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Thermal Management of Discretized Heaters Using CuW Microchannel Heat Sinks and FC3283
Single-phase cooling using microchannel heat sinks (MCHS) has become a popular approach for overcoming the thermal challenges associated with high-powered microelectronic devices. Thermal management is one of the largest barriers to higher power densities in electronics and frequently limits overall device performance. The implementation of forced convective cooling via single-phase liquid cooling in MCHS reduces the thermal resistance resulting in lower device temperatures at high-power conditions, which can decrease the package size and extend the lifespan of devices. The goal of the work described in this article was to investigate practical cooling solutions for laser diode bars. This study examined the effectiveness of a copper tungsten (CuW) microchannel heat sink paired with a dielectric coolant (FC3283) for dissipating both discrete and uniform heat fluxes up to 600 W/cm2 across a 0.25-cm2 surface area through a numerical and experimental study. CuW was chosen as the MCHS material because it is thermal expansion matched to GaAs, which is a common laser diode substrate. FC3283 serves as a dielectric coolant that is compatible with power electronics cooling. The microchannels utilized in this work were approximately $365$ $μ$ m deep and $100$ $μ$ m wide resulting in a hydraulic diameter of $160$ $μ$ m. The study investigated the cooling performance across a variety of applied power loads and flow rates to determine optimal effectiveness. The resulting thermal resistance ranged from 0.15 cm2 K/W at the highest flow rate to 0.26 cm2 K/W at the lowest flow rate. Further, the resulting thermal performance from this study demonstrates the importance of considering discrete heat sources separately from uniform heat sources and proved that the unique combination of CuW microchannels with FC3283 can be a promising cooling option toward future advancements of laser diode bars and other high-power microelectronics.
Design, fabrication, simulation, and testing of additively manufactured lattice-based copper heat sinks
Here, this study investigates the potential advantages of lattice structure-based bound metal material extrusion (MEX) 3D printing for fabricating high-performance copper heat sinks. Copper powder-filled polymer filaments, with a copper content of > 90 wt.%, were developed specifically for the bound metal MEX 3D printing process. Three types of structures—planar, strut, and surface lattices—were 3D printed to facilitate efficient heat transfer pathways within the heat sinks. Subsequent post-processing steps, including polymer removal and sintering, were performed to achieve dense copper parts. Hot isostatic pressing was further employed to enhance the sintered density from 93 to 98%. Finite element analysis (FEA) simulations were conducted to assess the heat transfer efficiency of the designs, and heat transfer experiments were performed using a custom setup to validate the simulation results. Additionally, this research explores the use of extended hold times during pre-sintering and a reduced atmosphere to enhance the %IACS values (electrical conductivity) and thermal performance of the bound metal MEX 3D printed copper heat sinks. The investigation combines experimental analysis, including simulations and heat transfer experiments, to gain insights into the structure-material property relationships and optimize the thermal performance of the printed heat sinks.
Double-sided cooling cold plates with overhanging heat sinks and through body busbar for high-power density power electronics
A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.
Exploration of Binder Jet Additive Manufacturing for Automotive Heat Sink Component Fabrication
ORNL (Contractor) and Magna Services of America Inc. (Participant) collaborated to determine the feasibility of binder jet additive manufacturing (BJAM) for the fabrication of copper components for automotive heat sink applications. This Phase 1 collaboration focused on printing copper heat sinks that rely on capillary effect to move fluids rather than mechanical pumps in electric vehicles to extend the battery range and life. Partial sintering of copper powders deposited via BJAM was hypothesized to aid capillary effect to improve the heat transfer. Further, BJAM offers the potential for scalability at a production level.
