Field failure rate assessment methodology
Components field failure rates assessment methods for ground support equipment
Bean, E. E.↗
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Development of KSC program for investigating and generating field failure rates. Reliability handbook for ground support equipment
Field failure rates and confidence factors are presented for 88 identifiable components of the ground support equipment at the John F. Kennedy Space Center. For most of these, supplementary information regarding failure mode and cause is tabulated. Complete reliability assessments are included for three systems, eight subsystems, and nine generic piece-part classifications. Procedures for updating or augmenting the reliability results are also included.
Bloomquist, C. E.↗
Field failure mechanisms for photovoltaic modules
Beginning in 1976, Department of Energy field centers have installed and monitored a number of field tests and application experiments using current state-of-the-art photovoltaic modules. On-site observations of module physical and electrical degradation, together with in-depth laboratory analysis of failed modules, permits an overall assessment of the nature and causes of early field failures. Data on failure rates are presented, and key failure mechanisms are analyzed with respect to origin, effect, and prospects for correction. It is concluded that all failure modes identified to date are avoidable or controllable through sound design and production practices.
Dumas, L. N.↗
Development of KSC program for investigating and generating field failure rates. Volume 2: Recommended format for reliability handbook for ground support equipment
Field failure rates and confidence factors are presented for 88 identifiable components of the ground support equipment at the John F. Kennedy Space Center. For most of these, supplementary information regarding failure mode and cause is tabulated. Complete reliability assessments are included for three systems, eight subsystems, and nine generic piece-part classifications. Procedures for updating or augmenting the reliability results presented in this handbook are also included.
Bloomquist, C. E.↗
Development of KSC program for investigating and generating field failure rates. Volume 1: Summary and overview
A summary of the KSC program for investigating the reliability aspects of the ground support activities is presented. An analysis of unsatisfactory condition reports (RC), and the generation of reliability assessment of components based on the URC are discussed along with the design considerations for attaining reliable real time hardware/software configurations.
Bean, E. E.↗
Study of intermittent field hardware failure data in digital electronics
The collection and analysis of data concerning intermittent dailures in digital devices was performed using data from a computer design for shipboard usage. The failure data consisted of actual field failures classified by failure mechanisms and their likelihood of having been intermittent, potentially intermittent, or hard. Each class was studies with respect to computer operation in the ranges of 0 to 2,000 hours, 0 to 5, hours, and 0 to 10,000 hours. The study was done at the computer level as well as the microcircuit level. Results indicate that as age increases, the quasi-intermittent failure rate increases and the mean time to failure descreases.
Oneill, E. J.↗
Analysis of field usage failure rate data for plastic encapsulated solid state devices
Survey and questionnaire techniques were used to gather data from users and manufacturers on the failure rates in the field of plastic encapsulated semiconductors. It was found that such solid state devices are being successfully used by commercial companies which impose certain screening and qualification procedures. The reliability of these semiconductors is now adequate to support their consideration in NASA systems, particularly in low cost systems. The cost of performing necessary screening for NASA applications was assessed.
Source record↗
Study program for design improvements of the X-3060 and X-3075. Phase 1: Study definition
The existing designs of the X-3060 and X-3075 klystrons were critically examined to determine whether or not realistic redesign goals could be established. Additionally, failure analyses and field failure reports were examined to identify any design weaknesses. Results of this critical analysis indicate that substantial improvements can be made to the overall design of both the X-3060 and X-3075 klystrons. Pertinent and detailed data concerning these improvements are reported herein.
Goldfinger, A.↗
Electrostatic Discharge (ESD) Failures in Thin Film Resistors
Field failures of nichrome thin film resistors have been investigated recently for several pieces of space flight hardware. These failures have involved resistance shifts ranging from a few percent to complete open circuits. Failure analysis and duplication of these failures have revealed that the failures were caused by electrostatic discharge. The failure characteristics and the circuit conditions necessary for failure have been studied for several types of thin film resistors including nichrome and tantalum nitride resistive elements. The effects of latent damage and resistive pattern design will also be discussed.
Hull, Scott M.↗
Investigation of Spiral Bevel Gear Condition Indicator Validation via AC-29-2C Combining Test Rig Damage Progression Data with Fielded Rotorcraft Data
This is the final of three reports published on the results of this project. In the first report, results were presented on nineteen tests performed in the NASA Glenn Spiral Bevel Gear Fatigue Test Rig on spiral bevel gear sets designed to simulate helicopter fielded failures. In the second report, fielded helicopter HUMS data from forty helicopters were processed with the same techniques that were applied to spiral bevel rig test data. Twenty of the forty helicopters experienced damage to the spiral bevel gears, while the other twenty helicopters had no known anomalies within the time frame of the datasets. In this report, results from the rig and helicopter data analysis will be compared for differences and similarities in condition indicator (CI) response. Observations and findings using sub-scale rig failure progression tests to validate helicopter gear condition indicators will be presented. In the helicopter, gear health monitoring data was measured when damage occurred and after the gear sets were replaced at two helicopter regimes. For the helicopters or tails, data was taken in the flat pitch ground 101 rotor speed (FPG101) regime. For nine tails, data was also taken at 120 knots true airspeed (120KTA) regime. In the test rig, gear sets were tested until damage initiated and progressed while gear health monitoring data and operational parameters were measured and tooth damage progression documented. For the rig tests, the gear speed was maintained at 3500RPM, a one hour run-in was performed at 4000 in-lb gear torque, than the torque was increased to 8000 in-lbs. The HUMS gear condition indicator data evaluated included Figure of Merit 4 (FM4), Root Mean Square (RMS) or Diagnostic Algorithm 1(DA1), + 3 Sideband Index (SI3) and + 1 Sideband Index (SI1). These were selected based on their sensitivity in detecting contact fatigue damage modes from analytical, experimental and historical helicopter data. For this report, the helicopter dataset was reduced to fourteen tails and the test rig data set was reduced to eight tested gear sets. The damage modes compared were separated into three cases. For case one, both the gear and pinion showed signs of contact fatigue or scuffing damage. For case two, only the pinion showed signs of contact fatigue damage or scuffing. Case three was limited to the gear tests when scuffing occurred immediately after the gear run-in. Results of this investigation highlighted the importance of understanding the complete monitored systems, for both the helicopter and test rig, before interpreting health monitoring data. Further work is required to better define these two systems that include better state awareness of the fielded systems, new sensing technologies, new experimental methods or models that quantify the effect of system design on CI response and new methods for setting thresholds that take into consideration the variance of each system.
