL to begin plating of the MP-1 foils. Prior to plating of the MP-1 foils, PNNL will be plating demonstration low enriched uranium (LEU).
Evaluation of Anodized and Electroplated Radioactive Check Sources for Radiological Monitoring Instruments
Radioactive check sources are often used for source checking calibrated instruments to confirm accurate readings are obtained from radiological monitoring instruments. Because of the importance of check sources and their application, PNNL conducted a study to evaluate the effectiveness and accuracy of active sources produced using different construction methods. Eleven, randomly selected check sources of both anodized (five) and electroplated (six) construction were evaluated, along with their calculated decay curves, to determine how well they withstand consistent, multi-year use in the field. Results show that the anodized and electroplated check sources evaluated hold up well enough to continue their use, regardless of wear and tear sustained over years of use. This report provides the source information, empirical data for the 11 anodized and electroplated check sources and their representative decay curves, and it documents the conclusion that anodized and electroplated check sources are reliable for routine use in the field over multiple years.
Water-Based Electroplating Maskant Is Safer
Report proposes use of commercial water-based electroplating maskant Tolber 0-18 as nontoxic alternative to commercial organic-solvent-based electroplating maskant Turco 531-A. Tolber 0-18 found to be equal or superior in key properties, including suitability for application by brushing, effectiveness of sealing, and durability. In addition, exerts no adverse effect on environment or on health of workers, and enables users to comply with local and federal antipollution laws. Use of maskant proves beneficial in most, if not all, electroplating applications involving brush application of maskants to areas not to be electroplated.
Electroplated AU for conformal coating of high aspect ratio silicon structures
A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
Electroplated Au for conformal coating of high aspect ratio silicon structures
A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
Devices for Thermal Conductivity Measurements of Electroplated Bi for X-ray TES Absorbers
Electroplated bismuth (Bi) is commonly used in transition-edge sensors (TESs) for X-rays because of its high stopping power and low heat capacity (Collan in Phys Rev B 1:2888, 1970, Yan in Appl Phys Lett 111:192602, 2017). Electroplated Bi is usually grown on top of another metal that acts as seed layer, typically gold (Au), making it challenging to extrapolate its thermoelectric properties. In this work, we present four-wire resistance measurement structures that allow us to measure resistance as a function of temperature of electroplated Bi independently of Au. The results show that the thermal conductivity of the Bi at 3 K is high enough to ensure the correct thermalization of X-ray photons when used as an absorber for TESs.
Black chrome on commercially electroplated tin as a solar selecting coating
The reflectance properties of black chrome electroplated on commercially electroplated tin were measured for various black chrome plating times for both the solar and infrared spectrum. The values of absorptance and emittance were calculated from the measured reflectance values. The results indicate that the optimum combination of the highest absorptance in the solar region and the lowest emittance in the infrared of the black chrome plated on commercially electroplated tin is obtained for a black chrome plating time of between one and two minutes.
In-plant testing of membranes to treat electroplating wastewater
This is the final report submitted for the work performed under the NASA Cooperative Agreement NCC3-301 for the project entitled 'In-Plant Testing of Membranes To Treat Electroplating Waste water'. The main objective of the research project was to determine if the crosslinked polyacrylic acid salt films developed by NASA scientists could be used for heavy metal removal from the wastewater generated by the metals-finishing or electroplating industry. A variety of tasks identified in the original proposal were completed. These included: (1) analysis of our industrial partner Aetna Plating's zinc electroplating process and its wastewater treatment needs for zinc removal; (2) design and construction of a laboratory-scale unit to continuously supply and remove the ion exchange films from the zinc wastewater; (3) performance of a series of runs on such a unit to determine its operating characteristics; and (4) design of a prototype unit for use at the industrial site. In addition, there were a number of tasks that had not been identified in the original proposal but were later judged to be necessary for the successful completion of the project. These were: (1) batch equilibrium and kinetic experiments with analysis of the experimental results to accurately determine the equilibrium and kinetic parameters for the ion exchange films; (2 ) simulation studies for proper design of the prototype unit; and (3) preliminary runs to exchange the films from H form to Calcium form.
