Search NASA⌕ Search

SEARCH · Search NASA

Results for “HEAT SINK”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1988

Heat pipe cooling system with sensible heat sink

A heat pipe cooling system which employs a sensible heat sink is discussed. With this type of system, incident aerodynamic heat is transported via a heat pipe from the stagnation region to the heat sink and absorbed by raising the temperature of the heat sink material. The use of a sensible heat sink can be advantageous for situations where the total mission heat load is limited, as it is during re-entry, and a suitable radiation sink is not available.

Silverstein, Calvin C.↗
NASA NTRS1965

Electronic modules easily separated from heat sink

Metal heat sink and electronic modules bonded to a thermal bridge can be easily cleaved for removal of the modules for replacement or repair. A thin film of grease between a fluorocarbon polymer film on the metal heat sink and an adhesive film on the modules acts as the cleavage plane.

Source record↗
NASA NTRS1964

Mounting for diodes provides efficient heat sink

Efficient heat sink is provided by soldering diodes to metal support bars which are brazed to a ceramic base. Electrical connections between diodes on adjacent bars are made flexible by metal strips which aid in heat dissipation.

Source record↗
NASA NTRS2011

Passive Vaporizing Heat Sink

A passive vaporizing heat sink has been developed as a relatively lightweight, compact alternative to related prior heat sinks based, variously, on evaporation of sprayed liquids or on sublimation of solids. This heat sink is designed for short-term dissipation of a large amount of heat and was originally intended for use in regulating the temperature of spacecraft equipment during launch or re-entry. It could also be useful in a terrestrial setting in which there is a requirement for a lightweight, compact means of short-term cooling. This heat sink includes a hermetic package closed with a pressure-relief valve and containing an expendable and rechargeable coolant liquid (e.g., water) and a conductive carbon-fiber wick. The vapor of the liquid escapes when the temperature exceeds the boiling point corresponding to the vapor pressure determined by the setting of the pressure-relief valve. The great advantage of this heat sink over a melting-paraffin or similar phase-change heat sink of equal capacity is that by virtue of the =10x greater latent heat of vaporization, a coolant-liquid volume equal to =1/10 of the paraffin volume can suffice.

Knowles, TImothy R.↗
NASA NTRS1989

Honeycomb-Fin Heat Sink

Improved finned heat sink for electronic components more lightweight, inexpensive, and efficient. Designed for use with forced air, easily scaled up to dissipate power up to few hundred watts. Fins are internal walls of aluminum honeycomb structure. Cell structure gives strength to thin aluminum foil. Length of channels chosen for thermodynamic efficency; columns of cells combined in any reasonable number because flowing air distributed to all. Heat sink cools nearly as effectively at ends as near its center, no matter how many columns of cells combined.

Rippel, Wally E.↗
NASA NTRS1995

Multilead, Vaporization-Cooled Soldering Heat Sink

Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

Rice, John↗
NASA NTRS1992

Direct-Interface, Fusible Heat Sink

Nonventing, regenerable, and self-contained heat sink absorbs heat in melting of ice by direct contact with forced flow of warm water. Elastic bladder contains water and ice. Connectors designed to prevent leaks easily connectable and disconnectable. Female portions embedded in wall of heat sink. After water frozen, male portions inserted and flow of warm water initiated. Water melts ice in and around female connectors, then flow passes between ice and bladder from inlet to outlet. Component of low-power portable refrigerator to operate for short time in picnic or camp setting.

Lomax, Curtis↗
NASA NTRS1989

Heat sink effects on weld bead: VPPA process

An investigation into the heat sink effects due to weldment irregularities and fixtures used in the variable polarity plasma arc (VPPA) process was conducted. A basic two-dimensional model was created to represent the net heat sink effect of surplus material using Duhamel's theorem to superpose the effects of an infinite number of line heat sinks of variable strength. Parameters were identified that influence the importance of heat sink effects. A characteristic length, proportional to the thermal diffusivity of the weldment material divided by the weld torch travel rate, correlated with heat sinking observations. Four tests were performed on 2219-T87 aluminum plates to which blocks of excess material were mounted in order to demonstrate heat sink effects. Although the basic model overpredicted these effects, it correctly indicated the trends shown in the experimental study and is judged worth further refinement.