Oblique microchannel merged with circle micro pin-fin as a novel hybrid heat sink for cooling of electronic devices
Not Available
High Heat Flux Thermal Management using CuW Microchannel Heat Sinks and FC3283
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Thermal Management of Discretized Heaters Using CuW Microchannel Heat Sinks and FC3283 for Laser Diode Applications
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THERMAL MANAGEMENT OF DISCRETIZED HEATERS USING CUW MICROCHANNEL HEAT SINKS AND FC3283 FOR LASER DIODE APPLICATIONS
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High performance heat exchangers for next generation hybrid cooler (CRADA NFE-19-07891 Final Report)
The evaporative cooling process has been successfully deployed in multiple energy conversion processes such as power generation, process cooling, heating, ventilation & cooling (HVAC), and commercial and industrial refrigeration. The heat exchanger is a very common yet extremely critical component of such systems. The device is important since the performance of the overall cooling system heavily relies on the thermal-hydraulic efficiency of the heat exchanger. The possible wet operation as evaporative cooling heat exchanger complicates the issue. Indeed, based on the hybrid nature of operation (fully dry, partially wet, fully wet) the efficiency can vary significantly and can cause performance variation for the whole system. Understanding the importance of the issue, Oak Ridge National Laboratory (Contractor) and Baltimore Aircoil Company (Participant) propose an activity focused on the analysis of the existing heat exchanger technology used in air and evaporative cooling processes and design, development and demonstration of a novel heat exchanger design based on porous materials. The potential candidates include metallic wire meshes and metal foams carefully designed for the proposed application. Prior research has indicated that these materials have great potential for deployment in thermal systems, particularly heat sinks and heat exchangers. It is expected that the successful completion of the project will lead to novel heat exchanger technology for hybrid systems (capable of dry and wet operation) by exploring newly emerging materials and their potential for heat transfer application. The overall goal is to develop a next generation heat exchanger technology which can be deployed in evaporative cooling systems. The impact of the such development is significant since, it will not only make the overall system highly efficient but will also, reduce the total refrigerant charge in the heat exchanger, a critical aspect for the deployment of refrigerants with lower Global Warming Potential (GWP).
High performance heat exchangers for next generation hybrid cooler (CRADA Final Report)
The evaporative cooling process has been successfully deployed in multiple energy conversion processes such as power generation, process cooling, heating, ventilation & cooling (HVAC), and commercial and industrial refrigeration. The heat exchanger is a very common yet extremely critical component of such systems. The device is important since the performance of the overall cooling system heavily relies on the thermal-hydraulic efficiency of the heat exchanger. The possible wet operation as evaporative cooling heat exchanger complicates the issue. Indeed, based on the hybrid nature of operation (fully dry, partially wet, fully wet) the efficiency can vary significantly and can cause performance variation for the whole system. Understanding the importance of the issue, Oak Ridge National Laboratory (Contractor) and Baltimore Aircoil Company (Participant) propose an activity focused on the analysis of the existing heat exchanger technology used in air and evaporative cooling processes and design, development and demonstration of a novel heat exchanger design based on porous materials. The potential candidates include metallic wire meshes and metal foams carefully designed for the proposed application. Prior research has indicated that these materials have great potential for deployment in thermal systems, particularly heat sinks and heat exchangers. It is expected that the successful completion of the project will lead to novel heat exchanger technology for hybrid systems (capable of dry and wet operation) by exploring newly emerging materials and their potential for heat transfer application. The overall goal is to develop a next generation heat exchanger technology which can be deployed in evaporative cooling systems. The impact of the such development is significant since, it will not only make the overall system highly efficient but will also, reduce the total refrigerant charge in the heat exchanger, a critical aspect for the deployment of refrigerants with lower Global Warming Potential (GWP).
