Predicting ff-HEDM Measurements of Strain with the Crystal-Plasticity Finite-Element Method
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Far-field high-energy X-ray diffraction microscopy (ff-HEDM) and the crystal plasticity finite element method (CPFEM) are used to investigate the role of grain-scale (Type-II) residual stresses on the fatigue life of additively manufactured (AM) Inconel alloy 625 (IN-625). Grain-averaged orientations, centroids, and residual elastic strain tensors from ff-HEDM data are used to instantiate a crystal plasticity model to simulate the effect of residual stresses at the grain scale. Simulation results indicate that the presence of tensile residual strains increase stress localization and heterogeneity within grains, triggering an earlier onset of plasticity. A microscale fatigue indicator parameter (FIP) is computed to model the impact of these residual strains on the cycles to fatigue crack nucleation. The crack nucleation model, based on the computed FIPs, predicts a significant reduction in the number of cycles for fatigue crack nucleation for mid- and high-cycle fatigue due to the residual strain induced localization, while the residual strains have minimal impact on low-cycle fatigue life.