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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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We propose a wearable thermoelectric cooler and heatsink based of silicone elastomer, phase-change material, and graphite powder, which can achieve a cooling temperature of ∼5 K at 0.5 W input power for more than 5 h under ambient conditions.
This paper presents the design and development of a 30-kW 3D printed based air-cooled silicon carbide (SiC) inverter for electric vehicle application. Specifically, an all-SiC air-cooled power module is designed, aiming at reduced thermal resistance for high temperature and high power density operation. The module assembly incorporates three major parts: an optimized 3D printed heat sink, a SiC MOSFET phase leg module, and a two-channel gate driver. The electrical and thermal performance of the power module is evaluated through double pulse test and continuous operation. Based on the air-cooled power module, a three-phase half-bridge voltage source inverter with 3D-printed air duct is built and tested to further verify the performance of the power module.
A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.
Review of design features and how fabrication will be completed for DRIFT Capsules, Big-BUSTER, and Moderator Assemblies for Big-BUSTER in TREAT.
The traditional heatsink design technologies for forced air-cooling and power semiconductors with low junction temperatures have constrained the converters to be designed with massive heatsinks. The low power losses of WBG device technology and higher junction temperature operation over a wide operating range of power have not been fully utilized with liquid-cooled systems. The other major limitation has also been the traditional power module packaging “stack” approach with baseplate. This paper presents a novel power stage design which involves 1.7 kV silicon carbide (SiC) MOSFETs, a heatsink design with Genetic Algorithm (GA) and built using 3D printing technology, and a novel integrated modular power module for high power density. The air-cooled module assembly has a SiC MOSFET phase leg module with split high-side and low-side switches and a gate driver with cross-talk and short circuit protection functions. The heatsink design was modeled using a co-simulation environment with finite element analysis software and GA in MATLAB and COMSOL. The proposed concepts were verified and validated through experiments at each stage of development. The power stage was evaluated at 800V, 900 V, and 1kV for 20 kHz switching frequency and 50-kW load. The experimental results show that the CEC efficiency is 98.4 %. In addition to the efficiency, a power density of 75 W/in 3 was also achieved.
Opportunities to improve thermal management in electronic devices are currently hindered by processing constraints that limit thermal conductivity in polymer-matrix composites. Active patterning of filler particles is a promising route to improve conductivity while retaining processability by improving particle contact density and directing heat along optimized pathways. Here, we employ acoustic patterning to align and compact filler particles into stripes during stereolithographic 3D printing. This approach produces polymer-based composite materials with highly efficient embedded heat transport pathways which reach 95 vol% particle utilization (relative to the parallel conduction upper limit). These composites exhibit anisotropic thermal conductivity up to 300% higher than unpatterned composites, with in-plane anisotropy ratios of up to 350%. Combining this high conductivity with 3D printing enables materials with engineered heat networks that optimize transport from hot spots to heatsinks while maintaining low viscosity for fast particle patterning and for infiltration around electronic components. Finally, numerical simulations of acoustic assembly of particles with varied geometry, when compared to experimentally characterized particle packing, illuminate pathways for further improving conductivity by optimizing particle geometry for alignment and stacking of particles with maximum contact surface area.
Purpose AlSi10Mg alloy is commonly used in laser powder bed fusion due to its printability, relatively high thermal conductivity, low density and good mechanical properties. However, the thermal conductivity of as-built materials as a function of processing (energy density, laser power, laser scanning speed, support structure) and build orientation, are not well explored in the literature. This study aims to elucidate the relationship between processing, microstructure, and thermal conductivity. Design/methodology/approach The thermal conductivity of laser powder bed fusion (L-PBF) AlSi10Mg samples are investigated by the flash diffusivity and frequency domain thermoreflectance (FDTR) techniques. Thermal conductivities are linked to the microstructure of L-PBF AlSi10Mg, which changes with processing conditions. The through-plane exceeded the in-plane thermal conductivity for all energy densities. A co-located thermal conductivity map by frequency domain thermoreflectance (FDTR) and crystallographic grain orientation map by electron backscattered diffraction (EBSD) was used to investigate the effect of microstructure on thermal conductivity. Findings The highest through-plane thermal conductivity (136 ± 2 W/m-K) was achieved at 59 J/mm 3 and exceeded the values reported previously. The in-plane thermal conductivity peaked at 117 ± 2 W/m-K at 50 J/mm 3 . The trend of thermal conductivity reducing with energy density at similar porosity was primarily due to the reduced grain size producing more Al-Si interfaces that pose thermal resistance. At these interfaces, thermal energy must convert from electrons in the aluminum to phonons in the silicon. The co-located thermal conductivity and crystallographic grain orientation maps confirmed that larger colonies of columnar grains have higher thermal conductivity compared to smaller columnar grains. Practical implications The thermal properties of AlSi10Mg are crucial to heat transfer applications including additively manufactured heatsinks, cold plates, vapor chambers, heat pipes, enclosures and heat exchangers. Additionally, thermal-based nondestructive testing methods require these properties for applications such as defect detection and simulation of L-PBF processes. Industrial standards for L-PBF processes and components can use the data for thermal applications. Originality/value To the best of the authors’ knowledge, this paper is the first to make coupled thermal conductivity maps that were matched to microstructure for L-PBF AlSi10Mg aluminum alloy. This was achieved by a unique in-house thermal conductivity mapping setup and relating the data to local SEM EBSD maps. This provides the first conclusive proof that larger grain sizes can achieve higher thermal conductivity for this processing method and material system. This study also shows that control of the solidification can result in higher thermal conductivity. It was also the first to find that the build substrate (with or without support) has a large effect on thermal conductivity.
