Results for “Interfacial Electron Transfer”

NASA NTRS2011

Development and Progress in Enabling the Photocatalyst Ti02 Visible-Light-Active

Photocatalytic oxidation (PCO) of organic contaminants is a promising air and water quality management approach which offers energy and cost savings compared to thermal catalytic oxidation (TCO). The most widely used photocatalyst, anatase TiO2, has a wide band gap (3.2 eV) and is activated by UV photons. Since solar radiation consists of less than 4% UV, but contains 45% visible light, catalysts capable of utilizing these visible photons need to be developed to make peo approaches more efficient, economical, and safe. Researchers have attempted various approaches to enable TiO2 to be visible-light-active with varied degrees of success'. Strategies attempted thus far fall into three categories based on their electrochemical' mechanisms: 1) narrowing the band gap of TiO2 by implantation of transition metal elements or nonmetal elements such as N, S, and C, 2) modifying electron-transfer processes during PCO by adsorbing sensitizing dyes, and 3) employing light-induced interfacial electron transfer in the heteronanojunction systems consisting of narrow band gap semiconductors represented by metal sulfides and TiO2. There are diverse technical approaches to implement each of these strategies. This paper presents a review of these approaches and results of the photocatalytic activity and photonic efficiency of the end .products under visible light. Although resulting visible-light-active (VLA) photocatalysts show promise, there is often no comparison with unmodified TiO2 under UV. In a limited number of studies where such comparison was provided, the UV-induced catalytic activity of bare TiO2 is much greater than the visible-light-induced catalytic activity of the VLA catalyst. Furthermore, VLA-catalysts have much lower quantum efficiency compared to the approx.50% quantum efficiency of UV-catalysts. This stresses the need for continuing research in this area.

Levine, Lanfang H.↗

NASA NTRS1997

Redox chemistry at liquid/liquid interfaces

The interface between two immiscible liquids with immobilized photosynthetic pigments can serve as the simplest model of a biological membrane convenient for the investigation of photoprocesses accompanied by spatial separation of charges. As it follows from thermodynamics, if the resolvation energies of substrates and products are very different, the interface between two immiscible liquids may act as a catalyst. Theoretical aspects of charge transfer reactions at oil/water interfaces are discussed. Conditions under which the free energy of activation of the interfacial reaction of electron transfer decreases are established. The activation energy of electron transfer depends on the charges of the reactants and dielectric permittivity of the non-aqueous phase. This can be useful when choosing a pair of immiscible solvents to decrease the activation energy of the reaction in question or to inhibit an undesired process. Experimental interfacial catalytic systems are discussed. Amphiphilic molecules such as chlorophyll or porphyrins were studied as catalysts of electron transfer reactions at the oil/water interface.

Non-NASA Center↗

NASA NTRS2005

Pd/CeO2/SiC Chemical Sensors

The incorporation of nanostructured interfacial layers of CeO2 has been proposed to enhance the performances of Pd/SiC Schottky diodes used to sense hydrogen and hydrocarbons at high temperatures. If successful, this development could prove beneficial in numerous applications in which there are requirements to sense hydrogen and hydrocarbons at high temperatures: examples include monitoring of exhaust gases from engines and detecting fires. Sensitivity and thermal stability are major considerations affecting the development of high-temperature chemical sensors. In the case of a metal/SiC Schottky diode for a number of metals, the SiC becomes more chemically active in the presence of the thin metal film on the SiC surface at high temperature. This increase in chemical reactivity causes changes in chemical composition and structure of the metal/SiC interface. The practical effect of the changes is to alter the electronic and other properties of the device in such a manner as to degrade its performance as a chemical sensor. To delay or prevent these changes, it is necessary to limit operation to a temperature <450 C for these sensor structures. The present proposal to incorporate interfacial CeO2 films is based partly on the observation that nanostructured materials in general have potentially useful electrical properties, including an ability to enhance the transfer of electrons. In particular, nanostructured CeO2, that is CeO2 with nanosized grains, has shown promise for incorporation into hightemperature electronic devices. Nanostructured CeO2 films can be formed on SiC and have been shown to exhibit high thermal stability on SiC, characterized by the ability to withstand temperatures somewhat greater than 700 C for limited times. The exchanges of oxygen between CeO2 and SiC prevent the formation of carbon and other chemical species that are unfavorable for operation of a SiC-based Schottky diode as a chemical sensor. Consequently, it is anticipated that in a Pd/CeO2/SiC Schottky diode, the nanostructured interfacial CeO2 layer would contribute to thermal stability and, by contributing to transfer of electrons, would also contribute to sensitivity.