The Monolithic Heat Pipe Microreactor Reference Plant Model
This work introduces a reference plant model for a generic monolithic heat-pipe-cooled microreactor. The model will serve as a springboard to develop future evaluation models in the licensing process of similar microreactor designs at the U.S. Nuclear Regulatory Commission. This model has been developed with the Comprehensive Reactor Analysis Bundle and its specifications are based on open literature publications for the eVinci TM design. BlueCRAB is the U.S. Nu- clear Regulatory Commission non-light-water reactor analysis system based on the Multiphysics Object-Oriented Simulation Environment framework, which can couple the Griffin, BISON, and Sockeye applications to resolve the various physics that are essential for the safety analysis of this type of reactor system. The core specifications includes tristructural isotropic fuel, graphite monolith, graphite reflectors, and drums composed of graphite and B 4 C. No moderator or burnable poison pins are used in the design. The fuel enrichment is reduced to control excess reactivity in the core. This core design is not optimized and only serves for testing purposes, since the primary objective of this work is to exercise the multiphysics coupling for this type of reactor system. A three dimensional (3D) core heterogeneous Griffin discrete ordinates (SN) transport model allows the precise calculation of the flux distribution and pin powers. Griffin transfers the power density distribution and obtains a temperature distribution to and from BISON. The BISON model com- putes the 3D core temperature distribution and is coupled to 876 Sockeye subapplications running a heat pipe model. This 3D conduction model is coupled to the various heat pipes via heat flux boundary conditions. The model includes a small gap between the heat pipe and the monolith. Convective heat transfer boundaries with either ambient temperature or condenser temperature as heat sinks are imposed at the model boundaries. The 2D Sockeye heat pipe model uses a vapor- only methodology, which provides the needed resolution for transient calculations and allows the determination of various heat pipe limits. This approach is superior to the superconductor model traditionally used in steady-state calculations. BlueCRAB computes steady-state power and temperature distributions that serve as the initial condition for a loss-of-heat-sink transient simulation. The steady-state results show significant peaking due to the position of the control drum, but this is a characteristic of the particular design used, which is not optimized at this stage. The transient results show the reactor power slowly stabilizing towards a 3% power level after the partial loss of secondary heat removal. Several recriticalities are observed due to cooling through the secondary system but the reactor is self-stabilizing and behaves as expected.
Design and Analysis of the Open-Surface Slow Li Flow Divertor and Comparison to the Fast Li Flow Divertor
In the ongoing U.S. project, “Liquid Metal Plasma Facing Components,” sponsored by the U.S. Department of Energy, efforts have been taken to develop two open-surface divertor designs for the Fusion Nuclear Science Facility using liquid lithium (Li) as a heat and particle flux removal media. The main focus of this study is the design and analysis of a slow (~1 mm/s) and thin (<1 mm) open-surface Li flow divertor with a Li-cooled substrate, which is then compared with an earlier design of a fast (up to 10 m/s) and thick (~0.5 cm) Li flow divertor with the substrate cooled with helium. The slow Li flow divertor design is based on the original LiWall concept developed at the Princeton Plasma Physics Laboratory. Such a thin and slow Li layer can remove the particle flux by reducing the recycling flux, while the heat flux is removed mainly through the heat sink located beneath. In the present study, the heat sink is provided through a Li cooling flow inside the substrate of reduced activation ferritic/martensitic steel. By performing a multiphysics analysis with COMSOL that included liquid-metal magnetohydrodynamics (MHD), heat transfer, and structural mechanics, the impact of various factors on the divertor heat removal capability, such as Li flow velocity, MHD effects, and inlet velocity boundary condition, were examined. Based on comparisons of the two divertor designs, it was shown that the fast-flow divertor significantly outperformed the slow-flow design, whose heat removal capability was limited to ~1 to 2 MW/m2.
Group-III nitride devices and systems on IBAD-textured substrates
A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111>oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used. The user is able to choose a substrate for its mechanical and thermal properties, such as how well its coefficient of thermal expansion matches that of the hexagonal epitaxial layer, while choosing a textured layer that more closely lattice matches that layer. Electronic devices such as LEDs can be manufactured from such structures. Because the substrate can act as both a reflector and a heat sink, transfer to other substrates, and use of external reflectors and heat sinks, is not required, greatly reducing costs. Large area devices such as light emitting strips or sheets may be fabricated using this technology.
