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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Flexible Electronics: Flexible Electrochemical Bioelectronics: The Rise of In Situ Bioanalysis (Adv. Mater. 15/2020)

Flexible electrochemical bioelectronics enables in situ quantification of a variety of chemical constituents present in the human body. It holds great promise for personalized health monitoring owing to its inherent wearability, high performance, and low cost. In article number 1902083, Wei Gao, Ali Javey, and co-authors summarize recent key innovations in flexible electrochemical bioelectronics from electrochemical sensing modalities, materials, systems, fabrication, to applications and discuss the challenges and opportunities in this field moving forward toward future preventive and personalized medicine devices.

36 MATERIALS SCIENCE↗
NASA NTRS2014

Flexible Electronics Development Supported by NASA

The commercial electronics industry is leading development in most areas of electronics for NASA applications; however, working in partnership with industry and the academic community, results from NASA research could lead to better understanding and utilization of electronic materials by the flexible electronics industry. Innovative ideas explored by our partners in industry and the broader U.S. research community help NASA execute our missions and bring new American products and services to the global technology marketplace. [Mike Gazarik, associate administrator for Space Technology, NASA Headquarters, Washington DC] This presentation provides information on NASA needs in electronics looking towards the future, some of the work being supported by NASA in flexible electronics, and the capabilities of the Glenn Research Center supporting the development of flexible electronics.

antenna↗
DOE OSTI2022

Advancing flexible electronics and additive manufacturing

There is high interest in the synergism of thin-film and flexible electronics with additive manufacturing. This review primarily focuses on the prospective developments in convergence with flexible electronics manufacturing technologies. Specifically, this paper covers the latest 3D printing and hybrid manufacturing technologies, the utility of specific types of materials, their functionalization and characterization, post-processing and testing strategies toward fabricating robust and application-specific flexible electronics. Besides exploring the advances in this area of research—it also highlights the limitations and gaps that have been observed in the previous years that will challenge and offer opportunities for advancing research and development. Lastly, the future of 3D-printed flexible electronics is discussed in the aspects of customizability, scalability, and its game-changing and state-of-the-art potential for intelligent sensing, instrumentation, and wearables for various medical, engineering, and industrial applications.

36 MATERIALS SCIENCE↗
NASA NTRS2003

Zipper Connectors for Flexible Electronic Circuits

Devices that look and function much like conventional zippers on clothing have been proposed as connectors for flexible electronic circuits. Heretofore, flexible electronic circuits have commonly included rigid connectors like those of conventional rigid electronic circuits. The proposed zipper connectors would make it possible to connect and disconnect flexible circuits quickly and easily. Moreover, the flexibility of zipper connectors would make them more (relative to rigid connectors) compatible with flexible circuits, so that the advantages of flexible circuitry could be realized more fully. Like a conventional zipper, a zipper according to the proposal would include teeth anchored on flexible tapes, a slider with a loosely attached clasp, a box at one end of the rows of mating teeth, and stops at the opposite ends. The tapes would be made of a plastic or other dielectric material. On each of the two mating sides of the zipper, metal teeth would alternate with dielectric (plastic) teeth, there being two metal teeth for each plastic one. When the zipper was closed, each metal tooth from one side would be in mechanical and electrical contact with a designated metal tooth from the other side, and these mating metal teeth would be electrically insulated from the next pair of mating metal teeth by an intervening plastic tooth. The metal teeth would be soldered or crimped to copper tabs. Wires or other conductors connected to electronic circuits would be soldered or crimped to the ends of the tabs opposite the teeth.