Characterization and Testing of Copper-Nickel Electroplated 3D Printed Parts for Space Flight Applications
3D printing enables novel designs which are impossible to replicate with conventional machining. The process involves 3D printing components from a polymer using a standard resin-based printing process, then electroplating the parts with a thin layer of copper-nickel. Initial results have shown these electroplated components have increased structural strength, while being less expensive; less massive; and can be made faster compared to conventional CNC machining. The focus and metric of success was to qualify this process and to answer the question if the 3D printed electroplated parts can be fabricated in a more cost, mass and schedule efficient manor compared to traditional CNC machining. Also, to determine if using this method will cause parts to have contamination issues or if parts can survive space environment testing. This was accomplished by conducting several critical tests such as outgassing, material testing and thermal cycling. In addition, this method is being used to develop a practical structural application for KArLE (Potassium Argon Laser Experiment).
Copper-nickel electroplating of 3D-printed acrylonitrile butadiene styrene for interference and radiation shielding applications
Here, in this study, electromagnetic and radiation shielding structures were fabricated by 3D printing acrylonitrile butadiene styrene (ABS) structures via fused filament fabrication and electroplating with copper (Cu) and nickel (Ni) metals. Prior to electroplating, the printed ABS materials were made conductive by surface electrodeposition of polypyrrole (PPy). ABS adsorbs the pyrrole monomer, which subsequently polymerizes via oxidation forming conductive PPy layer on the printed structures. The successful anchoring of PPy layer can be attributed to its hydrogen bonding and electrostatic interactions with ABS. Thermal analysis, optical, and electron microscopy equipped with energy dispersive X-ray were employed to characterize the printed shielding structures, while the interference and radiation shielding effectiveness were evaluated using a spectrum analyzer and dosimeter, respectively. The interference shielding was found to be effective at 60 ± 5 dB over relatively small frequency range. Shielding was also apparent against gamma and X-ray ionizing rays, but more significantly effective against beta rays. Furthermore, the Cu/Ni coating was able to reduce any heat-induced dimensional changes for the 3D printed ABS substrate without compromising the mechanical integrity.
Electroplating lithium transition metal oxides
Materials synthesis often provides opportunities for innovation. We demonstrate a general low-temperature (260°C) molten salt electrodeposition approach to directly electroplate the important lithium-ion (Li-ion) battery cathode materials LiCoO 2 , LiMn 2 O 4 , and Al-doped LiCoO 2 . The crystallinities and electrochemical capacities of the electroplated oxides are comparable to those of the powders synthesized at much higher temperatures (700° to 1000°C). In conclusion, this new growth method significantly broadens the scope of battery form factors and functionalities, enabling a variety of highly desirable battery properties, including high energy, high power, and unprecedented electrode flexibility.
Brazing of Martensitic Stainless Steel to Copper Using Electroplated Copper and Silver Coatings
Brazing of 3 mm thick sheets of low-carbon martensitic stainless steel and Cu-Cr-Zr-Ti alloy was attempted using electroplated coatings of Cu and Ag. Ni coating of 5 µm thick was provided on the MSS base metal to enhance the wettability. Brazing experiments were carried out at 985 °C for a holding of 15 min. Detailed microstructural studies, hardness, lap-shear, tensile, and pressure tests were carried out on the brazed joints. The reaction between the Cu and Ag coatings lead to the formation of in situ braze metal. The microstructure of the braze metal was found to consist of Cu-rich primary alpha (α{sub P}) and Ag-rich eutectic mixture (β + α{sub E}). In lap-shear tests, the brazed joints produced with an overlap of 9 and 6 mm were found to fail in copper base metal, while the joints produced with an overlap of 3 mm failed in the braze metal exhibiting a lap-shear strength of 147 MPa. In tensile tests, the butt brazed joints were found to fail in copper base metal as well with an average tensile strength of 213 MPa. The braze metal hardness was found to be higher than the hardness of the copper base metal. In pressure tests, the brazed panels were found to survive a pressure of 750 bar without undergoing any damage. These results show that electroplated coatings of Cu and Ag can be advantageously utilized for brazing of large, complex-shaped parts such as thrust chambers in space industry.