In this digest a 50kW string PV inverter formed using all SiC semiconductor devices is presented. The inverter design includes additively manufactured power block, symmetrical Y-core inductors for ac side filter, and advanced inverter functionality for grid support. This inverter utilizes the conventional three-phase Voltage Source Inverter topology and optimizes the design for SiC based devices. This paper presents the full functional validation of the designed inverter along with quantification of the efficiency and power density. The performance of the inverter for high dc-bus voltage without multi-level topology to exploit SiC advantages is also presented in this digest. The full paper will include details of inverter design, optimization and further experimental validation.
The demand for high performing, lightweight, reliable inverters, increased the scope of wide bandgap and high-switching frequency based solutions. To achieve such high efficiency inverters, it is vital to focus on the system level design considerations to maximize the benefits of these advanced technologies. This paper presents an improved design based on considerations to further reap the benefits of choosing the right inverter topology; increased capabilities through paralleling devices, with reduced total number of switches; and designing a planarized inverter with PCB based busbar. Appropriate thermal analysis and heatsink design has aided in increased system power density along with the overall efficiency. Demonstration of a 50kW 3-phase 3-level paralleled T-type SiC inverter operating at 40kHz switching frequency for aircraft applications is shown to evaluate the benefits of proposed design methodology. Here, the prototype achieves a high power density of 11kW/L.
We have developed a handheld γ -ray spectrometer based on 1024 pixels, 2.8mm×2.8mm×6 mm in size, of gadolinium–yttrium–gallium–aluminum garnet (GYGAG) ((Gd,Y,Ce) 3 (Ga,Al) 5 O 12 ) ceramic scintillator (total of 48-cm 3 detector volume) coupled to silicon photodiode (SiPD) arrays. The SiPD arrays and readout ASIC, originally developed for medical imaging applications, have been adapted for portability in a lightweight box with heatsink and thermoelectric cooling. Custom readout firmware for γ-ray spectroscopy has been implemented, and a system user interface was developed that runs on an Android tablet. Here, we have optimized the processing of the GYGAG(Ce), the pixel optical coupling, and electronics readout parameters to obtain single pixel energy resolution as good as R(662keV)=3.1 % full-width at half-maximum and full device resolution with singles events from all pixels summed of 4.5%. When Compton-summed events are included, full-energy peak efficiency increases by ~2× , and R(662keV)=4.7 % is obtained for the full device. The pixelated architecture is leveraged to locate point sources of radiological materials using Compton imaging and active masking techniques. Directional detection of a 1 mCi Cs-137 source at 10 m can be made to ±10° in ~2 s.
In a power module the parasitic inductance limits the dynamic high-frequency performance, and the area of the cooling surfaces limits the power capability. This paper presents a new 3D power electronic design methodology based on the concept of mutual inductance cancellation and multi-sided heat transfer. New 3D prismatic packaging concepts are proposed for Wide Band Gap (WBG) power devices, where the devices can be mounted at acute angles to adjacent interconnects or other devices. Discussion is given on electrical and thermal path optimization in a 3D space. To validate the 3D prismatic packaging methodology, a 1200V/50A SiC half-bridge power module is fabricated and tested for electrical and thermal performance and results are compared with simulations. The power density calculated for the module is 12 kW/in3 (including heatsink) and shows a 31.3% inductance reduction compared to a 2D planar module. Finally, design guidance suggested for utilizing prismatic structures is provided, together with suggested future work in the area. This paper presents the first reported true 3D power module.