Lu, Weijie↗

NASA NTRS2017

Direct Measurements of the Mechanical Strength of Carbon Nanotube - Aluminum Interfaces

Interfacial load transfer plays a critical role in the bulk mechanical performance of nanofiber-reinforced metallic-matrix nanocomposites (MMNC). In this paper, we investigate the mechanical strength of interfaces in double-walled carbon nanotube (CNT)-reinforced aluminum (Al) nanocomposites by using in situ electron microscopy nanomechanical single-tube pull-out techniques. The nanomechanical measurements reveal the shear lag effect on the CNT-Al interface that is found to possess an average interfacial shear strength (IFSS) of about 28.7 MPa. The study also shows that thermal annealing results in substantially higher binding strength interfaces between CNTs and Al matrices. The average IFSS of CNT-Al interfaces that were thermally annealed at 400 °C is found to reach about 35.3 MPa, a 23% increase from that of the non-annealed interfaces. The maximum load bearing capacity of the annealed interfaces reaches about 304 nN, a 40.1% increase from that of the non-annealed ones (about 217 nN). The findings are useful to better understand the load transfer mechanism in CNT-reinforced MMNC and the tuning and optimization of the reinforcing performance through thermal processing.

Interfacial strength↗

NASA NTRS2004

Boiling Heat Transfer Mechanisms in Earth and Low Gravity: Boundary Condition and Heater Aspect Ratio Effects

Boiling is a complex phenomenon where hydrodynamics, heat transfer, mass transfer, and interfacial phenomena are tightly interwoven. An understanding of boiling and critical heat flux in microgravity environments is of importance to space based hardware and processes such as heat exchange, cryogenic fuel storage and transportation, electronic cooling, and material processing due to the large amounts of heat that can be removed with relatively little increase in temperature. Although research in this area has been performed in the past four decades, the mechanisms by which heat is removed from surfaces in microgravity are still unclear. Recently, time and space resolved heat transfer data were obtained in both earth and low gravity environments using an array of microheaters varying in size between 100 microns to 700 microns. These heaters were operated in both constant temperature as well as constant heat flux mode. Heat transfer under nucleating bubbles in earth gravity were directly measured using a microheater array with 100 m resolution operated in constant temperature mode with low and high subcooled bulk liquid along with images from below and from the side. The individual bubble departure diameter and energy transfer were larger with low subcooling but the departure frequency increased at high subcooling, resulting in higher overall heat transfer. The bubble growth for both subcoolings was primarily due to energy transfer from the superheated liquid layer relatively little was due to wall heat transfer during the bubble growth process. Oscillating bubbles and sliding bubbles were also observed in highly subcooled boiling. Transient conduction and/or microconvection was the dominant heat transfer mechanism in the above cases. A transient conduction model was developed and compared with the experimental data with good agreement. Data was also obtained with the heater array operated in a constant heat flux mode and measuring the temperature distribution across the array during boiling. The instantaneous heat transfer into the substrate was numerically determined and subtracted from the supplied heat to obtain the wall to liquid heat flux.

Kim, Jungho↗

NASA NTRS2002

Length Scale and Gravity Effects on Microgravity Boiling Heat Transfer

Boiling is a complex phenomenon where hydrodynamics, heat transfer, mass transfer, and interfacial phenomena are tightly interwoven. An understanding of boiling and critical heat flux in microgravity environments is of importance to space based hardware and processes such as heat exchange, cryogenic fuel storage and transportation, electronic cooling, and material processing due to the large amounts of heat that can be removed with relatively little increase in temperature. Although research in this area has been performed in the past four decades, the mechanisms by which heat is removed from surfaces in microgravity are still unclear. In earth gravity, buoyancy is an important parameter that affects boiling heat transfer through the rate at which bubbles are removed from the surface. A simple model describing the bubble departure size based on a quasistatic force balance between buoyancy and surface tension is given by the Fritz [I] relation: Bo(exp 1/2) = 0.0208 theta where Bo is the ratio between buoyancy and surface tension forces. For small, rapidly growing bubbles, inertia associated with the induced liquid motion can also cause bubble departure. In microgravity, the magnitude of effects related to natural convection and buoyancy are small and physical mechanisms normally masked by natural convection in earth gravity such as Marangoni convection can substantially influence the boiling and vapor bubble dynamics. CHF (critical heat transfer) is also substantially affected by microgravity. In 1 g environments, Bo has been used as a correlating parameter for CHF. Zuber's CHF model for an infinite horizontal surface assumes that vapor columns formed by the merger of bubbles become unstable due to a Helmholtz instability blocking the supply of liquid to the surface. The jets are spaced lambda(sub D) apart, where lambda(sub D) = 2pi square root of 3[(sigma)/(g(rho(sub l) - rho(sub v)](exp 1/2) = 2pi square root of 3 L Bo(exp -1/2) = square root of 3 lambda(sub c) and is the wavelength that amplifies most rapidly. The critical wavelength, lambda(sub c), is the wavelength below which a vapor layer underneath a liquid layer is stable. For heaters with Bo smaller than about 3 (heaters smaller than lambda(sub D)), the above model is not applicable, and surface tension effects dominate. Bubble coalescence is thought to be the mechanism for CHF under these conditions. Small Bo can result by decreasing the size of a heater in earth gravity, or by operating a large heater in a lower gravity environment. In the microgravity of space, even large heaters can have low Bo, and models based on Helmholtz instability should not be applicable. The macrolayer model of Haramura and Katto is dimensionally equivalent to Zuber's model and has the same dependence on gravity, so it should not be applicable as well. The goal of this work is to determine how boiling heat transfer mechanisms in a low-g environment are altered from those at higher gravity levels. Boiling data using a microheater array was obtained under gravity environments ranging from 1.8 g to 0.02 g with heater sizes ranging from 2.7 mm to 1 mm. The boiling behavior for 2.7 mm at 0.02 g looked quite similar to boiling on the 1 mm heater at 1 g-the formation of a large primary bubble surrounded by smaller satellite bubbles was observed under both conditions. The similarity suggests that for heaters smaller than some fraction of I(sub c), coalescence and surface tension dominate boiling heat transfer. It also suggests that microgravity boiling can be studied by studying boiling on very small heaters.