Barnes, Kevin N.↗
DOE OSTI2025

Cracking in polymer substrates for flexible electronic devices and its mitigation

Mechanical reliability plays a critical role in determining the durability of flexible electronic devices because of the significant mechanical stresses they experience during manufacturing and operation. Many such devices are built on sheets comprising stiff transparent-conducting oxide (TCO) electrode films on compliant polymer substrates, and it is generally assumed that the high-toughness polymer substrates do not crack. Contrary to this assumption, here we show extensive cracking in the polymer substrates during bending of a variety of TCO/polymer sheets, and a device example — flexible perovskite solar cells. Such substrate cracking, which compromises the overall mechanical integrity of the entire device, is driven by the amplified stress-intensity factor caused by the elastic mismatch at the film/substrate interface. To mitigate this substrate cracking, an interlayer-engineering approach is designed and experimentally demonstrated. This approach is potentially applicable to myriad flexible electronic devices, with stiff films on compliant substrates, for improving their durability and reliability.

42 ENGINEERING↗
NASA NTRS2008

Ultra-Thin, Flexible Electronics

Thinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of these techniques is the thinning of die to a thickness of 50 microns or thinner. Conventional CMP processing can be used to thin to 50 microns. At 50 microns, the active die become flexible and must be handled by temporarily bonding them to a holder die, for further processing. Once bonded face down to the holder die, the active die can be further thinned by DRIE etching the exposed backside. The thinned die can then been packaged in or on the flexible substrate.

electronics packaging↗
DOE OSTI2020

High-Resolution Laser-Induced Graphene. Flexible Electronics beyond the Visible Limit

Laser-induced graphene (LIG) is a multifunctional graphene foam that is commonly direct-written with an infrared laser into a carbon-based precursor material. Here, a visible 405 nm laser is used to directly convert polyimide into LIG. This enabled the formation of LIG with a spatial resolution of ~12 μm and a thickness of <5 μm. The spatial resolution enabled by the relatively smaller focused spot size of the 405 nm laser represents a >60% reduction in LIG feature sizes reported in prior publications. This process occurs in situ in an SEM chamber, thus allowing direct observation of LIG formation. The reduced size of the LIG features enables the direct-write formation of flexible electronics that are not visible to the unaided eye. A humidity sensor is demonstrated which could detect human breath with a response time of 250 ms. With the growing interest in LIG for flexible electronics and sensors, finer features can greatly expand its utility.

36 MATERIALS SCIENCE↗
NASA NTRS2014

Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

Why printed electronics? Why should NASA use printed electronics to make a spacecraft? Three words provide the answer: universal, impactful, progressive. The technology is universal because the applications it can affect are broad and diverse from simple sensors to fully functional spacecraft. The impact of flexible, printed electronics range from straightforward mass, volume and cost savings all the way to enabling new mission concepts. The benefits of the technology will become progressively larger from what is achievable today so that investments will pay dividends tomorrow, next year and next decade. We started off three years ago asking the question can you build an entire spacecraft out of printed electronics? In other words, can you design and fabricate a fully integrated, electronic system that performs the same end-to-end functions of a spacecraft - take scientific measurements, perform data processing, provide data storage, transmit the data, powers itself, orients and propels itself - all out of thin flexible sheets of printed electronics? This "Printable Spacecraft" pushes the limits of printed flexible electronics performance. So the answer is yes, more or less. In our studies for the NIAC (NASA Innovative Advanced Concepts) program, we have explored this question further, to explain more completely what "more or less" means and to outline what is needed to make the answer a definitive "yes". Despite its appealing "Flat Stanley"-like (a book series by Jeff Brown) qualities, making a Printable Spacecraft is not as easy as flattening the Cassini spacecraft with a bulletin board, as was Stanley Lamchop's fate. But, if NASA invests in the design challenges, the materials challenges, the performance challenges of printed electronics, it might find itself with a spacecraft that can enable as many adventures and advantages as Flat Stanley including putting it in an envelope and mailing it to the planet of your choice. You just have to let your imagination take over. In this report we document the work of the Phase 2 Printable Spacecraft task conducted under the guidance and leadership of the NIAC program. In Phase One of the NIAC task entitled "Printable Spacecraft", we investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. In Phase 2 we tried to answer the more practical questions such as can you really build a multi-functional printed electronic spacecraft system? If you do, can it survive the space environment? Even if it can, what benefit does a printable system provide over a traditional implementation of a spacecraft?

