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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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15 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Puffer: Pop-Up Flat Folding Explorer Robot

A repeatably reconfigurable robot, comprising at least two printed circuit board (PCB) rigid sections, at least one PCB flexible section coupled to the at least two PCB rigid sections, at least one wheel, hybrid wheel propeller, wheel and propeller, or hybrid wheel screw propeller rotatably coupled to at least one of the at least two PCB rigid sections and at least one actuator coupled to the at least two PCB rigid sections, wherein the at least one actuator folds and unfolds the repeatably reconfigurable robot.

Karras, Jaakko T.↗
NASA NTRS2023

Flex-Capsules for the Roman Space Telescope High Gain Antenna Gimbal

The Cable Wrap mechanism has been traditionally used for feeding power and telemetry through each gimbal actuator exiting at the gimbal output flange. Such a mechanism had often utilized round wire bundles or a multitude of single insulated conductors woven together flatwise to handle the angular rotation. Though flexible printed circuit board (PCB) is not a new technology, it was decided to implement it for the Roman Space Telescope (RST) High Gain Antenna Gimbal in an effort to improve reliability with consistency of manufacture and to save mass and minimize required volume. This paper provides a description of what we term Flex-Capsule (a similar vendor flight development is termed Twist Capsule), discusses the reasoning behind choosing a new engineering development over maintaining heritage, and includes commentary pertaining to life cycle analysis, electrical performance, and flexible PCB lubrication. Lessons learned from the design, analysis, and test campaign are also included. The conclusion is that benefits of pursuing the Flex-Capsule over heritage Cable Wrap have been realized.

twist capsule↗
NASA NTRS2023

Flex-Capsule for the Roman Space Telescope High Gain Antenna Gimbal

The Cable Wrap mechanism has been traditionally used for feeding power and telemetry through each gimbal actuator exiting at the Gimbal output flange. Such a mechanism had often utilized round wire bundles, or a multitude of single insulated conductors woven together flatwise to handle the angular rotation. Though flexible printed circuit board (PCB) is not a new technology, it was decided to implement it for the Roman Space Telescope (RST) High Gain Antenna Gimbal in an effort to improve reliability with consistency of manufacture and to save mass and minimize required volume. This paper provides a description of what we term Flex-Capsule (a similar vendor flight development is termed Twist Capsule), discusses the reasoning behind choosing a new engineering development over maintaining heritage, and includes commentary pertaining to life cycle analysis, electrical performance, and flexible PCB lubrication. Lessons learned from the design, analysis, and test campaign are also included. The conclusion is that benefits of pursuing the Flex-Capsule over heritage Cable Wrap have been realized.

twist capsule↗
NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗
NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗
NASA NTRS2022

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origamiinspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigidflex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL’s Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

de la Croix, Jean-Pierre↗
NASA NTRS2022

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origami-inspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigid-flex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL's Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

John Bell↗
NASA NTRS2021

Modular Composite Damage Detection System (MCDDS)

The 2020 CIF funded Modular Composite Damage Detection System (MCDDS) aims to advance the technology of damage detection in composites in the areas of thin, flexible damage detection panel construction, encapsulation techniques in composite matrixes, innovative integration and interfacing techniques with flexible embedded sensory panels, repair methods of composite materials, and improved packaging of the MCDDS. Custom thin, flexible polyimide printed circuit boards (PCBs) were designed and procured for fabrication of test specimens. A custom interface PCB was designed and fabricated to monitor the newly developed damage detection test specimens. Test specimens were fabricated using the novel flexible circuitry that were either fully or partially encapsulated. The fully encapsulated specimens were used to demonstrate embedded damage detection concepts and the partially encapsulated specimens were used to demonstrate surface-mounted (laminate) damage detection concepts. The new composite damage detection test specimens were tested and evaluated to determine if the novel damage detection sensory panels could withstand low-cycle threshold fatigue loading per a modified version of American Society for Testing and Materials (ASTM) D 7264 for up to 50 cycles without void formation. The data for multiple sensory panels indicates that the newly fabricated sensory panels are robust and do indeed withstand three-point bend flexural loading for more than 50 cycles. Additionally, testing was performed to determine if damage could be detected in damage detection test specimens subjected to failure using a 3-point bend test per a modified version of ASTM D 7264. Again, multiple sensory panels (both fully and partially encapsulated) showed the ability to detect damage to specimens subjected to failure per a modified version of ASTM D 7264. Additionally, a novel concept for tracking and monitoring of cracking (and potentially delamination) in composites was designed and developed that utilizes painted-on conductors.