Edge-emitting diode lasers with shallow location of a quantum-well active region at a depth of 0.92 μm were developed and their thermal resistance was evaluated from the analysis of true spontaneous emission spectra through the top contact window. Owing to a close spacing between the active region and laser heatsink, effective heat removal is achieved under continuous wave operation that is characterized by a low value of specific thermal resistance of 6 × 10{sup –3} K/(W cm{sup 2}).
The influence exerted by the heat removal conditions on the extent of overheating of photovoltaic converters of high-power (>10{sup 3} W/cm{sup 2}) laser light has been studied. The temperature of the p–n junction of photovoltaic cells was measured by recording the instantaneous values of the open-circuit voltage generated by laser light. The effect of cooling in high-efficiency photovoltaic cells (efficiency = 55%) via removal of a substantial part of absorbed optical power by the photocurrent into the external load was demonstrated. It was shown that, at laser radiation power of 2.5 W, the overheating of a photocell with an area of 1.7 × 10{sup –3} cm{sup 2} relative to the copper heatsink temperature is 48°C in the no-load conditions and 30°C in operation with the optimal load.
OLED lighting has immense potential as aesthetically pleasing, energy-efficient general illumination. Unlike other light sources, such as incandescents, fluorescents, and inorganic LEDs, OLEDs naturally emit over a large-area surface. They are glare free, do not need to be shaded, and are cool to the touch, requiring no heatsink. The best efficiencies and lifetimes reported are on par with or better than current forms of illumination. However, the cost for OLED lighting remains high – so much so that these products are not market competitive and there is very low consumer demand. We believe that flexible, plastic-based devices will highlight the advantages of aesthetically-pleasing OLED lighting systems while paving the way for lowering both materials and manufacturing costs. These flexible devices require new development in substrate and support technology, which was the focus of the work reported here. Sinovia Technologies, as part of a collaborative team, has developed integrated plastic substrates to serve as supports for flexible OLED lighting. These substrates include a barrier to protect the OLED from moisture and oxygen-related degradation, a smooth, highly conductive transparent anode to define the OLED area, and a light scattering layer to improve emission efficiency. To ensure low cost, the anode pattern must be defined using high throughput, continuous processing, and any pattern shape should be possible. No current patterning technique meets all of these requirements. This SBIR work demonstrated the use of flexographic printing as an effective method of patterning for integrated substrates. Flexography is a letterpress process commonly used for many types of everyday items including boxes, retail bags, milk cartons, food packaging, disposable cups, adhesive tapes, envelopes, wallpaper, and newspaper. The printing process can go as fast as 600 meters per minute with feature resolution around 10 microns, showing promise for low-cost with high throughput. In this case, Sinovia has successfully used this technique to print transparent anode patterns roll-to-roll as part of our integrated substrate for OLED lighting. We have characterized the printed films and tailored the edges of the printed areas for OLED compatibility. We followed this by making white OLEDs using these anodes. To ensure that our anodes were compatible with different OLED stack structures, we fabricated solution-processed polymer white OLEDs, as well as collaborated with OLEDWorks to fabricate evaporated small-molecule devices. Comparing to results from our previous studies, we find that the flexography process does not have any detrimental effects to our overall substrate. We were able to show that our flexographically printed integrated substrate improves OLED efficiency by 24 – 35%, similar to previous results demonstrated using batch-patterning techniques. The success of this work represents two substantial opportunities for OLED lighting manufacturers. The first to first facilitate flexible lighting panels at scale, and the second to lower costs for by enabling roll-to-roll manufacture of the entire device stack. When realized, both of these will help OLED to become market competitive with other forms of general illumination.
This project developed the key technology for a scalable, high-density photovoltaic (PV) inverter, based on gallium-nitride (GaN) power semiconductors, and advanced digital control. Specifically, we explored the feasibility of a flying-capacitor multi-level inverter for 1.5 kV PV installations, through the development of hardware prototypes utilizing low-inductance commutation loop designs, robust digital control and signaling, and low-cost heatsink integration.
This paper discusses the impact of parasitic inductances on the electromagnetic interference (EMI) performance at radiated frequency and provides a new concept for high-frequency wide bandgap (WBG) power module package design with integrated π-type common mode filter (π-CMF). The connection parasitic-inductances of a π-type CMF model are analyzed, and the parasitic inductances from the CMF to the CM noise source and to the heatsink are minimized to improve the CMF's EMI performance in the radiated frequency range. Therefore, placing the π-CMF closer to the power module (i.e. in-package CMF) provides a larger noise attenuation compared to placing it outside the module (i.e. external CMF). To verify the theoretical analysis, a half-bridge GaN power module with an in-package π-CMF is designed, and experiments are conducted by comparing the attenuated noise spectrums of a 70-V/1.75-A hard-switching buck converter built by the designed module with an external CMF and the power-module integrated CMF. According to the experiment results, up to 10 dBμV more attenuation is achieved by the in-package CMF than the external CMF, validating the analytical conclusion.