Steranka, Paul O., Jr.↗
NASA NTRS1990

Heat sink effects on weld bead: VPPA process

An investigation into the heat sink effects due to weldment irregularities and fixtures used in the variable polarity plasma arc (VPPA) process was conducted. A basic two-dimensional model was created to represent the net heat sink effect of surplus material using Duhamel's theorem to superpose the effects of an infinite number of line heat sinks of variable strength. Parameters were identified that influence the importance of heat sink effects. A characteristic length, proportional to the thermal diffusivity of the weldment material divided by the weld torch travel rate, correlated with heat sinking observations. Four tests were performed on 2219-T87 aluminum plates to which blocks of excess material were mounted in order to demonstrate heat sink effects. Although the basic model overpredicted these effects, it correctly indicated the trends shown in the experimental study and is judged worth further refinement.

Steranka, Paul O., Jr.↗
NASA NTRS2012

Model Development and Experimental Validation of the Fusible Heat Sink Design for Exploration Vehicles

The Fusible Heat Sink is a novel vehicle heat rejection technology which combines a flow through radiator with a phase change material. The combined technologies create a multi-function device able to shield crew members against Solar Particle Events (SPE), reduce radiator extent by permitting sizing to the average vehicle heat load rather than to the peak vehicle heat load, and to substantially absorb heat load excursions from the average while constantly maintaining thermal control system setpoints. This multi-function technology provides great flexibility for mission planning, making it possible to operate a vehicle in hot or cold environments and under high or low heat load conditions for extended periods of time. This paper describes the model development and experimental validation of the Fusible Heat Sink technology. The model developed was intended to meet the radiation and heat rejection requirements of a nominal MMSEV mission. Development parameters and results, including sizing and model performance will be discussed. From this flight-sized model, a scaled test-article design was modeled, designed, and fabricated for experimental validation of the technology at Johnson Space Center thermal vacuum chamber facilities. Testing showed performance comparable to the model at nominal loads and the capability to maintain heat loads substantially greater than nominal for extended periods of time.

Cognata, Thomas J.↗
NASA NTRS2013

Model Development and Experimental Validation of the Fusible Heat Sink Design for Exploration Vehicles

The Fusible Heat Sink is a novel vehicle heat rejection technology which combines a flow through radiator with a phase change material. The combined technologies create a multi-function device able to shield crew members against Solar Particle Events (SPE), reduce radiator extent by permitting sizing to the average vehicle heat load rather than to the peak vehicle heat load, and to substantially absorb heat load excursions from the average while constantly maintaining thermal control system setpoints. This multi-function technology provides great flexibility for mission planning, making it possible to operate a vehicle in hot or cold environments and under high or low heat load conditions for extended periods of time. This paper describes the modeling and experimental validation of the Fusible Heat Sink technology. The model developed was intended to meet the radiation and heat rejection requirements of a nominal MMSEV mission. Development parameters and results, including sizing and model performance will be discussed. From this flight-sized model, a scaled test-article design was modeled, designed, and fabricated for experimental validation of the technology at Johnson Space Center thermal vacuum chamber facilities. Testing showed performance comparable to the model at nominal loads and the capability to maintain heat loads substantially greater than nominal for extended periods of time.

Cognata, Thomas J.↗
NASA NTRS2015

Phase Change Material Heat Sink for an ISS Flight Experiment

A flight experiment is being constructed to utilize the persistent microgravity environment of the International Space Station (ISS) to prove out operation of a microgravity compatible phase change material (PCM) heat sink. A PCM heat sink can help to reduce the overall mass and volume of future exploration spacecraft thermal control systems (TCS). The program is characterizing a new PCM heat sink that incorporates a novel phase management approach to prevent high pressures and structural deformation that often occur with PCM heat sinks undergoing cyclic operation in microgravity. The PCM unit was made using brazed aluminum construction with paraffin wax as the fusible material. It is designed to be installed into a propylene glycol and water cooling loop, with scaling consistent with the conceptual designs for the Orion Multipurpose Crew Vehicle. This paper reports on the construction of the PCM heat sink and on initial ground test results conducted at UTC Aerospace Systems prior to delivery to NASA. The prototype will be tested later on the ground and in orbit via a self‐contained experiment package developed by NASA Johnson Space Center to operate in an ISS EXPRESS rack.