Christopher Forney↗
NASA NTRSDate not supplied

Additively Manufactured Ink-based Cell Batteries for Flexible Conformational Applications

With the rise of additively manufactured electronics, the importance of thin, flexible printed batteries has increased for shape-conformal electronics. Traditionally, battery cells such as industry-standard lithium-ion batteries, have been rigid and therefore unable to conform to time-variant surfaces such as smart cards/RFID devices, disposable battery-powered skin patches, foldable electronic devices, and IoT nodes. Aligned with the effort to advance technologies on printed electronics for habitat systems and advanced manufacturing, this proof-of-concept will focus on printing a 50 mAh Zn-Ag battery implementing a DIW Technique. After prototype manufacturing, electrical and environmental testing on the flexible battery cell will be conducted to the evaluate energy and power density over 50 charge cycles under standard atmosphere conditions. The project aims to provide PCB designers, fabricators, and assemblers an integrated battery package to eliminate external batteries, external wiring and connectors, and conformational complexity. Potential end uses of the printed battery process will be within Martian and lunar habitat systems, Gateway, and surface vehicles, or aerial robots where space and geometry is a restriction.

Printed Electronics↗
NASA NTRS2013

NASA Tech Briefs, October 2013

Topics include: A Short-Range Distance Sensor with Exceptional Linearity; Miniature Trace Gas Detector Based on Microfabricated Optical Resonators; Commercial Non-Dispersive Infrared Spectroscopy Sensors for Sub-Ambient Carbon Dioxide Detection; Fast, Large-Area, Wide-Bandgap UV Photodetector for Cherenkov Light Detection; Mission Data System Java Edition Version 7; Adaptive Distributed Environment for Procedure Training (ADEPT); LEGEND, a LEO-to-GEO Environment Debris Model; Electronics/Computers; Millimeter-Wave Localizers for Aircraft-to-Aircraft Approach Navigation; Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces; SpaceCube Version 1.5; High-Pressure Lightweight Thrusters; Non-Magnetic, Tough, Corrosion- and Wear-Resistant Knives From Bulk Metallic Glasses and Composites; Ambient Dried Aerogels; Applications for Gradient Metal Alloys Fabricated Using Additive Manufacturing; Passivation of Flexible YBCO Superconducting Current Lead With Amorphous SiO2 Layer; Propellant-Flow-Actuated Rocket Engine Igniter; Lightweight Liquid Helium Dewar for High-Altitude Balloon Payloads; Method to Increase Performance of Foil Bearings Through Passive Thermal Management; Unibody Composite Pressurized Structure; JWST Integrated Science Instrument Module Alignment Optimization Tool; Radar Range Sidelobe Reduction Using Adaptive Pulse Compression Technique; Digitally Calibrated TR Modules Enabling Real-Time Beamforming SweepSAR Architectures; Electro-Optic Time-to-Space Converter for Optical Detector Jitter Mitigation; Partially Transparent Petaled Mask/Occulter for Visible-Range Spectrum; Educational NASA Computational and Scientific Studies (enCOMPASS); Coarse-Grain Bandwidth Estimation Scheme for Large-Scale Network; Detection of Moving Targets Using Soliton Resonance Effect; High-Efficiency Nested Hall Thrusters for Robotic Solar System Exploration; High-Voltage Clock Driver for Photon-Counting CCD Characterization; Development of the Code RITRACKS; and Enabling Microliquid Chromatography by Microbead Packing of Microchannels.

Source record↗
NASA NTRS2016

Command and Data Handling Branch Internship

Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments (TI)' MSP430 16-bit ultra-low-power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display (LCD) touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320 by 240 RGB resistive color screen including an optional carrier board. The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA (Field Programmable Gate Array) development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At the moment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process. Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments’ MSP430 16 bit ultra-low power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320x240 RGB resistive color screen including an optional carrier board.The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At themoment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process.Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate school for a master's or doctorate degree in electrical or computer engineering.

Billings, Rachel Mae↗
NASA NTRS1995

MEMS Technology for Space Applications

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

vandenBerg, A.↗
NASA NTRS2023

Development of Two High-Energy Bus ‘Cores’ for Rapid Support of Low-TRL and Educational Payloads: A Software-Configured EPS Combined with Flexible C&DH