Preliminary Assessment for the Electric Load Shifting Potential of Integrating Thermal Energy Storage with Heat Pumps in Residential Buildings in Texas of United States
The widespread adoption of electric-driven heat pumps for heating and cooling is expected to significantly increase electric demand. Cooling electric demand will result in an increase in peak hours electric loads, placing additional strain on the grid during peak hours. This challenge, combined with the current rapidly increasing demand from data centers, exacerbates the electric demand duck curve problem. Integrating thermal energy storage (TES) with heat pump can shift electric use for heating and cooling from peak to off-peak hours of the electric grid, which can help flatten the daily electric demand profile of a building. This paper presents a novel design that integrates heat pump with TES (HP-TES), which uses phase change materials (PCM). Heat pump charges TES by melting or freezing PCM during off-peak hours when there is no thermal demand from the building. TES is then discharged (i.e., by freezing or melting PCM) during peak hours to provide a more favorable heat source or heat sink for the heat pump to meet the thermal demand of the building with lower electricity use than conventional air-source heat pumps. Computer simulations were developed to predict the performance of HP-TES applied to a typical single-family house in the US. The building-level simulation results were scaled up to preliminarily assess the aggregated impacts of deploying HP-TES across all single-family houses in Texas of the United States, including reduction of peak demand of the electric grid.
Motorette Thermal Performance Testing and Modeling for an Electric Motor with Additively Manufactured Hollow Conductors with Integrated Heat Pipes
This paper discusses the design, build and test of a motorette to characterize the thermal performance of an additively manufactured coil integrated with heat pipes. The motorette is powered using a variable frequency AC power supply and cooled through two independent cooling systems. The first cooling system cools the stator core using forced convection of air flowing over a finned heat sink mounted on the stator outer diameter. The second cooling system cools the heat pipes using forced convection of 50-50 water ethylene glycol (WEG) mixture flowing through condenser chambers. A 3D thermal FEA model of the setup is built and heat transfer coefficients (HTC) of convective boundaries are computed using coolant flow rates from test data and empirical equations. Temperature at locations on the coil and heat sink are recorded and compared to thermal model predicted values. A maximum temperature error of 22.7% occurs at 180ARMS and 800 Hz operating point for the AM dual coil. The thermal model provides higher temperatures compared to test results and hence it is on the conservative side but in general, there is good correlation between test and model results. Lastly, opportunities for improvement to both test data measurement and 3D thermal FEA modeling are discussed.
Pre- and post-launch operation of the Resolve soft X-ray spectrometer onboard the XRISM satellite
Resolve is a high-resolution X-ray spectrometer onboard the X-Ray Imaging and Spectroscopy Mission (XRISM), launched on September 6 (UT), 2023. The Resolve has performed better than its required spectral resolution (7 eV at full width at half maximum at 6 keV), both on the ground and in orbit, and has been confirmed to have comparable performance to the soft X-ray spectrometer onboard the ASTRO-H (Hitomi) satellite. The focal plane is composed of an array of microcalorimeter detectors operated at 50 mK to achieve the required energy resolution, and the cooling system is designed to satisfy the lifetime requirement of over 3 years. The focal plane and cooling system are contained in a vacuum-insulated dewar. The cooling system is equipped with a two-stage adiabatic demagnetization refrigerator (ADR) that uses superfluid liquid helium (LHe) as its heat sink. The system includes a third ADR stage that can be used to provide the heat sink when the helium is exhausted. A Joule–Thomson cooler and several two-stage Stirling coolers are used to reduce the heat load on the LHe. During pre-launch operations, we carried out a superfluid LHe top-off operation. The resultant amount of LHe onboard Resolve was over 35 L before launch, which is sufficient to meet the lifetime requirement. During post-launch operation, the LHe vent valve was opened 5 min after launch during rocket acceleration, and the cryocoolers were turned on after several orbits, as planned, which established stable cooling within the dewar. Pre- and post-launch operations for the Resolve instrument were planned around multiple constraints from launch vehicle operations; all were successfully completed, and the launch requirements were fully met.