Kim, Jungho↗

NASA NTRS1984

Tribological applications of surface analysis

For some years, surface analysis was used in fundamental studies of solid-solid contacts existing in tribological systems. Analysis was used to detect material transfer in sliding contacts. The effects of surface films on the adhesion of contacts was monitored. Finally electron spectroscopic analysis of interfaces has shed some light on the fundamental electronic nature of the interfacial bond. More recently, surface analysis was applied to many tribological engineering problems. In particular, identification of chemical films formed during the sliding contact of lubricated systems and study of the surface chemistry of lubricant additives were active areas of research. One or more of four properties of the analytical technique will be important in determining its utility. The four are: lateral resolution, specimen damage, depth resolution and the availability of chemical information. In each of the applications discussed here, the important factors are brought out.

Wheeler, D. R.↗

NASA NTRS1976

The metal to metal interface and its effect on adhesion and friction

The paper considers the interface between two bulk metals and the effect of this interface on adhesive bonding, resistance to tangential displacements, friction and the interfacial transport from one surface to another. Using Auger emission spectroscopy, field ion microscopy, and low energy electron diffraction techniques, the influence of surface orientation, lattice registry, crystal lattice structure and defects, metal surface chemistry and alloying on the characteristics of the interface was studied for noble, platinum, transition, and Group 4B metals. With dissimilar metals in contact, epitaxial transfer of the cohesively weaker to the cohesively stronger metal has been observed. Surface chemical activity of the noble and platinum metals is shown to affect interfacial behavior as does a valence bonding in the transition metals, and the degree of metallic nature in the Group 4B elements. Alloying elements, e.g., Si and Fe, can alter interfacial behavior by segregation to the surface of metals or by altering bulk properties such as crystal transformation kinetics.

Buckley, D. H.↗

NASA NTRS1975

Wear and interfacial transport of material

Bonding across the interface for two solids in contact and the subsequent transfer of material from one surface to another is a direct result of the interfacial bonds being stronger than the cohesive bonds in either of the two solids. Surface tools such as LEED, Auger emission spectroscopy, field ion microscopy, and the atom probe are used to examine adhesive contacts and to determine the direction, nature, quantity of material transfer and properties of the solids which effect transfer and wear. The electronic nature, cohesive binding energies, surface structure, lattice disregistry and distribution of species in surface layers are all found to effect adhesion and transfer or transport for clean surfaces in solid state contact. The influence of adsorbed and reacted surface films from fractions of a monolayer to multilayer reactive films are considered. It is shown that even fractions of a monolayer of surface active species such as oxygen and sulfur can markedly inhibit adhesion and transport.

Buckley, D. H.↗

NASA NTRS1978

Adhesion of a bimetallic interface

The Hohenberg-Kohn and Kohn-Sham formalisms are used to examine binding (binding energy as a function of separation) for combinations of the simple metals Al(111), Zn(0001), Mg(0001), and Na(110) in contact. Similar metal contacts between Al, Zn, Mg, and Na are examined self-consistently in an ab initio calculation using the Kohn-Sham formalism. Crystallinity is included using the Aschroft pseudopotential via first order perturbation theory for the electron-ion interaction; and the ion-ion interaction is included exactly via a lattice sum. Binding energy was determined both in the local-density approximation and including gradient corrections to the exchange and correlation energy. Binding was found in all cases. In dissimilar metal contacts, interfacial bonding was greater than that in the weaker material predicting the possibility of metallic transfer. The nonzero position of the energy minimum in like metal contacts is explained in terms of consistency between the Ashcroft pseudopotential and the bulk charge density. Good agreement with experimental surface energies is obtained in the self-consistent calculation when nonlocal terms are included.