Materials↗
DOE OSTI2025

Conductive Liquid Metal Vitrimer Composites for Reconfigurable and Recyclable Flexible Electronics

Liquid metal (LM) elastomer composites exhibit excellent functionality for stretchable electronics and wearables, but limited recycling and reuse pathways constrain their sustainable use. Here, to address these challenges amid growing concerns over electronic waste, a conductive LM–vitrimer composite is presented that enables recyclable and reconfigurable electronics. This soft and stretchable composite features uniformly distributed LM inclusions that enhance thermal conductivity by 6.53× and enable the formation of conductive traces with electrical self-healing, while the vitrimer provides structural restoration. The dynamic covalent bonds of the vitrimer matrix are leveraged for both reprocessing the composite and chemically recovering 94% of the LM. This liquid-state filler slightly reduces the vitrimer's stiffness to 2.63 MPa (≈20% lower), while maintaining its high stretchability (>135% strain) and thermal stability. It is further examined how ultrasonicated LM inclusions interact with the vitrimer matrix and demonstrate the composite's self-healing and recyclability through two distinct approaches: 1) thermomechanical reprocessing, which restores fragmented composites under heat and compression for circuit reconfiguration; and 2) chemical recycling, which recovers the embedded LM for reuse in fabricating new composites and redesigned circuitry. With the integration of recyclability and diverse functional capabilities, LM–vitrimer composites emerge as a promising material platform for sustainable, flexible electronics.

Han, Youngshang [Univ. of Washington, Seattle, WA ↗
DOE OSTI2024

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Additive manufacturing of functional devices on various rigid and flexible substrates is rising rapidly due to their design flexibility, rapid manufacturing, and lower cost. Current printing technologies are ink-based and focused on printing silver (Ag) as conductive lines due to its matured ink formulation process, low sintering temperature, ease of printing, and low oxidation rate. However, Ag is the 68th most abundant element on Earth, while copper (Cu) is the 25th, making it much cheaper (>100×) while having a comparable conductivity to Ag. Therefore, printing Cu has become technologically and economically more attractive than Ag. Nevertheless, Cu printing is still a significant challenge in ink-based printing methods due to the higher sintering temperature relative to the glass-transition temperature of most flexible substrates, the higher oxidation rate, the challenging ink formulation process, and ink stability concerns. Here, we demonstrate printing highly conductive Cu on flexible polyimide substrates using a dry printing technique. Cu nanoparticles (~3–30 nm) are generated by on-demand laser ablation of a solid Cu target inside the printer head and under argon background gas. These Cu nanoparticles are then transported through a nozzle and onto the substrate, where they are laser-sintered in real time. The argon gas plays three critical roles in laser plume condensation for nanoparticle generation, transport, and sheath gas to avoid oxidation during sintering. The sintered nanoparticles thus show high electrical conductivity and mechanical stability under static and cyclic tests. Our dry printing technique can potentially revolutionize how electronic devices and sensors are additively manufactured for earth and space applications.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2020

Nanometer-Thick Sr 2 IrO 4 Freestanding Films for Flexible Electronics

In this article, we report the structural and optical properties of nanoscale Sr 2 IrO 4 freestanding thin-films fabricated using a water-soluble Sr 3 Al 2 O 6 layer. The coherent lattice structure, phonon modes, two-magnon Raman scattering, and optical absorption spectra of the Sr 2 IrO 4 nanomembrane are analogous to those of the layered iridate epitaxial thin-films and single crystals. Remarkably, the formation of 3-unit-cell-thick SrIrO 3 and interfacial composite layers alleviates the antiphase boundaries at the Sr 2 IrO 4 /Sr 3 Al 2 O 6 interface, resulting in structurally-robust nanomembranes. Our experimental results show that this freestanding thin-film approach of layered oxides can provide techniques for tuning or realizing unprecedented states beyond conventional thin-film methods, suggesting a pathway in achieving flexible layered-oxide electronics.