The Temperature Heatsink Overpower Response Commissioning (THOR-C) and THOR-Metal (THOR-M) experiments will be performed as part of an ongoing project for testing sodium fast reactor fuels with the Japan Atomic Energy Agency (JAEA). The THOR-C experiments consist of fresh metallic fuel pins and have been analyzed using the ABAQUS, Ansys codes and the BISON fuel performance code. THOR-M-Loss of Flow-1 (THOR-M-LOF-1) is designed to test an EBR-II irradiated fuel pin under LOF conditions. Simulation of the THOR-MLOF-1 experiment required first simulating the base irradiation of the fuel pin in EBR-II. MFUEL module of SAS4A/SASSYS-1 [1] is a physics-based metallic fuel performance model applicable to the normal operation, transient scenarios and fuel failure modeling including scenarios with bulk fuel melting. The model has been validated using EBR-II normal operation, separate effect transient tests as well as TREAT M-Series transient tests [2]. In this study, MFUEL models has been utilized together with a new capsule heat transfer model developed in this project. The new heat transfer model was necessary due to (1) significant amount of heat losses that required 2D heat transfer, (2) the presence of a titanium heat sink, rejecting a significant amount of heat, and (3) stagnant coolant conditions, which are inconsistent with SAS4A/SASSYS-1 (SAS) heat transfer model. Updates to SAS4A/SASSYS-1 and MFUEL has been described below, followed by a preliminary validation effort using the results from THOR-C-2 fresh fuel capsule experiment. A previous study for THOR-C-2 analysis using BISON code is also utilized in this study to model this test [3]. [1] D. O’Grady, A. J. Brunett, L. Ibarra, A. Karahan, T. Kim, T. S. Sumner, R. Thomas, T. H. Fanning, “The SAS4A/SASSYS-2 Version 5.7 Safety Analysis Code System,” Argonne National Laboratory,ANL/NSE-SAS/5.7, (2023). [2] A. Karahan, T. Kim, T. Fanning, D. O’Grady, “Validation of MFUEL Metal Fuel Performance Models of SAS4A/SASSYS-1,” Argonne National Laboratory, ANL/NSE-23/11, (2023). [3] M. Mihelish, A. Zabriskie, K. Paaren, P. Medvedev, C. Jensen, “Fuel Performance Predictions for the TREAT THOR-C Experiments,” Idaho National Laboratory, INL/RPT-23-73397, Revision 0, (2023)
In November 2017, the Transient Reactor Test Facility returned to operation. Since that time, many transient test series have been completed, such as the Transient Heatsink Overpower Response capsule (THOR), the Transient Water Irradiation System for TREAT (TWIST), and Sirius. Each has provided valuable data for materials performance and reactor safety that can be applied in future designs. During each experimental series, detector count rates provided important information on the core behavior during transients. However, a limitation of these data is that variations in the neutron distribution during experiments can cause errors when attempting to infer reactivity evolution from detector signals. Neutron physics codes can be used to compute the flux shape variations. However, this is a poor solution when the experimental data is used for code verification, validation and uncertainty quantification. Indeed, if the output of the code is used both as a reference and to correct what the reference is compared to, the circular dependency limits the quality of the verification, validation and uncertainty quantification approach. To overcome this problem, the autocorrected reactimeter algorithm (ACRA) has been developed. This approach infers a time-dependent reactivity evolution by testing different spatial corrections and selecting the one that minimizes reactivity variations when the core is in a frozen configuration (i.e., when there is no variation in parameters affecting reactivity). However, the scope of this method was limited to transients where there were negligible thermal feedback. Indeed, the core is never in a frozen configuration when the fuel temperature varies during the whole transient. This is our motivation for developing an improved version of the ACRA that does not require frozen configurations. To develop this new algorithm, we need a precise and unbiased implementation of the inverse point kinetic equations (IPKEs) as any error in the reactivity evaluation will be propagated into the choice of the optimal spatial correction. Indeed, the previous reactimeter algorithm would use approximations, such as a negligible flux amplitude derivative, to focus on rapidity. For the numerical validation of ACRA, we aim at absolute error under for reactivity derived from signals similar to the one of this study. In this summary, we test eight different IPKE implementations. Each will process a mockup signal built for this study, similar to those that the future ACRA will process. Each reactivity output will be compared to the reference reactivity that has been used to generate the mockup signal. The implementation minimizing the difference with the reference reactivity will be used in the development of a new ACRA formulation.