In-situ synchrotron X-ray study on microstructure and stress evolutions of electroplated copper upon self-annealing
Background: The self-annealing behavior of electroplated copper (Cu) at room temperature is gaining attention in the microelectronics industry due to its significant impact on reliability issues such as substrate warpage and electrical resistivity. Methods: In this study, in-situ analysis of the microstructure transition and stress relaxation of the electroplated copper upon self-annealing was conducted via synchrotron white X-ray nanodiffraction (beamline 21A, Taiwan Photon Source) and grazing-incidence X-ray diffraction (beamline 17B1, Taiwan Light Source). Significant Findings: Remarkable relaxations of deviatoric stress and absolute strain component along the [002] direction were closely related to the Cu grain growth and crystallographic reorientation at the early stage of selfannealing, and a complete stress/strain relaxation can be achieved with the cessation of microstructure transition. In conclusion, the in-situ synchrotron X-ray studies provided an insight into Cu self-annealing mechanism, offering valuable information for improving Cu interconnect reliability.
Increased fracture depth range in controlled spalling of (100)-oriented germanium via electroplating
Controlled spalling in (100)-oriented germanium using a nickel stressor layer shows promise for semiconductor device exfoliation and kerfless wafering. Demonstrated spall depths of 7-60 um using DC sputtering to deposit the stressor layer are appropriate for the latter application but spall depths < 5 um may be required to minimize waste for device applications. This work investigates the effect of tuning both electroplating current density and electrolyte chemistry on the residual stress in the nickel and on the achievable spall depth range for the Ni/Ge system as a lower-cost, higher-throughput alternative to sputtering. By tuning current density and electrolyte phosphorous concentration, it is shown that electroplating can successfully span the same range of spalled thicknesses as has previously been demonstrated by sputtering and can reach sufficiently high stresses to enter a regime of thickness (<7 um) appropriate to minimize substrate consumption for device applications.
Iodine Capture with Copper-Electroplated Nickel Foams
This work explores the use of Ni0 foam scaffolds for Cu0 coatings for use as sorbents for iodine. The Cu0 electroplating was performed from aqueous copper(II) sulfate (CuSO4) solutions under different conditions to achieve a range of Cu0-layer thicknesses (4.89 ± 1.05 μm–57.32 ± 3.95 μm) with 900 A·m–2 current densities and coating times of 15–180 min. The thickest coatings resulted in Cu0-plated Ni0 foams with >89 mass % Cu0 in the final product. Iodine capture experiments showed very high Cu0 utilizations of 91.9–97.3 mass % at iodine loadings of 839–1774 mg·g–1 through the formation of CuI (marshite; space group F-43m). No evidence was found of iodine reactions taking place with the Ni0 scaffold, so it remained in iodine-loaded Cu-electroplated Ni foams as structural support to provide mechanical rigidity to the foams during the iodine loading process. Hot pressing of these materials can be used to create a CuI/Ni ceramic-metal composite waste form for disposal as demonstrated with spark plasma sintering.
Development of Electroplated Au Capsule Fill Tube Assemblies (CFTA) for the Double Shell ICF Concept on NIF
Current capsules used at the National Ignition Facility (NIF) utilize a single shell design comprised of a single ablator material. Although single shell designs are currently the standard design, they suffer from several physics disadvantages, such as sensitivity to asymmetries and instabilities. The double shell is a proposed design utilizing a high-Z inner metal shell with a low-Z outer shell that is intended to mitigate the issues associated with typical single shell designs. Electroplating is one method that can be utilized to fabricate high-Z metal shells. Au is one particular material that can be electroplated with high density and uniformity. Capsule fill tube assemblies (CFTAs) built from these Au shells have passed all cryogenic leak tests. The shells have a low native surface roughness and are free of voids. Lastly, Au shells have been successfully fabricated, characterized, and built into CFTAs.