36 MATERIALS SCIENCE↗
NASA NTRS2012

Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

Atmospheric confetti. Inchworm crawlers. Blankets of ground penetrating radar. These are some of the unique mission concepts which could be enabled by a printable spacecraft. Printed electronics technology offers enormous potential to transform the way NASA builds spacecraft. A printed spacecraft's low mass, volume and cost offer dramatic potential impacts to many missions. Network missions could increase from a few discrete measurements to tens of thousands of platforms improving areal density and system reliability. Printed platforms could be added to any prime mission as a low-cost, minimum resource secondary payload to augment the science return. For a small fraction of the mass and cost of a traditional lander, a Europa flagship mission might carry experimental printed surface platforms. An Enceladus Explorer could carry feather-light printed platforms to release into volcanic plumes to measure composition and impact energies. The ability to print circuits directly onto a variety of surfaces, opens the possibility of multi-functional structures and membranes such as "smart" solar sails and balloons. The inherent flexibility of a printed platform allows for in-situ re-configurability for aerodynamic control or mobility. Engineering telemetry of wheel/soil interactions are possible with a conformal printed sensor tape fit around a rover wheel. Environmental time history within a sample return canister could be recorded with a printed sensor array that fits flush to the interior of the canister. Phase One of the NIAC task entitled "Printable Spacecraft" investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. This final report captures the results and conclusions of the Phase One study. First, the report presents the approach taken in conducting the study and a mapping of results against the proposed Phase One objectives. Then an overview of the general field of printed electronics is provided, including manufacturing approaches, commercial drivers, and the current state of integrated systems. The bulk of the report contains the results and findings of Phase One organized into four sections: a survey of components required for a printable spacecraft, technology roadmaps considerations, science mission and engineering applications, and potential risks and challenges of the technology.

Spacecraft↗
NASA NTRS2001

Heterogeneous Integration, An Approach to High Density and High Flexibility Electronic Packaging

Key to the design of spacecraft for exploration of the outer planets will be the development of highly integrated and mass/volume efficient electronic systems. Exploration of the outer planets will require optimized propulsion approaches which mandates mass minimization. If one looks at a mission such as the Europa Lander, a high mass/volume efficiency feeds back directly into lower mass for radiation shielding. Concurrently the long mission lengths will drive the need for fault isolation and fault tolerance. The ability to build distributed electronic systems is an inherent requirement and one which is enabled by heterogeneous integration. The electronic packaging approach must be capable of interconnecting various components at a scale comparable with that on the components themselves (chip scale) and it must facilitate efficient integration of the electronics with elements of the spacecraft such as structure or antennae. The concept of 'Heterogeneous Integration' is being explored in the System On A Chip (SOAC) Project at JPL. The goal, of this approach to electronic packaging, is to enable the fabrication and assembly of complete electronic subsystems from components fabricated by a range of processes. Included in such a system could be MEMS sensors, SOI mixed signal ASICs, micro scale passive components and micro power. Secondarily the compact size will enable distributed architectures and integrated assemblies. Additional information is contained in the original extended abstract.

DAgostino, S. A.↗
NASA NTRS2016

Atmospheric Pressure Plasma Jet as a Dry Alternative to Inkjet Printing in Flexible Electronics

We have developed an atmospheric pressure plasma jet printing system that works at room temperature to 50 deg C unlike conventional aerosol assisted techniques which require a high temperature sintering step to obtain desired thin films. Multiple jets can be configured to increase throughput or to deposit multiple materials, and the jet(s) can be moved across large areas using a x-y stage. The plasma jet has been used to deposit carbon nanotubes, graphene, silver nanowires, copper nanoparticles and other materials on substrates such as paper, cotton, plastic and thin metal foils.

Printable electronics↗