Ferrante, J.↗

NASA NTRSDate not supplied

Quantum Mechanical Simulations of Dynamics of Electronic Excitations in Low-Dimensional Photovoltaics Materials

Dynamics of electronically excited states including exciton generation and relaxation, exciton-exciton interaction, and charge/energy transfer and transport, are critical to understanding and optimizing photovoltaic materials. Although considerable progress has been made, accurate experimental characterization of such crucial dynamics remains extremely challenging, especially in low-dimensional materials. In this talk, I will discuss how the advancement of quantum mechanical simulations of the dynamics of electronic excitations can reveal the physical mechanisms hindering or improving solar energy harvest. Specifically, we find that surface dangling-bond defects on silicon quantum dots cause rapid charge recombination and low carrier mobility in the inorganic-organic PV cells. Although small quantum dots are essentially free of defects, their optical gaps are too large. To solve this issue, a full-spectrum-light-absorption scheme is computationally designed, taking advantage of complexity and flexibility of low-dimensional materials consisting of different characteristics and dimensions. In this scheme the multifunctional ligands are used to (1) passivate against oxidation, (2) facilitate interfacial charge transfer, and (3) improve both charge transport and optical absorption. A joint theoretical and experimental study has demonstrated the feasibility of this approach. Finally, I will briefly talk about how this scheme and the well-tested quantum mechanical simulations can be employed to help improve energy-conversion efficiency in perovskite photovoltaics including perovskite-based tandem cells.

Zhigang Wu↗

NASA NTRS1982

Surface chemistry, friction and wear of Ni-Zn and Mn-Zn ferrites in contact with metals

X-ray photoelectron and Auger electron spectroscopy analysis were used in sliding friction experiments. These experiments were conducted with hot-pressed polycrystalline Ni-Zn and Mn-Zn ferrites, and single-crystal Mn-Zn ferrite in contact with various transition metals at room temperature in both vacuum and argon. The results indicate that Ni2O3 and Fe3O4 were present on the Ni-Zn ferrite surface in addition to the nominal bulk constituents, while MnO2 and Fe3O4 were present on the Mn-Zn ferrite surface in addition to the nominal bulk constituents. The coefficients of friction for the ferrites in contact with metals were related to the relative chemical activity of these metals. The more active the metal, the higher is the coefficient of friction. The coefficients of friction for the ferrites were correlated with the free energy of formation of the lowest metal oxide. The interfacial bond can be regarded as a chemical bond between the metal atoms and the oxygen anions in the ferrite surfaces. The adsorption of oxygen on clean metal and ferrite does strengthen the metal-ferrite contact and increase the friction. The ferrites exhibit local cracking and fracture with sliding under adhesive conditions. All the metals transferred to he surfaces of the ferrites in sliding.

Miyoshi, K.↗

NASA NTRS1983

Surface chemistry, friction, and wear of Ni-Zn and Mn-Zn ferrites in contact with metals

X-ray photoelectron and Auger electron spectroscopy analysis were used in sliding friction experiments. These experiments were conducted with hot-pressed polycrystalline Ni-Zn and Mn-Zn ferrites, and single-crystal Mn-Zn ferrite in contact with various transition metals at room temperature in both vacuum and argon. The results indicate that Ni2O3 and Fe3O4 were present on the Ni-Zn ferrite surface in addition to the nominal bulk constituents, while MnO2 and Fe3O4 were present on the Mn-Zn ferrite surface in addition to the nominal bulk constituents. The coefficients of friction for the ferrites in contact with metals were related to the relative chemical activity of these metals. The more active the metal, the higher is the coefficient of friction. The coefficients of friction for the ferrites were correlated with the free energy of formation of the lowest metal oxide. The interfacial bond can be regarded as a chemical bond between the metal atoms and the oxygen anions in the ferrite surfaces. The adsorption of oxygen on clean metal and ferrite does strengthen the metal-ferrite contact and increase the friction. The ferrites exhibit local cracking and fracture with sliding under adhesive conditions. All the metals transferred to the surfaces of the ferrites in sliding. Previously announced in STAR as N83-19901

Miyoshi, K.↗

NASA NTRS2018

Challenges and Opportunities in Gen3 Embedded Cooling with High-Quality Microgap Flow

Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.

microchannel↗