For several years the TechEdSat flight series (TES-n), developed by the Nano Orbital Workshop (NOW) group at NASA Ames, has relied upon an in-house developed unit to serve both EPS (Electrical Power System) and C&DH (Command and Data Handling) roles along with low data-rate telemetry functions, i.e., serving as the ‘core’ of the spacecraft bus. This ‘core’ has a considerable task given the rapid cadence of the TES program and the typically low-TRL of payloads; configurability and compatibility are key to prevent mission-specific hardware. However, at only 15 watts the current core has become insufficient to support the program’s growing missions and increasingly demanding payloads. To this end, the NOW program is developing new cores to support two TES mission classes: a single-PCB ‘MiniCore’ designed to support 80-watt missions 6U or smaller in LEO, and a three-PCB, radiation-tolerant ‘StackCore’ designed to support 6U and larger missions over 500 watts in LEO and beyond. The ‘MiniCore’ design consists of three main segments: a processor-agnostic C&DH, a software-configured EPS, and a backup low data-rate radio. The design philosophy was to enable rapid-manufacture in a turbulent supply chain, hence the design consists of COTS parts with a focus on those able to be drop-in replaced with radiation-tolerant versions when demanded by the mission. As a single PC-104 sized circuit board, power density and ease of integration also dominated design, demanding the use of modern features such as single-point USB-C for easy charging and monitoring of the spacecraft on the ground. The ‘MiniCore’ can support 80 watts of load, 140 watt-hours of storage, and over 20 watts of optimized solar generation with extensive power monitoring throughout. The ‘MiniCore’ supports one battery pack, six solar-panels, six loads, five actuators, Iridium SBD, and an internal 802.15.4 network. Additionally, the processor-agnostic design can accept any PJRC Teensy 3.x or Adafruit Feather microcontroller unit to enable processor scaling with mission requirements or environment. It is expected a development unit of this design will be completed before conference. The ‘StackCore’ design consists of three stacked PC-104 sized circuit boards: one dedicated to power generation and storage, one dedicated to power distribution, and one dedicated to C&DH tasks. This delineation is necessary to support the transition from highly integrated ICs to discrete analog circuitry, enabling a primarily analog control power system able to operate without software in a radiation environment with finer monitoring compared to the ‘MiniCore’ design. The planned base architecture supports over 500 watts of load, 250 watt-hours of storage, and over 80 watts of optimized solar generation. The power distribution board allows for the use of daughter cards hosting custom converters or interfaces for payloads, in addition to the software-configured supplies used on the ‘MiniCore’. This core stack will be managed by a Vorago ARM M4 microcontroller and support the same wireless communications as the ‘MiniCore’, with optional integration of a NOW S-band radio and attitude determination sensors for ‘black box’ functionality. It is expected the prototype will still be in development during conference.

Spacecraft↗
NASA NTRSDate not supplied

Development of Two High-Energy Bus ‘Cores’ for Rapid Support of Low-TRL and Educational Payloads: A Software-Configured EPS Combined with Flexible C&DH

For several years the TechEdSat flight series (TES-n), developed by the Nano Orbital Workshop (NOW) group at NASA Ames, has relied upon an in-house developed unit to serve both EPS (Electrical Power System) and C&DH (Command and Data Handling) roles along with low data-rate telemetry functions, i.e., serving as the ‘core’ of the spacecraft bus. This ‘core’ has a considerable task given the rapid cadence of the TES program and the typically low-TRL of payloads; configurability and compatibility are key to prevent mission-specific hardware. However, at only 15 watts the current core has become insufficient to support the program’s growing missions and increasingly demanding payloads. To this end, the NOW program is developing new cores to support two TES mission classes: a single-PCB ‘MiniCore’ designed to support 80-watt missions 6U or smaller in LEO, and a three-PCB, radiation-tolerant ‘StackCore’ designed to support 6U and larger missions over 500 watts in LEO and beyond. The ‘MiniCore’ design consists of three main segments: a processor-agnostic C&DH, a software-configured EPS, and a backup low data-rate radio. The design philosophy was to enable rapid-manufacture in a turbulent supply chain, hence the design consists of COTS parts with a focus on those able to be drop-in replaced with radiation-tolerant versions when demanded by the mission. As a single PC-104 sized circuit board, power density and ease of integration also dominated design, demanding the use of modern features such as single-point USB-C for easy charging and monitoring of the spacecraft on the ground. The ‘MiniCore’ can support 80 watts of load, 140 watt-hours of storage, and over 20 watts of optimized solar generation with extensive power monitoring throughout. The ‘MiniCore’ supports one battery pack, six solar-panels, six loads, five actuators, Iridium SBD, and an internal 802.15.4 network. Additionally, the processor-agnostic design can accept any PJRC Teensy 3.x or Adafruit Feather microcontroller unit to enable processor scaling with mission requirements or environment. It is expected a development unit of this design will be completed before conference. The ‘StackCore’ design consists of three stacked PC-104 sized circuit boards: one dedicated to power generation and storage, one dedicated to power distribution, and one dedicated to C&DH tasks. This delineation is necessary to support the transition from highly integrated ICs to discrete analog circuitry, enabling a primarily analog control power system able to operate without software in a radiation environment with finer monitoring compared to the ‘MiniCore’ design. The planned base architecture supports over 500 watts of load, 250 watt-hours of storage, and over 80 watts of optimized solar generation. The power distribution board allows for the use of daughter cards hosting custom converters or interfaces for payloads, in addition to the software-configured supplies used on the ‘MiniCore’. This core stack will be managed by a Vorago ARM M4 microcontroller and support the same wireless communications as the ‘MiniCore’, with optional integration of a NOW S-band radio and attitude determination sensors for ‘black box’ functionality. It is expected the prototype will still be in development during conference.

Spacecraft↗