Quinn, Gregory↗
NASA NTRS2015

Phase Change Material Heat Sink for an ISS Flight Experiment

A flight experiment is being constructed to utilize the persistent microgravity environment of the International Space Station (ISS) to prove out operation of a microgravity compatible phase change material (PCM) heat sink. A PCM heat sink can help to reduce the overall mass and volume of future exploration spacecraft thermal control systems (TCS). The program is characterizing a new PCM heat sink that incorporates a novel phase management approach to prevent high pressures and structural deformation that often occur with PCM heat sinks undergoing cyclic operation in microgravity. The PCM unit was made using brazed aluminum construction with paraffin wax as the fusible material. It is designed to be installed into a propylene glycol and water cooling loop, with scaling consistent with the conceptual designs for the Orion Multipurpose Crew Vehicle. This paper reports on the construction of the PCM heat sink and on initial ground test results conducted at UTC Aerospace Systems prior to delivery to NASA. The prototype will be tested later on the ground and in orbit via a self‐contained experiment package developed by NASA Johnson Space Center to operate in an ISS EXPRESS rack.

Quinn, Gregory↗
NASA NTRS1997

Structural Design and Analysis of a Light-Weight Laminated Composite Heat Sink for Spaceflight PWBs

In order to reduce the overall weight in spaceborne electronic systems, a conventional metallic heat sink typically used for double-sided printed wiring boards was suggested to be replaced by light-weight and high-strength laminated composite materials. Through technology validation assurance (TVA) approach, it has been successfully demonstrated that using laminated composite heat sink can not only reduce the weight of the heat sink by nearly 50%, but also significantly lower the internal thermally-induced stresses that are largely responsible for potential delamination under cyclic temperature variations. With composite heat sink, both thermal and dynamic performance of the double-sided printed wiring board (PWB) exceeds that of its counterpart with metallic heat sink. Also included in this work is the original contribution to the understanding of creep behavior of the worst-case leadless chip carrier (LCC) surface mount solder joint. This was identified as the interconnection most susceptible to thermal fatigue damage in the PWB assembly.

Fan, Mark S.↗
DOE OSTI2024

Thermal Management of Discretized Heaters Using CuW Microchannel Heat Sinks and FC3283

Single-phase cooling using microchannel heat sinks (MCHS) has become a popular approach for overcoming the thermal challenges associated with high-powered microelectronic devices. Thermal management is one of the largest barriers to higher power densities in electronics and frequently limits overall device performance. The implementation of forced convective cooling via single-phase liquid cooling in MCHS reduces the thermal resistance resulting in lower device temperatures at high-power conditions, which can decrease the package size and extend the lifespan of devices. The goal of the work described in this article was to investigate practical cooling solutions for laser diode bars. This study examined the effectiveness of a copper tungsten (CuW) microchannel heat sink paired with a dielectric coolant (FC3283) for dissipating both discrete and uniform heat fluxes up to 600 W/cm2 across a 0.25-cm2 surface area through a numerical and experimental study. CuW was chosen as the MCHS material because it is thermal expansion matched to GaAs, which is a common laser diode substrate. FC3283 serves as a dielectric coolant that is compatible with power electronics cooling. The microchannels utilized in this work were approximately $365$ $μ$ m deep and $100$ $μ$ m wide resulting in a hydraulic diameter of $160$ $μ$ m. The study investigated the cooling performance across a variety of applied power loads and flow rates to determine optimal effectiveness. The resulting thermal resistance ranged from 0.15 cm2 K/W at the highest flow rate to 0.26 cm2 K/W at the lowest flow rate. Further, the resulting thermal performance from this study demonstrates the importance of considering discrete heat sources separately from uniform heat sources and proved that the unique combination of CuW microchannels with FC3283 can be a promising cooling option toward future advancements of laser diode bars and other high-power microelectronics.

42 ENGINEERING↗