spiral bevel gears↗
Environmental testing of terrestrial flat plate photovoltaic modules
The Low-Cost Solar Array (LSA) Project at the Jet Propulsion Laboratory has as one objective: the development and implementation of environmental tests for flat plate photovoltaic modules as part of the Department of Energy's terrestrial photovoltaic program. Modules procured under this program have been subjected to a variety of laboratory tests intended to simulate service environments, and the results of these tests have been compared to available data from actual field service. This comparison indicates that certain tests (notably temperature cycling, humidity cycling, and cyclic pressure loading) are effective indicators of some forms of field failures. Other tests have yielded results useful in formulating module design guidelines. Not all effects noted in field service have been successfully reproduced in the laboratory, however, and work is continuing in order to improve the value of the test program as a tool for evaluating module design and workmanship. This paper contains a review of these ongoing efforts and an assessment of significant test results to date.
Hoffman, A.↗
Achieving Improved Reliability with Failure Analysis
Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.
non-destructive techniques↗
Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures
This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.
Printed circuit boards↗
Achieving Improved Reliability with Failure Analysis
Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)
PCB quality↗
JPL/NASA/IEEE Test Effectiveness Workshop
(none given)From OBJECTIVES: Specific objectives of the working group are to support the innovation, development, evaluation and implementation of test methods, metrics and tools based on failure engineering/physics and/or root cause evaluations. Data sources systems and tools shall be developed and implemented that: 1) provide improved preventions, controls, analyses and tests (PACT) & field failure data collection, 2) facilities data analysis, archiving, retrieval, failure physics and/or root cause evaluations and 3) enable new and existing technology suitability evaluations to be performed.
effectiveness concurrent engineering metrics test ↗
Structural fatigue test results for large wind turbine blade sections
In order to provide quantitative information on the operating life capabilities of wind turbine rotor blade concepts for root-end load transfer, a series of cantilever beam fatigue tests was conducted. Fatigue tests were conducted on a laminated wood blade with bonded steel studs, a low cost steel spar (utility pole) with a welded flange, a utility pole with additional root-end thickness provided by a swaged collar, fiberglass spars with both bonded and nonbonded fittings, and, finally, an aluminum blade with a bolted steel fitting (Lockheed Mod-0 blade). Photographs, data, and conclusions for each of these tests are presented. In addition, the aluminum blade test results are compared to field failure information; these results provide evidence that the cantilever beam type of fatigue test is a satisfactory method for obtaining qualitative data on blade life expectancy and for identifying structurally underdesigned areas (hot spots).
Faddoul, J. R.↗
Software dependability in the Tandem GUARDIAN system
Based on extensive field failure data for Tandem's GUARDIAN operating system this paper discusses evaluation of the dependability of operational software. Software faults considered are major defects that result in processor failures and invoke backup processes to take over. The paper categorizes the underlying causes of software failures and evaluates the effectiveness of the process pair technique in tolerating software faults. A model to describe the impact of software faults on the reliability of an overall system is proposed. The model is used to evaluate the significance of key factors that determine software dependability and to identify areas for improvement. An analysis of the data shows that about 77% of processor failures that are initially considered due to software are confirmed as software problems. The analysis shows that the use of process pairs to provide checkpointing and restart (originally intended for tolerating hardware faults) allows the system to tolerate about 75% of reported software faults that result in processor failures. The loose coupling between processors, which results in the backup execution (the processor state and the sequence of events) being different from the original execution, is a major reason for the measured software fault tolerance. Over two-thirds (72%) of measured software failures are recurrences of previously reported faults. Modeling, based on the data, shows that, in addition to reducing the number of software faults, software dependability can be enhanced by reducing the recurrence rate.
Lee, Inhwan↗
On-Demand Cell Internal Short Circuit Device
A device implantable in Li-ion cells that can generate a hard internal short circuit on-demand by exposing the cell to 60C has been demonstrated to be valuable for expanding our understanding of cell responses. The device provides a negligible impact to cell performance and enables the instigation of the 4 general categories of cell internal shorts to determine relative severity and cell design susceptibility. Tests with a 18650 cell design indicates that the anode active material short to the aluminum cathode current collector tends to be more catastrophic than the 3 other types of internal shorts. Advanced safety features (such as shutdown separators) to prevent or mitigate the severity of cell internal shorts can be verified with this device. The hard short success rate achieved to date in 18650 cells is about 80%, which is sufficient for using these cells in battery assemblies for field-failure-relevant, cell-cell thermal runaway propagation verification tests
Darcy, Eric↗